CN110320748A - 固化性树脂组合物、干膜、固化物和印刷电路板 - Google Patents
固化性树脂组合物、干膜、固化物和印刷电路板 Download PDFInfo
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- CN110320748A CN110320748A CN201910244783.0A CN201910244783A CN110320748A CN 110320748 A CN110320748 A CN 110320748A CN 201910244783 A CN201910244783 A CN 201910244783A CN 110320748 A CN110320748 A CN 110320748A
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- 229910000859 α-Fe Inorganic materials 0.000 description 1
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Abstract
提供固化性树脂组合物、干膜、固化物和印刷电路板,具体来说,提供:维持优异的显影性、分辨率等原有的特性、且在不产生指触干燥性(不粘手性)的恶化等问题的情况下固化后化学镀锡耐性优异、而且对各种基材的密合性、耐焊接热性能、耐湿性、耐化学药品性、电绝缘性等各特性也优异的能形成固化覆膜的图案的固化性树脂组合物。一种固化性树脂组合物,其特征在于,包含:(A)含羧基的树脂、(B)光聚合引发剂、(C)热固化性化合物、(D)光聚合性单体、和(E)同时具有芳香族结构和聚醚结构的聚酯。
Description
技术领域
本发明涉及适于印刷电路板的阻焊层等覆膜形成的固化性树脂组合物、干膜和其固化物,更详细而言,涉及:干燥覆膜的指触干燥性(不粘手性)、分辨率、化学镀锡耐性和耐焊接热性能优异的能形成固化覆膜的图案的固化性树脂组合物、干膜和其固化物。本发明还涉及:由上述组合物的固化物形成阻焊层等永久覆膜而成的印刷电路板。
背景技术
以往,作为通过曝光、显影形成印刷电路板中的阻焊层等永久覆膜图案的材料,广泛使用有能通过碱水溶液显影的固化性树脂组合物。例如列举了一种固化性树脂组合物,其包含:在酚醛清漆型环氧树脂与不饱和单羧酸的反应产物上加成多元酸酐而得到的含羧基的树脂;光聚合引发剂;稀释剂;和,环氧树脂(参照专利文献1)。
根据这样的固化性树脂组合物,显影性、分辨率优异,且图案形成后进行热固化,从而通过残留于涂膜内的羧基与环氧基的加成反应形成三维网状结构,可以得到密合性、硬度、耐热性、化学镀金耐性、电绝缘性等优异的固化覆膜。
另一方面,印刷电路板的制造工序中,通常在形成阻焊层等固化覆膜后,作为导体的表面保护、接合加工的前处理,对导体焊盘等连接端子实施镀覆。
作为这样的镀覆,由于无需通电、镀铅,因此,采用了化学镀金,但最近,与化学镀金相比,在成本面、药品的安全性等方面,逐渐使用有化学镀锡。
该化学镀锡为浸镀,边使作为导体层的铜表面溶解边析出锡,因此,存在如下问题:在由专利文献1中记载的固化性树脂组合物形成的阻焊层等永久覆膜的图案开口部中,化学镀锡的化学溶液从阻焊层与铜的界面侵入,阻焊层产生剥离。
针对于此,要求开发出化学镀锡耐性优异的固化性树脂组合物,但注意到如果想要提高化学镀锡耐性,则存在如下新的问题:经干燥的覆膜表面的指触干燥性(不粘手性)恶化,使负型薄膜接触并曝光时,在经干燥的覆膜表面产生负型薄膜的接触痕迹。
专利文献1:日本特公平1-54390号公报
发明内容
发明要解决的问题
因此,本发明的目的在于,提供:维持优异的显影性、分辨率等原有的特性、在不产生指触干燥性(不粘手性)的恶化等问题的情况下固化后化学镀锡耐性优异、而且对各种基材的密合性、耐焊接热性能、耐湿性、耐化学药品性、电绝缘性等各特性也优异的能形成固化覆膜的图案的固化性树脂组合物。
用于解决问题的方案
本发明人等面对实现上述目的进行了深入研究,结果发现:同时具有芳香族结构和聚醚结构的聚酯可以在不降低固化性树脂组合物的显影性、耐热性的情况下提高与基底的铜的密合性,至此完成了本发明。
即,本发明的固化性树脂组合物的特征在于,包含:(A)含羧基的树脂、(B)光聚合引发剂、(C)热固化性化合物、(D)光聚合性单体、和(E)同时具有芳香族结构和聚醚结构的聚酯。
本发明的固化性树脂组合物中,优选前述(E)同时具有芳香族结构和聚醚结构的聚酯为使双酚的环氧烷加成物与多元羧酸进行反应而得到的聚酯。
认为,其利用双酚等的芳香族结构来提高热稳定性,设为环氧烷加成物,从而利用所导入的聚醚结构赋予柔软性,设为与多元羧酸反应而得到的聚酯,从而能调整成作为组合物的最佳的溶解性,提高耐焊接热性能和化学镀锡耐性。
本发明的干膜的特征在于,其是将前述固化性树脂组合物涂布于薄膜并干燥而得到的。
本发明的固化物的特征在于,其是对前述固化性树脂组合物、或构成前述干膜的固化性树脂组合物进行光固化和热固化中的至少任一者而得到的。
本发明的印刷电路板的特征在于,具有前述固化物。
发明的效果
根据本发明,可以提供:维持分辨率、经干燥的覆膜的不粘手性、且比现有技术进一步提高了化学镀锡耐性和耐焊接热性能的、固化性树脂组合物。
具体实施方式
以下,对本发明的固化性树脂组合物具体进行说明,但本发明不受这些的任何限定。
需要说明的是,说明的化合物中存在异构体的情况下,只要没有特别说明,就在本发明中可以使用能存在的全部异构体。
<固化性树脂组合物的组成>
本发明的固化性树脂组合物有如下特征:其包含(A)含羧基的树脂、(B)光聚合引发剂、(C)热固化性化合物、(D)光聚合性单体、(E)同时具有芳香族结构和聚醚结构的聚酯。需要说明的是,本发明的固化性树脂组合物在不妨碍本发明的效果的范围内可以包含无机填充材料等其他任意成分。
[(A)含羧基的树脂]
作为含羧基的树脂,只要分子中具有羧基就可以使用公知的物质。另外,含羧基的树脂可以单独使用1种,也可以组合2种以上使用。
作为含羧基的树脂,从光固化性、耐显影性的方面出发,优选分子中具有烯属不饱和双键的含羧基的感光性树脂。烯属不饱和双键优选源自丙烯酸或甲基丙烯酸或它们的衍生物。通过使用具有烯属不饱和双键的含羧基的树脂,从而使组合物容易成为光固化性。
作为含羧基的树脂的具体例,可以举出以下的化合物(低聚物和聚合物均可)。
(I)通过(甲基)丙烯酸等不饱和羧酸、与苯乙烯、α-甲基苯乙烯、(甲基)丙烯酸低级烷基酯、异丁烯等含不饱和基团的化合物的共聚而得到的含羧基的树脂。
(II)通过脂肪族二异氰酸酯、支链脂肪族二异氰酸酯、脂环式二异氰酸酯、芳香族二异氰酸酯等二异氰酸酯、与二羟甲基丙酸、二羟甲基丁酸等含羧基的二醇化合物、与聚碳酸酯系多元醇、聚醚系多元醇、聚酯系多元醇、聚烯烃系多元醇、丙烯酸类多元醇、双酚A系环氧烷加成物二元醇、具有酚性羟基和醇性羟基的化合物等二元醇化合物的加聚反应而得到的含羧基的聚氨酯树脂。
(III)通过二异氰酸酯、与双酚A型环氧树脂、氢化双酚A型环氧树脂、双酚F型环氧树脂、双酚S型环氧树脂、联二甲苯酚型环氧树脂、联苯酚型环氧树脂等2官能环氧树脂的(甲基)丙烯酸酯或其部分酸酐改性物、含羧基的二醇化合物和二元醇化合物的加聚反应而得到的含羧基的感光性聚氨酯树脂。
(IV)在前述(II)或(III)的树脂的合成中,加入(甲基)丙烯酸羟基烷基酯等分子内具有1个羟基和1个以上(甲基)丙烯酰基的化合物,经末端(甲基)丙烯酰化的含羧基的感光性聚氨酯树脂。
(V)在前述(II)或(III)的树脂的合成中,加入异佛尔酮二异氰酸酯与季戊四醇三丙烯酸酯的等摩尔反应物等分子内具有1个异氰酸酯基和1个以上(甲基)丙烯酰基的化合物,经末端(甲基)丙烯酰化的含羧基的感光性聚氨酯树脂。
(VI)使2官能或其以上的多官能(固体)环氧树脂与(甲基)丙烯酸反应,在存在于侧链的羟基上加成二元酸酐而得到的含羧基的感光性树脂。
(VII)使2官能(固体)环氧树脂的羟基进而用环氧氯丙烷环氧化而得到多官能环氧树脂,使得到的多官能环氧树脂与(甲基)丙烯酸反应,在生成的羟基上加成二元酸酐而得到的含羧基的感光性树脂。
(VIII)使2官能氧杂环丁烷树脂与己二酸、邻苯二甲酸、六氢邻苯二甲酸等二羧酸反应,在生成的伯羟基上加成邻苯二甲酸酐、四氢邻苯二甲酸酐、六氢邻苯二甲酸酐等二元酸酐而得到的含羧基的聚酯树脂。
(IX)使1分子中具有多个环氧基的环氧化合物与对羟基苯乙醇等1分子中具有至少1个醇性羟基和1个酚性羟基的化合物、和(甲基)丙烯酸等含不饱和基团的单羧酸反应,得到反应产物,使所得反应产物的醇性羟基与马来酸酐、四氢邻苯二甲酸酐、偏苯三酸酐、均苯四酸酐、己二酸等的多元酸酐反应而得到的含羧基的树脂。
(X)使1分子中具有多个酚性羟基的化合物与环氧乙烷、环氧丙烷等环氧烷反应而得到反应产物,使所得反应产物与含不饱和基团的单羧酸反应,使所得反应产物与多元酸酐反应而得到的含羧基的感光性树脂。
(XI)使1分子中具有多个酚性羟基的化合物与碳酸亚乙酯、碳酸亚丙酯等环状碳酸酯化合物反应而得到反应产物,使所得反应产物与含不饱和基团的单羧酸反应,使所得反应产物与多元酸酐反应而得到的含羧基的感光性树脂。
(XII)在前述(I)~(XI)的树脂上进而加成1分子内具有1个环氧基和1个以上(甲基)丙烯酰基的化合物而成的含羧基的感光性树脂。
含羧基的树脂的酸值适当的是30~150mgKOH/g的范围,更优选50~120mgKOH/g的范围。通过使含羧基的树脂的酸值为30mgKOH/g以上,从而碱显影变得容易。另外,通过设为150mgKOH/g以下,从而防止显影液所导致的曝光部的溶解,且将未曝光部溶解剥离,描绘正常的抗蚀图案变容易。
含羧基的树脂的重均分子量(以下,有时简记作Mw)根据树脂骨架而不同,一般而言,优选处于2000~150000的范围、进而处于3000~100000的范围。重均分子量如果为2000以上,则曝光后的树脂层的耐湿性良好,显影时不易产生膜损耗,分辨率变得良好。另外,重均分子量如果为150000以下,则耐显影性和贮藏稳定性变得良好。重均分子量可以通过凝胶渗透色谱法而测定。
含羧基的树脂可以不限定于前述列举地使用。其中,如前述含羧基的树脂(X)、(XI)那样,使用酚化合物作为起始原料而合成的含羧基的树脂的HAST耐性(超加速寿命试验)、PCT耐性(饱和蒸气加压试验)优异,故可以优选使用。
含羧基的树脂的配混量以树脂组合物总量基准计、优选5~60质量%、更优选10~60质量%、进而优选15~60质量%、特别优选20~50质量%。如果为该范围,则涂膜强度良好,组合物的粘性适度,可以提高涂布性等。
[(B)光聚合引发剂]
作为光聚合引发剂,可以使用公知的物质。另外,光聚合引发剂可以单独使用1种,也可以组合2种以上使用。
作为光聚合引发剂,例如可以举出:双-(2,6-二氯苯甲酰基)苯基氧化膦、双-(2,6-二氯苯甲酰基)-2,5-二甲基苯基氧化膦、双-(2,6-二氯苯甲酰基)-4-丙基苯基氧化膦、双-(2,6-二氯苯甲酰基)-1-萘基氧化膦、双-(2,6-二甲氧基苯甲酰基)苯基氧化膦、双-(2,6-二甲氧基苯甲酰基)-2,4,4-三甲基戊基氧化膦、双-(2,6-二甲氧基苯甲酰基)-2,5-二甲基苯基氧化膦、双-(2,4,6-三甲基苯甲酰基)-苯基氧化膦等二酰基氧化膦类;2,6-二甲氧基苯甲酰基二苯基氧化膦、2,6-二氯苯甲酰基二苯基氧化膦、2,4,6-三甲基苯甲酰基苯基膦酸甲酯、2-甲基苯甲酰基二苯基氧化膦、新戊酰基苯基膦酸异丙酯、2,4,6-三甲基苯甲酰基二苯基氧化膦等单酰基氧化膦类;苯基(2,4,6-三甲基苯甲酰基)次膦酸乙酯、1-羟基-环己基苯基酮、1-[4-(2-羟基乙氧基)-苯基]-2-羟基-2-甲基-1-丙烷-1-酮、2-羟基-1-{4-[4-(2-羟基-2-甲基-丙酰基)-苄基]苯基}-2-甲基-丙烷-1-酮、2-羟基-2-甲基-1-苯基丙烷-1-酮等羟基苯乙酮类;苯偶姻、联苯酰等苯偶姻类;苯偶姻甲醚、苯偶姻乙醚、苯偶姻正丙醚、苯偶姻异丙醚、苯偶姻正丁醚等苯偶姻烷基醚类;二苯甲酮、对甲基二苯甲酮、米蚩酮、甲基二苯甲酮、4,4’-二氯二苯甲酮、4,4’-双二乙基氨基二苯甲酮等二苯甲酮类;苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、2,2-二乙氧基-2-苯基苯乙酮、1,1-二氯苯乙酮、1-羟基环己基苯基酮、2-甲基-1-[4-(甲硫基)苯基]-2-吗啉基-1-丙酮、2-苄基-2-二甲基氨基-1-(4-吗啉基苯基)-1-丁酮、2-(二甲基氨基)-2-[(4-甲基苯基)甲基)-1-[4-(4-吗啉基)苯基]-1-丁酮、N,N-二甲基氨基苯乙酮等苯乙酮类;噻吨酮、2-乙基噻吨酮、2-异丙基噻吨酮、2,4-二甲基噻吨酮、2,4-二乙基噻吨酮、2-氯噻吨酮、2,4-二异丙基噻吨酮等噻吨酮类;蒽醌、氯蒽醌、2-甲基蒽醌、2-乙基蒽醌、2-叔丁基蒽醌、1-氯蒽醌、2-戊基蒽醌、2-氨基蒽醌等蒽醌类;苯乙酮二甲基缩酮、苯偶酰二甲基缩酮等缩酮类;乙基-4-二甲基氨基苯甲酸酯、2-(二甲基氨基)乙基苯甲酸酯、对二甲基苯甲酸乙酯等苯甲酸酯类;{1-[4-(苯硫基)-2-(O-苯甲酰肟)]}1,2-辛二酮、1-[9-乙基-6-(2-甲基苯甲酰基)-9H-咔唑-3-基]-1-(O-乙酰肟)乙酮等肟酯类;双(η5-2,4-环戊二烯-1-基)-双(2,6-二氟-3-(1H-吡咯-1-基)苯基)钛、双(环戊二烯基)-双[2,6-二氟-3-(2-(1-吡咯-1-基)乙基)苯基]钛等二茂钛类;苯基二硫醚2-硝基芴、丁偶姻、茴香偶姻乙醚、偶氮双异丁腈、四甲基秋兰姆二硫醚等。
光聚合引发剂的含量以不挥发成分换算计、相对于含羧基的树脂100质量份,优选0.1~30质量份。0.1质量份以上的情况下,树脂组合物的光固化性变得良好,覆膜不易剥离,耐化学药品性等覆膜特性也变得良好。另外,30质量份以下的情况下,可以得到脱气的降低效果,进而覆膜的透光性变得良好,深部固化性不易降低。更优选0.5~20质量份。
[(C)热固化性化合物]
作为热固化性化合物,可以使用公知的物质。另外,热固化性化合物可以单独使用1种或组合2种以上使用。
作为热固化性化合物,例如可以举出三聚氰胺树脂、苯并胍胺树脂、三聚氰胺衍生物、苯并胍胺衍生物等氨基树脂、异氰酸酯化合物、封端异氰酸酯化合物、环碳酸酯化合物、环氧化合物、氧杂环丁烷化合物、环硫化物树脂、双马来酰亚胺、碳二亚胺树脂等。
作为环氧化合物,可以举出环氧化植物油;双酚A型环氧树脂;对苯二酚型环氧树脂;双酚型环氧树脂;硫醚型环氧树脂;溴化环氧树脂;苯酚酚醛清漆型环氧树脂;甲酚酚醛清漆型环氧树脂;联苯酚酚醛清漆型环氧树脂;双酚F型环氧树脂;氢化双酚A型环氧树脂;缩水甘油胺型环氧树脂;乙内酰脲型环氧树脂;脂环式环氧树脂;三羟苯基甲烷型环氧树脂;联二甲苯酚型或联苯酚型环氧树脂或它们的混合物;双酚S型环氧树脂;双酚A酚醛清漆型环氧树脂;四羟苯基乙烷型环氧树脂;杂环式环氧树脂;邻苯二甲酸二缩水甘油酯树脂;四缩水甘油二甲苯酰基乙烷树脂;含萘基的环氧树脂;具有二环戊二烯骨架的环氧树脂;甲基丙烯酸缩水甘油酯共聚系环氧树脂;环己基马来酰亚胺与甲基丙烯酸缩水甘油酯的共聚环氧树脂;环氧改性的聚丁二烯橡胶衍生物;CTBN改性环氧树脂等,但不限于这些。这些环氧树脂可以单独使用1种或组合2种以上使用。
作为氧杂环丁烷化合物,例如除双[(3-甲基-3-氧杂环丁基甲氧基)甲基]醚、双[(3-乙基-3-氧杂环丁基甲氧基)甲基]醚、1,4-双[(3-甲基-3-氧杂环丁基甲氧基)甲基]苯、1,4-双[(3-乙基-3-氧杂环丁基甲氧基)甲基]苯、丙烯酸(3-甲基-3-氧杂环丁基)甲酯、丙烯酸(3-乙基-3-氧杂环丁基)甲酯、甲基丙烯酸(3-甲基-3-氧杂环丁基)甲酯、甲基丙烯酸(3-乙基-3-氧杂环丁基)甲酯、它们的低聚物或共聚物等多官能氧杂环丁烷类之外,还可以举出:氧杂环丁醇与酚醛清漆树脂、聚(对羟基苯乙烯)、Cardo型双酚类、杯芳烃类、间苯二酚杯芳烃类、或倍半硅氧烷等具有羟基的树脂的醚化物等。此外,还可以举出具有氧杂环丁烷环的不饱和单体与(甲基)丙烯酸烷基酯的共聚物等。
作为环硫化物树脂,可以举出双酚A型环硫化物树脂等。另外,也可以利用:使用同样的合成方法,将酚醛清漆型环氧树脂的环氧基的氧原子取代为硫原子而得到的环硫化物树脂等。
作为三聚氰胺衍生物、苯并胍胺衍生物等氨基树脂,可以举出羟甲基三聚氰胺化合物、羟甲基苯并胍胺化合物、羟甲基甘脲化合物和羟甲基尿素化合物等。
作为异氰酸酯化合物,可以配混多异氰酸酯化合物。作为多异氰酸酯化合物,可以举出4,4’-二苯基甲烷二异氰酸酯、2,4-甲苯二异氰酸酯、2,6-甲苯二异氰酸酯、萘-1,5-二异氰酸酯、邻二甲苯二异氰酸酯、间二甲苯二异氰酸酯和2,4-甲苯二异氰酸酯二聚体等芳香族多异氰酸酯;四亚甲基二异氰酸酯、六亚甲基二异氰酸酯、亚甲基二异氰酸酯、三甲基六亚甲基二异氰酸酯、4,4-亚甲基双(环己基异氰酸酯)和异佛尔酮二异氰酸酯等脂肪族多异氰酸酯;双环庚烷三异氰酸酯等脂环式多异氰酸酯;以及上述列举的异氰酸酯化合物的加合物、缩脲体和异氰脲酸酯体等。
作为封端异氰酸酯化合物,可以使用异氰酸酯化合物与异氰酸酯封端剂的加成反应产物。作为能与异氰酸酯封端剂反应的异氰酸酯化合物,例如可以举出上述多异氰酸酯化合物等。作为异氰酸酯封端剂,例如可以举出酚系封端剂;内酰胺系封端剂;活性亚甲基系封端剂;醇系封端剂;肟系封端剂;硫醇系封端剂;酰胺系封端剂;酰亚胺系封端剂;胺系封端剂;咪唑系封端剂;亚胺系封端剂等。
热固化性化合物的含量相对于含羧基的树脂所含有的每1mol羧基,反应的热固化性化合物的官能团数优选0.2~2.0mol、更优选0.5~1.5mol。
[(D)光聚合性单体]
光聚合性单体为具有烯属不饱和双键的化合物,例如通过光照射而烯属不饱和双键彼此发生加成反应从而能进行聚合。通过使用光聚合性单体,从而曝光部对显影液的耐性与未曝光部对显影液的溶解性变大,分辨率提高。
作为这样的光聚合性单体,例如可以举出(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸环己酯等(甲基)丙烯酸烷基酯类;(甲基)丙烯酸2-羟基乙酯、(甲基)丙烯酸2-羟基丙酯等(甲基)丙烯酸羟基烷基酯类;乙二醇、丙二醇、二乙二醇、二丙二醇等环氧烷衍生物的单或二(甲基)丙烯酸酯类;己二醇、三羟甲基丙烷、季戊四醇、二(三羟甲基)丙烷、二季戊四醇、三羟基乙基异氰脲酸酯等多元醇或它们的环氧乙烷或环氧丙烷加成物的多元(甲基)丙烯酸酯类;(甲基)丙烯酸苯氧基乙酯、双酚A的聚乙氧基二(甲基)丙烯酸酯等酚类的环氧乙烷或环氧丙烷加成物的(甲基)丙烯酸酯类;甘油二缩水甘油醚、三羟甲基丙烷三缩水甘油醚、三缩水甘油异氰脲酸酯等等缩水甘油醚的(甲基)丙烯酸酯类;和三聚氰胺(甲基)丙烯酸酯;等。
光聚合性单体可以单独使用1种、或组合2种以上使用。光聚合性单体的含量以不挥发成分换算计、相对于含羧基的树脂100质量份,优选5~40质量份。光聚合性单体的含量处于上述范围的情况下,可以使基于曝光的光固化性良好,曝光后的显影工序中,可以提高图案精度。另外,40质量份以下的情况下,不易产生晕影,可以得到良好的分辨率。
[(E)同时具有芳香族结构和聚醚结构的聚酯]
同时具有芳香族结构和聚醚结构的聚酯为多元羧酸、与具有芳香族结构和聚醚结构的多元醇的缩聚体,可以使用公知的物质。另外,该聚酯可以单独使用1种,也可以组合2种以上使用。
多元羧酸可以使用公知的物质,可以单独使用1种,也可以组合2种以上使用。另外,本发明的多元羧酸可以包含其酐。
作为多元羧酸,例如可以举出丙二酸、琥珀酸、琥珀酸酐、戊二酸、己二酸、壬二酸、癸二酸、邻苯二甲酸、邻苯二甲酸酐、六氢邻苯二甲酸酐、四氢邻苯二甲酸酐、间苯二甲酸、对苯二甲酸、纳迪克酸酐、马来酸、马来酸酐、富马酸、衣康酸、柠康酸、庚二酸、辛二酸、十二烷二酸、偏苯三酸、偏苯三酸酐、均苯四酸和均苯四酸酐等,可以由组合物中聚酯的溶解性而适宜选择。
多元醇只要包含具有芳香族结构和聚醚结构的多元醇就可以使用公知的物质,可以单独使用1种,也可以组合2种以上使用。
具有芳香族结构和聚醚结构的多元醇例如可以举出:1,4-苯二甲醇、1,3-苯二甲醇、1,2-苯二甲醇、4,4’-萘二甲醇、3,4’-萘二甲醇等芳香族多元醇;1,2,3-三羟基苯、2,2-双(4-羟基-3-甲基苯基)丙烷、4,4’-二羟基二苯甲酮、二羟基苯乙酮、1,1-双(4-羟基亚苯基)乙烷、双(4-羟基苯基)甲烷(也称为双酚F)、2,2-双(4-羟基苯基)丙烷(也称为双酚A)、双(4-羟基苯基)砜(也称为双酚S)、双(4-羟基苯基)醚、4,4’-联苯酚、1,1-双(4-羟基苯基)异丁烷、2,2-双(4-羟基-叔丁基苯基)丙烷、2-甲基-1,1-双(4-羟基苯基)丙烷、邻苯二酚、间苯二酚、对苯二酚、酚醛清漆、甲酚、1,1,1-(4-羟基苯基)乙烷等多元酚;双-(2-羟基萘基)甲烷、1,5-二羟基-萘和其他二羟基萘等萘多元醇等、和在它们上加成环氧烷而得到的衍生物等。
其中,多元醇优选在热稳定性优异的1,1-双(4-羟基亚苯基)乙烷等双酚类上加成具有柔软性的环氧烷而得到的多元醇,特别是更优选在2,2-双(4-羟基苯基)丙烷(“双酚A”)上加成环氧烷而得到的多元醇。
另外,为了均衡性良好地体现化学镀锡耐性与耐焊接热性能,多元醇优选在双酚类上加成2~30摩尔的环氧烷而得到的多元醇,更优选加成4~20摩尔的环氧烷而得到的多元醇。通过加成2摩尔以上的环氧烷,从而柔软性、与基底的铜的密合性优异,可以得到充分的化学镀锡耐性,通过设为低于30摩尔,从而可以得到耐焊接热性能、指触干燥性、表面硬度优异的固化性树脂组合物。
进而,环氧烷优选环氧乙烷、环氧丙烷、环氧丁烷。
作为在双酚类上加成环氧烷的方法,例如可以举出如下方法:将双酚类作为引发剂,进行利用公知常用的方法加成环氧烷的反应。而且,反应时,可以使用公知的酯化催化剂。
酯化催化剂例如可以使用钛酸四丁酯、钛酸四丙酯、钛酸四乙酯等有机钛系化合物、辛酸锡、二丁基氧化锡、二丁基锡月桂酸酯、氯化亚锡、溴化亚锡等锡系化合物等。
同时具有芳香族结构和聚醚结构的聚酯的含量以不挥发成分换算计、相对于含羧基的树脂100质量份,优选1~50质量份。同时具有芳香族结构和聚醚结构的聚酯的含量为上述范围的情况下,可以在不使分辨率恶化的情况下得到具有优异的化学镀锡耐性、耐焊接热性能的固化性树脂组合物。
同时具有芳香族结构和聚醚结构的聚酯的数均分子量(以下,有时简记作Mn)优选3000~15000的范围、更优选5000~10000的范围。需要说明的是,数均分子量可以通过凝胶渗透色谱法而测定。
同时具有芳香族结构和聚醚结构的聚酯的羟值优选0.2~100、更优选0.5~80。如此聚酯的Mn、羟值如果为上述范围,则曝光部的耐显影性、未曝光部的显影性提高,可以得到优异的分辨率,也可以得到作为固化物的耐焊接热性能、表面硬度也优异的固化性树脂组合物。
[其他成分]
作为其他成分,可以举出固化性树脂组合物中一般使用的公知的添加剂、例如无机填充材料、有机填充材料、着色剂、有机溶剂、热固化催化剂、光引发助剂、氰酸酯化合物、弹性体、巯基化合物、氨基甲酸酯化催化剂、触变剂、密合促进剂、嵌段共聚物、链转移剂、阻聚剂、铜害防止剂、抗氧化剂、防锈剂、微粉二氧化硅、有机膨润土、蒙脱石等增稠剂、有机硅系、氟系、高分子系等的消泡剂和/或流平剂、咪唑系、噻唑系、三唑系等硅烷偶联剂、次膦酸盐、磷酸酯衍生物、磷腈化合物等磷化合物等阻燃剂等。
作为无机填充材料,可以使用公知的物质,可以单独使用1种,也可以组合2种以上使用。
作为无机填充材料的具体例,可以使用:氧化钛、氢氧化铝、氢氧化镁、碳酸钙、碳酸镁、飞灰、二氧化硅(天然二氧化硅或合成二氧化硅)、高岭土、氧化钙、氧化镁、氧化锌、硫酸钡、氧化铝、滑石、云母、水滑石、勃姆石、氢氧化钙、钙硅石、钛酸钾、钛酸钡、硫酸镁、硫酸钙、海泡石、铜、铁、炭黑、氧化铝、氧化锆、氧化锑、铅白、氢氧化锌、硫化锌、钛酸铅、氮化铝、氮化硅、氮化钛、金刚石粉末、硅酸锆、云母粉、硫酸铅、氟化铈、氧化铈、次膦酸铝盐、硅酸铝、硅酸镁、硅酸钙、粘土、焙烧滑石、磷酸镁、硬硅钙石、氮化硼、硼酸铝、二氧化硅球、玻璃鳞片、玻璃球、无定形二氧化硅、结晶性二氧化硅、熔融二氧化硅、球状二氧化硅、制铁炉渣、氧化铁、铁硅铝、铝镍钴磁铁、各种铁素体等磁性粉、水泥、玻璃粉末、脱水污泥、诺易堡硅土、硅藻土、三氧化锑、硫酸氧镁、水合铝、水合石膏、明矾、次膦酸铝盐等含磷的金属盐等。
从涂覆性、密合性、耐化学药品性的方面出发,无机填充材料优选二氧化硅、硫酸钡或滑石,从热尺寸稳定性的方面出发,更优选二氧化硅。
无机填充材料的平均粒径没有特别限定,只要是能作为无机填充材料使用的粒径即可。优选的平均粒径如下:作为由以通过激光衍射式粒度分布测定装置而测定的体积平均计的粒度分布测定结果求出的平均粒径,为0.1μm~30μm、更优选0.1μm~10μm。
无机填充材料的配混量以不挥发成分换算计、相对于含羧基的树脂100质量份,优选5~350质量份、更优选10~300质量份、进而优选30质量份~250质量份的范围。通过设为该范围,从而可以得到具有优异的耐热性和物理强度的固化物。
作为有机溶剂,可以使用公知的物质。另外,有机溶剂可以单独使用1种,也可以组合2种以上使用。
作为有机溶剂的具体例,可以举出甲乙酮、环己酮等酮类;甲苯、二甲苯、四甲苯等芳香族烃类;溶纤剂、甲基溶纤剂、丁基溶纤剂、卡必醇、甲基卡必醇、丁基卡必醇、丙二醇单甲醚、二丙二醇单甲醚、二丙二醇二乙醚、二乙二醇单甲醚乙酸酯、三丙二醇单甲醚等二醇醚类;乙酸乙酯、乙酸丁酯、乳酸丁酯、溶纤剂乙酸酯、丁基溶纤剂乙酸酯、卡必醇乙酸酯、丁基卡必醇乙酸酯、丙二醇单甲醚乙酸酯、二丙二醇单甲醚乙酸酯、碳酸亚丙酯等酯类;辛烷、癸烷等脂肪族烃类;石油醚、石脑油、溶剂石脑油等石油系溶剂;等。
有机溶剂一般出于制备组合物、形成干膜、涂布于印刷电路基板上时的粘度调整等目的而使用。因此,有机溶剂的含量可以根据目的而适宜变更。
<固化性树脂组合物的使用方法>
接着,作为本发明的固化性树脂组合物的使用方法的一例,对形成干膜的方法、和在印刷电路基板上形成固化性树脂组合物的固化物的方法进行说明。
[干膜的形成方法]
干膜一般通过执行涂布工序和干燥工序而得到。以下对各工序进行说明。
(涂布工序)
对于固化性树脂组合物,根据需要利用有机溶剂进行粘度调整,在支撑薄膜(以下,也称为“载体薄膜”)上以期望的厚度涂布。
作为支撑薄膜,优选使用聚对苯二甲酸乙二醇酯等聚酯薄膜、聚酰亚胺薄膜、聚酰胺酰亚胺薄膜、聚丙烯薄膜、聚苯乙烯薄膜等塑料薄膜。
支撑薄膜的厚度例如可以设为10~150μm的范围。
作为涂布方法,例如可以举出逗点涂布机(comma coater)、刮刀涂布机、唇口涂布机(lip coater)、棒涂机(rod coater)、挤压涂布机(squeeze coater)、逆式涂布机(reverse coater)、传递辊涂布机(transfer roll cater)、凹版涂布机(gravurecoater)、喷涂机等。
涂布膜厚例如可以按照以干燥后的膜厚计成为3~100μm、优选成为5~40μm的范围的方式适宜设定。
(干燥工序)
使涂布于支撑薄膜上的固化性树脂组合物中所含的有机溶剂挥发干燥,形成树脂层(干燥涂膜)。
作为干燥手段,例如可以举出热风循环式干燥炉、IR炉、热板、对流烘箱等。
干燥条件例如可以将干燥温度设为50~130℃、干燥时间设为1~30分钟等。
在形成于支撑薄膜上的树脂层的表面上,出于防止尘埃附着等目的,也可以层叠能剥离的保护薄膜(以下,也称为“覆盖薄膜”)。
作为保护薄膜,将保护薄膜剥离时,只要树脂层与保护薄膜的粘接力小于树脂层与支撑薄膜的粘接力即可。作为保护薄膜,例如可以使用聚乙烯薄膜、聚四氟乙烯薄膜、聚丙烯薄膜、经表面处理的纸等。
[固化物的形成方法]
固化物一般通过执行树脂层形成工序、曝光工序、显影工序和热固化工序而得到。以下对各工序进行说明。
(树脂层形成工序)
对于固化性树脂组合物,根据需要利用有机溶剂进行粘度调整,在印刷电路基板等基材上以期望的厚度涂布。接着,使涂布于基材上的固化性树脂组合物中所含的有机溶剂挥发干燥,在基材上形成树脂层。
作为涂布方法,例如可以举出丝网印刷法、淋幕涂布法、喷涂法、辊涂法等。
涂布膜厚例如可以按照以干燥后的膜厚计成为3~100μm、优选成为5~40μm的范围的方式适宜设定。
作为干燥手段,例如可以举出热风循环式干燥炉、IR炉、热板、对流烘箱等。
干燥条件例如可以将干燥温度设为50~130℃、干燥时间设为1~30分钟等。
在印刷电路基板等基材上形成树脂层的方法也可以为将上述干膜层压至印刷电路基板,将设于干膜的树脂层转印至印刷电路基板的方法。
(曝光工序)
借助形成有规定的曝光图案的光掩模,对树脂层照射活性能量射线,进行对树脂层的选择性的曝光。
作为活性能量射线的照射光源,可以举出低压汞灯、中压汞灯、高压汞灯、超高压汞灯、氙灯和金属卤化物灯等。
此处,曝光方法可以分为在光掩模与树脂层接触的状态下进行曝光的接触曝光法;和,在光掩模与树脂层成为非接触的状态下进行曝光的非接触曝光法。
接触曝光法中,由于光掩模与树脂层接触,因此,分辨率高,另一方面,曝光后去除光掩模时,树脂层会附着于光掩模,污染光掩模、或引起自动曝光机的异常停止等连续的生产率有时变差。非接触曝光法中,由于光掩模与树脂层的距离远离,因此,连续的生产率高,另一方面,分辨率容易变低。
使用本发明的固化性树脂组合物得到的树脂层可以在上述非接触曝光法和接触曝光法中使用,均可。本发明的固化性树脂组合物的指触干燥性优异,因此,可以优选用于接触曝光法。
(显影工序)
曝光工序后,利用碱水溶液进行显影,从而将树脂层的未曝光部去除,进行图案形成。
作为碱水溶液,可以举出氢氧化钾、氢氧化钠、碳酸钠、碳酸钾、磷酸钠、硅酸钠、氨、胺类等碱水溶液等。
(热固化工序)
显影工序后,对于形成有图案的树脂层,进而照射活性能量射线后进行加热固化(例如100~220℃),或加热固化后照射活性能量射线,或仅利用加热固化进行最终加工固化(正式固化),在印刷电路基板等基材上形成具有规定的图案的固化物。
具备如此得到的、本发明的固化性树脂组合物的固化物的印刷电路基板可以用于各种用途,由于采用化学镀锡、耐热性优异,因此,特别优选设为车载用。
实施例
以下,示出实施例和比较例,对本发明具体进行说明,但本发明不限定于下述实施例。需要说明的是,以下中“份”只要没有特别说明就全部为质量基准。
[原料]
含羧基的树脂A和同时具有芳香族结构和聚醚结构的聚酯E-1~E-3利用后述的方法制备,此外,使用市售品。
(A)含羧基的树脂:含羧基的树脂A(不挥发成分65质量%、固体成分酸值85mgKOH/g、重均分子量约3500)
(B-1)光聚合引发剂:IRGACURE 907(BASF株式会社制)
(B-2)光聚合引发剂:Kayacure DETX-S(日本化药株式会社制)
(C)热固化性化合物:N-695(DIC株式会社制甲酚酚醛清漆型环氧)
(D)光聚合性单体:二季戊四醇六丙烯酸酯(DPHA)
(E-1)同时具有芳香族结构和聚醚结构的聚酯:聚酯E-1数均分子量Mn:3000
(E-2)同时具有芳香族结构和聚醚结构的聚酯:聚酯E-2数均分子量Mn:8000
(E-3)同时具有芳香族结构和聚醚结构的聚酯:聚酯E-3数均分子量Mn:15000
无机填充材料(二氧化硅):Admafine SO-E2(Admatechs公司制)
着色剂:酞菁蓝
着色剂:铬酞黄
固化催化剂1:双氰胺(DICY)
固化催化剂2:三聚氰胺
消泡剂:KS-66(信越有机硅株式会社制)
(含羧基的树脂的制备)
合成例<含羧基的树脂A>
将甲酚酚醛清漆型环氧树脂(DIC株式会社制、注册商标“EPICLON”N-695、环氧当量:220)220质量份放入带有搅拌机和回流冷凝器的四口烧瓶中,加入卡必醇乙酸酯214质量份,进行加热溶解。接着,加入作为阻聚剂的对苯二酚0.1质量份、和作为反应催化剂的二甲基苄基胺2.0质量份。将该混合物加热至95~105℃,缓慢滴加丙烯酸72份,反应16小时。将该反应产物冷却至80~90℃,加入四氢邻苯二甲酸酐106质量份,反应8小时,冷却后取出。
如此得到的同时具有烯属不饱和键和羧基的感光性树脂如下:不挥发成分为65质量%、固体物的酸值为85mgKOH/g、重均分子量Mw为约3500。
需要说明的是,所得树脂的重均分子量通过连接有株式会社岛津制作所制泵LC-6AD、和昭和电工株式会社制的三根柱Shodex(注册商标)KF-804、KF-803、KF-802的高效液相色谱而测定。
(同时具有芳香族结构和聚醚结构的聚酯的制备)
合成例1<聚酯E-1(数均分子量:3000)>
在2升的四口烧瓶内,加入双酚A的环氧乙烷6摩尔加成物800质量份、己二酸180质量份、和作为酯化催化剂的四异丙醇钛0.2质量份,以220℃使其反应,从而合成聚酯E-1。
合成例2<聚酯E-2(数均分子量:8000)>
在2升的四口烧瓶内,加入双酚A的环氧乙烷6摩尔加成物800质量份、己二酸200质量份、和作为酯化催化剂的四异丙醇钛0.2质量份,以220℃使其反应,从而合成聚酯E-2。
合成例3<聚酯E-3(数均分子量:15000)>
在2升的四口烧瓶内,加入双酚A的环氧乙烷6摩尔加成物800质量份、己二酸220质量份、和作为酯化催化剂的四异丙醇钛0.2质量份,以220℃使其反应,从而合成聚酯E-3。
(固化性树脂组合物的制备)
以表1所示的组成(质量份),将各成分用搅拌机进行预混合后,用三辊磨进行混炼,制备固化性树脂组合物。
(试验基板的制作)
(1)通过丝网印刷法,使用100目的聚酯丝网,将各实施例和比较例中制备好的固化性树脂组合物以厚度成为20~30μm的方式整面涂布于形成有电路的印刷电路基板上。接着,对涂膜用80℃的热风循环式干燥炉进行30分钟干燥,制作供于指触干燥性的试验的试验基板。
(2)接着,对于上述试验基板,进而使具有30~150μm(每隔10μm)的线图案的光掩模密合在干燥涂膜上,利用紫外线曝光装置(ORC Manufacturing Co.Ltd.制、型号HMW-680GW),照射紫外线(曝光量300mJ/cm2),接着,在1质量%碳酸钠水溶液中,以0.2MPa的加压压力进行显影60秒。之后,在150℃的热风循环式干燥炉中进行60分钟加热固化,自然冷却至室温后,用高压汞灯以1000mJ/cm2进行照射,制作供于分辨率、耐焊接热性能和化学镀锡耐性的试验的试验基板。
使用如此制作好的试验基板,对指触干燥性、分辨率、耐焊接热性能、化学镀锡耐性进行评价。这些评价的试验方法和评价方法如以下所述。将其评价结果一并示于表1。
(1)指触干燥性:
在前述试验基板上,用手指直接接触干燥后的涂膜表面,以以下的基准对指触干燥性进行评价。
◎:完全没有发粘的情况。
○:稍有发粘的情况。
×:有发粘的情况。
(2)分辨率:
用光学显微镜测量前述试验基板的线图案,以以下的基准进行评价。
◎:残留线宽低于50μm。
○:残留线宽低于100μm。
×:残留线宽为100μm以上。
(3)耐焊接热性能:
在前述试验基板上涂布松香系助焊剂,在设定为260℃的焊料槽中浸渍30秒。将该试验基板用有机溶剂清洗后,进行利用玻璃纸胶带的剥离试验,以以下的基准进行评价。
◎:无外观变化。
○:固化涂膜上确认到稍剥离的情况。
△:固化涂膜上确认到剥离的情况。
×:剥离试验前固化涂膜上浮起,确认到焊料浸入(はんだもぐり)的情况。
(4)化学镀锡耐性:
依据后述的工序,对前述试验基板进行化学镀锡,对于该试验基板,进行外观的变化和利用玻璃纸胶带的剥离试验,以以下基准对固化覆膜的剥离状态进行评价。
◎:既无外观变化,也完全没有固化覆膜的剥离。
○:无外观的变化,但固化覆膜上稍有剥离。
×:确认到固化覆膜的浮起、镀层浸入(めっきもぐり),剥离试验中固化覆膜的剥离较大。
化学镀锡工序:
1.脱脂:将试验基板在30℃的酸性脱脂液(株式会社日本MacDermid制、MetexL-5B的20体积%水溶液)中浸渍3分钟。
2.水洗:将试验基板在流水中浸渍3分钟。
3.软蚀刻:在室温下,将试验基板在14.3质量%的过硫酸铵水溶液中浸渍1分钟。
4.水洗:将试验基板在流水中浸渍3分钟。
5.酸浸渍:在室温下,将试验基板在10体积%的硫酸水溶液中浸渍1分钟。
6.水洗:将试验基板在流水中浸渍30秒~1分钟。
7.化学镀锡:将试验基板在70℃、pH=1的镀锡液(Atotech Corporation制、Stanatec H Plus73体积份、SF特殊的酸(Special acid)6体积份、SFTin solution C 5.5体积份、Stanatec SN校正液15.5体积份、Stanatec Additive C0.125体积份溶液)中浸渍12分钟。
8.水洗:将试验基板在流水中浸渍3分钟。
[表1]
由上述表中所示的评价结果明确确认到,各实施例中,可以得到具备指触干燥性和分辨率、且具有优异的耐焊接热性能和化学镀锡耐性的固化性树脂组合物。
Claims (5)
1.一种固化性树脂组合物,其特征在于,包含:(A)含羧基的树脂、(B)光聚合引发剂、(C)热固化性化合物、(D)光聚合性单体、和(E)同时具有芳香族结构和聚醚结构的聚酯。
2.根据权利要求1所述的固化性树脂组合物,其特征在于,所述(E)同时具有芳香族结构和聚醚结构的聚酯为使双酚的环氧烷加成物与多元羧酸进行反应而得到的聚酯。
3.一种干膜,其特征在于,其是将权利要求1或2所述的固化性树脂组合物涂布于薄膜并干燥而得到的。
4.一种固化物,其特征在于,其是对权利要求1或2所述的固化性树脂组合物、或构成权利要求3所述的干膜的固化性树脂组合物进行光固化和热固化中的至少任一者而得到的。
5.一种印刷电路板,其特征在于,具有权利要求4所述的固化物。
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