CN1101552C - 具有可测试部件块的半导体集成电路 - Google Patents

具有可测试部件块的半导体集成电路 Download PDF

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Publication number
CN1101552C
CN1101552C CN95116979A CN95116979A CN1101552C CN 1101552 C CN1101552 C CN 1101552C CN 95116979 A CN95116979 A CN 95116979A CN 95116979 A CN95116979 A CN 95116979A CN 1101552 C CN1101552 C CN 1101552C
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CN
China
Prior art keywords
signal
component block
test
input
output
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN95116979A
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English (en)
Chinese (zh)
Other versions
CN1122918A (zh
Inventor
本原章
竹冈贞已
贵志哲司
中岛雅逸
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Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
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Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN1122918A publication Critical patent/CN1122918A/zh
Application granted granted Critical
Publication of CN1101552C publication Critical patent/CN1101552C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318536—Scan chain arrangements, e.g. connections, test bus, analog signals
    • H10P74/00—

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Test And Diagnosis Of Digital Computers (AREA)
CN95116979A 1994-08-29 1995-08-28 具有可测试部件块的半导体集成电路 Expired - Fee Related CN1101552C (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP20384294 1994-08-29
JP203842/94 1994-08-29
JP203842/1994 1994-08-29
JP250535/1994 1994-10-17
JP25053594 1994-10-17
JP250535/94 1994-10-17

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CNB001085646A Division CN1200282C (zh) 1994-08-29 2000-05-18 具有可测试部件块的半导体集成电路

Publications (2)

Publication Number Publication Date
CN1122918A CN1122918A (zh) 1996-05-22
CN1101552C true CN1101552C (zh) 2003-02-12

Family

ID=26514137

Family Applications (2)

Application Number Title Priority Date Filing Date
CN95116979A Expired - Fee Related CN1101552C (zh) 1994-08-29 1995-08-28 具有可测试部件块的半导体集成电路
CNB001085646A Expired - Fee Related CN1200282C (zh) 1994-08-29 2000-05-18 具有可测试部件块的半导体集成电路

Family Applications After (1)

Application Number Title Priority Date Filing Date
CNB001085646A Expired - Fee Related CN1200282C (zh) 1994-08-29 2000-05-18 具有可测试部件块的半导体集成电路

Country Status (5)

Country Link
EP (1) EP0699920B1 (cg-RX-API-DMAC10.html)
KR (1) KR0181546B1 (cg-RX-API-DMAC10.html)
CN (2) CN1101552C (cg-RX-API-DMAC10.html)
DE (1) DE69526162T2 (cg-RX-API-DMAC10.html)
TW (1) TW307927B (cg-RX-API-DMAC10.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3145976B2 (ja) 1998-01-05 2001-03-12 日本電気アイシーマイコンシステム株式会社 半導体集積回路
EP1417502B1 (en) * 2001-08-16 2007-10-17 Nxp B.V. Electronic circuit and method for testing
JP4108560B2 (ja) * 2003-07-28 2008-06-25 シャープ株式会社 高周波受信装置
JP3859647B2 (ja) * 2004-01-16 2006-12-20 松下電器産業株式会社 半導体集積回路のテスト方法および半導体集積回路
GB0425800D0 (en) * 2004-11-24 2004-12-22 Koninkl Philips Electronics Nv Montoring physical operating parameters of an integrated circuit
JP4563791B2 (ja) * 2004-12-20 2010-10-13 Ｏｋｉセミコンダクタ株式会社 半導体集積回路
TW200801550A (en) * 2006-01-06 2008-01-01 Koninkl Philips Electronics Nv IC testing methods and apparatus
US7539913B2 (en) * 2006-07-05 2009-05-26 Via Technologies, Inc. Systems and methods for chip testing
CN101144847B (zh) * 2006-09-14 2012-05-23 国际商业机器公司 集成电路和指定集成电路的方法
JP5059532B2 (ja) * 2007-09-26 2012-10-24 ルネサスエレクトロニクス株式会社 半導体集積回路
CN101975922A (zh) * 2010-10-11 2011-02-16 上海电力学院 低功耗扫描测试电路及运行方法
JP5793978B2 (ja) * 2011-06-13 2015-10-14 富士通セミコンダクター株式会社 半導体装置
CN107430167B (zh) * 2015-06-18 2021-02-02 瑞萨电子株式会社 半导体装置和诊断测试方法
CN115561612A (zh) * 2021-07-02 2023-01-03 瑞昱半导体股份有限公司 半导体装置与测试脉冲信号产生方法
CN120831561B (zh) * 2025-09-17 2026-01-06 中国星网网络应用有限公司 一种芯片批量化测试装置和方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3806891A (en) * 1972-12-26 1974-04-23 Ibm Logic circuit for scan-in/scan-out
US4779273A (en) * 1984-06-14 1988-10-18 Data General Corporation Apparatus for self-testing a digital logic circuit
GB8432458D0 (en) * 1984-12-21 1985-02-06 Plessey Co Plc Integrated circuits
DE9005697U1 (de) * 1990-05-18 1990-08-30 Siemens AG, 1000 Berlin und 8000 München Integrierter Schaltkreis

Also Published As

Publication number Publication date
DE69526162D1 (de) 2002-05-08
KR960009092A (ko) 1996-03-22
TW307927B (cg-RX-API-DMAC10.html) 1997-06-11
KR0181546B1 (ko) 1999-04-15
DE69526162T2 (de) 2002-08-14
EP0699920A2 (en) 1996-03-06
CN1122918A (zh) 1996-05-22
CN1277361A (zh) 2000-12-20
EP0699920A3 (en) 1997-09-10
CN1200282C (zh) 2005-05-04
EP0699920B1 (en) 2002-04-03

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