CN110085546B - 用于薄基板搬运的静电载体 - Google Patents

用于薄基板搬运的静电载体 Download PDF

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Publication number
CN110085546B
CN110085546B CN201910019606.2A CN201910019606A CN110085546B CN 110085546 B CN110085546 B CN 110085546B CN 201910019606 A CN201910019606 A CN 201910019606A CN 110085546 B CN110085546 B CN 110085546B
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electrostatic chuck
electrode
dielectric layer
support layer
top surface
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Chinese (zh)
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CN110085546A (zh
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迈克尔·S·考克斯
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
CN201910019606.2A 2013-08-05 2014-07-24 用于薄基板搬运的静电载体 Active CN110085546B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910019606.2A CN110085546B (zh) 2013-08-05 2014-07-24 用于薄基板搬运的静电载体

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361862471P 2013-08-05 2013-08-05
US61/862,471 2013-08-05
CN201480038575.0A CN105408992B (zh) 2013-08-05 2014-07-24 用于薄基板搬运的静电载体
PCT/US2014/048065 WO2015020810A1 (en) 2013-08-05 2014-07-24 Electrostatic carrier for thin substrate handling
CN201910019606.2A CN110085546B (zh) 2013-08-05 2014-07-24 用于薄基板搬运的静电载体

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201480038575.0A Division CN105408992B (zh) 2013-08-05 2014-07-24 用于薄基板搬运的静电载体

Publications (2)

Publication Number Publication Date
CN110085546A CN110085546A (zh) 2019-08-02
CN110085546B true CN110085546B (zh) 2023-05-16

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CN201480038575.0A Active CN105408992B (zh) 2013-08-05 2014-07-24 用于薄基板搬运的静电载体
CN201910019606.2A Active CN110085546B (zh) 2013-08-05 2014-07-24 用于薄基板搬运的静电载体

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Country Status (6)

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US (2) US9536768B2 (enExample)
JP (2) JP6518666B2 (enExample)
KR (2) KR102139682B1 (enExample)
CN (2) CN105408992B (enExample)
TW (2) TWI629748B (enExample)
WO (1) WO2015020810A1 (enExample)

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KR102139682B1 (ko) * 2013-08-05 2020-07-30 어플라이드 머티어리얼스, 인코포레이티드 얇은 기판 취급을 위한 정전 캐리어
JP6282080B2 (ja) * 2013-10-30 2018-02-21 株式会社日立ハイテクノロジーズ プラズマ処理装置
US9551070B2 (en) * 2014-05-30 2017-01-24 Applied Materials, Inc. In-situ corrosion resistant substrate support coating
EP3402908A1 (en) * 2016-01-13 2018-11-21 Applied Materials, Inc. Holding arrangement for holding a substrate, carrier for supporting a substrate, vacuum processing system, method for holding a substrate, and method for releasing a substrate
DE102016206193A1 (de) * 2016-04-13 2017-10-19 Trumpf Gmbh + Co. Kg Elektroadhäsionsgreifer mit fraktalen Elektroden
JP6867686B2 (ja) * 2017-06-30 2021-05-12 株式会社 セルバック 接合装置
CN112640082B (zh) * 2018-12-05 2023-12-26 株式会社爱发科 静电吸盘、真空处理装置及基板处理方法
US11887878B2 (en) * 2019-06-28 2024-01-30 Applied Materials, Inc. Detachable biasable electrostatic chuck for high temperature applications
US20210381101A1 (en) * 2020-06-03 2021-12-09 Applied Materials, Inc. Substrate processing system
US11749542B2 (en) * 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US12046503B2 (en) * 2021-10-26 2024-07-23 Applied Materials, Inc. Chuck for processing semiconductor workpieces at high temperatures
JP2025119839A (ja) * 2024-02-02 2025-08-15 信越化学工業株式会社 静電吸着機能を有する加熱装置

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CN2786784Y (zh) * 2004-03-31 2006-06-07 应用材料公司 可拆卸静电吸盘
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WO1999014796A1 (en) * 1997-09-16 1999-03-25 Applied Materials, Inc. Plasma chamber support having an electrically coupled collar ring
JP2000228441A (ja) * 1999-01-13 2000-08-15 Applied Materials Inc 改良された温度制御及び静電チャックおよび耐破壊性を有する静電チャック
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KR20110025267A (ko) * 2009-09-04 2011-03-10 주식회사 디엠에스 피처리물의 디척킹과 함께 반응 챔버 내부 및 정전 척의 드라이 클리닝을 실행하는 플라즈마 반응기의 피처리물 디척킹 장치 및 방법
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干法刻蚀中静电吸盘对产品良率的影响;董家伟;黄其煜;;电子与封装(第03期);全文 *

Also Published As

Publication number Publication date
CN110085546A (zh) 2019-08-02
JP2019125811A (ja) 2019-07-25
TW201519362A (zh) 2015-05-16
KR102139682B1 (ko) 2020-07-30
CN105408992B (zh) 2019-01-29
KR20170063982A (ko) 2017-06-08
TW201737411A (zh) 2017-10-16
KR101812666B1 (ko) 2017-12-27
TWI629748B (zh) 2018-07-11
US20170062261A1 (en) 2017-03-02
KR20160040656A (ko) 2016-04-14
CN105408992A (zh) 2016-03-16
JP6518666B2 (ja) 2019-05-22
WO2015020810A1 (en) 2015-02-12
TWI613756B (zh) 2018-02-01
US9779975B2 (en) 2017-10-03
JP6968120B2 (ja) 2021-11-17
US20150036260A1 (en) 2015-02-05
US9536768B2 (en) 2017-01-03
JP2016529718A (ja) 2016-09-23

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