CN109979868A - 搬送装置的示教方法 - Google Patents

搬送装置的示教方法 Download PDF

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CN109979868A
CN109979868A CN201811515565.8A CN201811515565A CN109979868A CN 109979868 A CN109979868 A CN 109979868A CN 201811515565 A CN201811515565 A CN 201811515565A CN 109979868 A CN109979868 A CN 109979868A
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CN109979868B (zh
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小林俊之
北原竜
越石和也
佐藤淳哉
须藤骏
千叶俊光
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Tokyo Electron Ltd
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Abstract

本发明提供一种搬送装置的示教方法，能够抑制铅垂方向的示教精度的偏差。在一个实施方式的搬送装置的示教方法中，搬送装置具有：基板保持部，其具备用于通过抽吸来吸附保持基板的抽吸孔；驱动机构，其使基板保持部移动；以及压力检测部，其检测与抽吸孔连通的抽吸路径的压力，搬送装置的示教方法包括以下步骤：第一移动步骤，使基板保持部移动到基板的下方；第二移动步骤，在对抽吸路径进行抽吸的状态下检测抽吸路径的压力，并且使基板保持部从基板的下方朝向上方移动；判定步骤，基于抽吸路径的压力来判定基板保持部是否接触到基板；以及存储步骤，将判定为基板保持部接触到基板时的基板保持部的位置存储为基准位置。

Description

搬送装置的示教方法
技术领域
本发明涉及一种搬送装置的示教方法。
背景技术
在制造半导体器件时，使用具备在多个模块之间搬送基板的搬送装置的基板处理系统。在基板处理系统中，搬送装置向各个模块内搬入基板，并将基板交接到配置在各个模块内的载置台。
在这样的基板处理系统中，为了高精度地将基板搬送到各个模块内，对搬送装置示教各个模块内的载置基板的位置等搬送所需要的信息(例如，参照专利文献1)。
专利文献1：日本特开2002-313872号公报
发明内容
发明要解决的问题
另外，关于用于将基板载置在载置台的中心位置的水平方向的示教，大多由控制装置自动地进行。另一方面，关于铅垂方向的示教，作业者通过目视进行位置检测，通过手动作业来将位置信息输入到搬送装置。因此，根据作业者的熟练度不同而使铅垂方向的示教精度产生偏差。
因而，在本发明的一个方式中，目的在于提供一种能够抑制铅垂方向的示教精度的偏差的搬送装置的示教方法。
用于解决问题的方案
为了实现上述目的，在本发明的一个实施方式所涉及的搬送装置的示教方法中，该搬送装置具有：基板保持部，其具备用于通过抽吸来吸附保持基板的抽吸孔；驱动机构，其使所述基板保持部移动；以及压力检测部，其检测与所述抽吸孔连通的抽吸路径的压力，该搬送装置的示教方法包括以下步骤：第一移动步骤，使所述基板保持部移动到所述基板的下方；第二移动步骤，在对所述抽吸路径进行抽吸的状态下检测所述抽吸路径的压力，并且使所述基板保持部从所述基板的下方朝向上方移动；判定步骤，基于所述抽吸路径的压力来判定所述基板保持部是否接触到所述基板；以及存储步骤，将判定为所述基板保持部接触到所述基板时的所述基板保持部的位置存储为基准位置。
发明的效果
根据本公开的搬送装置的示教方法，能够抑制铅垂方向的示教精度的偏差。
附图说明
图1是示出一个实施方式所涉及的基板处理系统的概要结构的图。
图2是示出加载埠的截面的一例的图。
图3是示出定位器的截面的一例的图。
图4是示出加载互锁模块的截面的一例的图。
图5是示出控制装置的硬件结构的一例的图。
图6是示出拾取器的概要结构的一例的图。
图7是示出一个实施方式所涉及的搬送装置的示教方法的流程图。
图8是示出拾取器的高度与吸附压力之间关系的图。
图9是示出拾取器与晶圆的位置关系的图。
图10是说明拾取器与旋转载置台之间交接晶圆的动作的图。
附图标记说明
1：基板处理系统；10：传送模块；11：搬送装置；12：拾取器；20：工艺模块；21：载置台；30：加载模块；31：搬送装置；32：导轨；33：多关节臂；34：拾取器；34a：基部；34b：前端部；34c：爪部；34d：排气路径；34e：抽吸孔；34f：排气管；34g：压力传感器；34h：阀；34i：排气装置；40：加载互锁模块；41：载置台；50：加载埠；51：搬送容器；60：定位器；62：旋转载置台；100：控制装置；W：晶圆。
具体实施方式
下面，参照附图来说明用于实施本发明的方式。此外，在本说明书和附图中，对于实质上相同的结构，通过标注相同的附图标记，来省去重复的说明。
〔基板处理系统〕
作为应用一个实施方式所涉及的示教方法的基板处理系统的一例，对能够以单片方式对半导体晶圆(以下称为“晶圆W”)施加成膜处理等各种处理的基板处理系统进行说明。
图1是示出一个实施方式所涉及的基板处理系统的概要结构的图。图2是示出加载埠的截面的一例的图。图3是示出定位器的截面的一例的图。图4是示出加载互锁模块的截面的一例的图。图5是示出控制装置的硬件结构的一例的图。
如图1所示，基板处理系统1具备：传送模块10、四个工艺模块20、加载模块30、两个加载互锁模块40以及控制装置100。
传送模块10在俯视时具有近似六边形形状。传送模块10由真空室构成，具有配置在内部的搬送装置11。搬送装置11由多关节臂形成，该多关节臂形成为在能够进入工艺模块20和加载互锁模块40的位置能够进行伸屈、升降以及转动。搬送装置11具有能够向彼此相反的方向独立地伸屈的两个拾取器12，从而一次能够搬送两片晶圆W。此外，搬送装置11只要能够与工艺模块20及加载互锁模块40之间搬送晶圆W即可，不限定于图1所示的结构。
工艺模块20呈放射状地配置在传送模块10的周围且与传送模块10连接。工艺模块20由处理室构成，在内部具有用于载置晶圆W的圆柱状的载置台21。在工艺模块20中，对载置于载置台21上的晶圆W施加成膜处理等规定的处理。传送模块10与工艺模块20通过能够开闭的闸阀22被隔开。
加载模块30与传送模块10相向地配置。加载模块30为长方体形状，是被保持为大气压气氛的大气搬送室。在加载模块30内配置有搬送装置31。搬送装置31以能够滑动移动的方式被支承在导轨32上，该导轨32被设置为在加载模块30内的中心部沿长边方向延伸。在导轨32中内置有例如具有编码器的线性马达，通过驱动线性马达来使搬送装置31沿导轨32移动。
搬送装置31在上下具有被配置两段的两个多关节臂33。在各多关节臂33的顶端安装有形成为两叉状的作为基板保持部的拾取器34。在各拾取器34上保持晶圆W。各多关节臂33能够从中心向半径方向伸屈以及升降。另外，能够对各多关节臂33的伸屈动作单独地进行控制。多关节臂33的各旋转轴以各自相对于基台35能够同轴地旋转的方式连结，例如能够向相对于基台35的转动方向一体地旋转。导轨32和多关节臂33作为使拾取器34移动的驱动机构发挥功能。搬送装置31与后述的加载互锁模块40、搬送容器51以及定位器60之间搬送晶圆W。此外，搬送装置31只要能够与加载互锁模块40、搬送容器51以及定位器60之间搬送晶圆W即可，不限定于图1所示的结构。
在加载模块30的沿长边方向的一个侧面连接有两个加载互锁模块40。另一方面，在加载模块30的沿长边方向的另一个侧面设置有用于导入晶圆W的一个或多个搬入口36。图示的例中，设置有三个搬入口36。在各搬入口36设置有能够开闭的开闭门37。另外，分别与各搬入口36对应地设置有加载埠50。在加载埠50载置用于收容并搬送晶圆W的搬送容器51。搬送容器51可以是将多个(例如25片)晶圆W以具有规定的间隔的方式分为多段地进行载置并收容的FOUP(Front-Opening Unified Pod：前开式晶圆盒)。图2中示出三个加载埠50中的一个，在各加载埠50设置有为了将搬送容器51的开闭盖52开闭而能够升降并且能够进退的开闭门37的驱动机构38。
在加载模块30的沿短边方向的一个侧面连接有定位器60。定位器60进行晶圆W的位置对准。如图3所示，定位器60具有通过驱动马达61来进行旋转的旋转载置台62，并且在旋转载置台62上载置晶圆W的状态下进行旋转。旋转载置台62具有比晶圆W的直径小的直径。在旋转载置台62的外周设置有用于对晶圆W的周缘部进行检测的光学传感器63。定位器60利用光学传感器63检测晶圆W的中心位置以及切口相对于晶圆W的中心的方向，在加载互锁模块40内对晶圆W的搬送位置进行调整，使得晶圆W的中心位置和切口的方向成为规定位置和规定方向。
加载互锁模块40被配置在传送模块10与加载模块30之间。加载互锁模块40由能够将内部在真空与大气压之间进行切换的内压可变室构成，在内部具有用于载置晶圆W的圆柱状的载置台41。载置台41具有比晶圆W的直径小的直径。加载互锁模块40在将晶圆W从加载模块30向传送模块10搬入时，在将内部维持为大气压并从加载模块30接收到晶圆W之后，对内部进行减压后向传送模块10搬入晶圆W。另外，在将晶圆W从传送模块10向加载模块30搬出时，在将内部维持为真空并从传送模块10接收到晶圆W之后，使内部升压到大气压后向加载模块30搬入晶圆W。加载互锁模块40与传送模块10通过能够开闭的闸阀42被隔开。另外，加载互锁模块40与加载模块30通过能够开闭的闸阀43被隔开。
控制装置100控制基板处理系统1的各个构成要素的动作。如图5所示，控制装置100是具有通过总线B而相互连接的驱动器装置101、辅助存储装置102、存储器装置103、CPU104以及接口装置105等的计算机。用于实现控制装置100中的处理的程序由CD-ROM等记录介质106来提供。当存储有程序的记录介质106被设置于驱动器装置101时，程序从记录介质106经由驱动器装置101被安装到辅助存储装置102。但是，程序的安装未必一定由记录介质106进行，也可以是经由网络来从其它计算机进行下载。辅助存储装置102存储所安装的程序、制程等所需要的数据。存储器装置103在存在程序的起动指示的情况下，从辅助存储装置102读出程序并存储该程序。CPU 104按照存储器装置103中存储的程序来执行与基板处理系统1相关的功能。接口装置105被用作用于与网络连接的接口。
〔拾取器〕
接下来，说明搬送装置31的拾取器34。图6是示出拾取器34的概要结构的一例的图。
拾取器34具有基部34a、两个前端部34b、四个爪部34c以及排气路径34d。基部34a被安装于多关节臂33。各前端部34b形成为从基部34a朝向拾取器34的前进方向呈近似圆弧状地延伸。各爪部34c形成为朝向被基部34a和前端部34b包围的区域(以下称为“晶圆保持区域”)的中心部突出。四个爪部34c以沿着晶圆保持区域的周向彼此具有间隔的方式配置。在各爪部34c的上部形成有抽吸孔34e，晶圆W以其下表面的周缘部堵住抽吸孔34e的方式吸附保持在爪部34c上。排气路径34d形成于基部34a及前端部34b，构成抽吸路径。排气路径34d的一端连接于各爪部34c的抽吸孔34e，另一端与连接于拾取器34的构成抽吸路径的排气管34f内连通。
在排气管34f上插入设置有阀34h以及作为压力检测部的压力传感器34g。压力传感器34g检测排气管34f内的压力(以下也称为“吸附压力”)，并将与检测出的压力对应的信号输出到控制装置100。在排气管34f上的阀34h的下游侧连接有排气装置34i。排气装置34i包括调节器、真空泵等，一边调整压力一边对排气路径34d和排气管34f内进行抽吸。以如下方式对阀34h进行控制，在执行后述的搬送装置31的示教时，或者在从紧挨着由搬送装置31自一个模块接收晶圆W之前直至紧挨着将晶圆W载置到另一模块之后为止的期间，阀34h被打开，在除此之外的期间阀34h被关闭。由此，在搬送装置31的示教时以及从紧挨着由搬送装置31保持晶圆W之前直至紧挨着使晶圆W离开之后为止，从抽吸孔34e进行抽吸。
〔示教方法〕
对一个实施方式所涉及的搬送装置31的示教方法进行说明。图7是示出一个实施方式所涉及的搬送装置31的示教方法的流程图。
下面，列举用于对搬送装置示教(指教)定位器60内的旋转载置台62上载置的晶圆W的下表面与搬送装置31的拾取器34的上表面接触的位置的方法为例来进行说明。但是，对于加载互锁模块40内的载置台41上载置的晶圆W的下表面或搬送容器51内收容的晶圆W的下表面与搬送装置31的拾取器34的上表面接触的位置，也能够同样地进行示教。此外，在下面的说明中，由控制装置100控制基板处理系统1的各个构成要素的动作。
在步骤S1中，将示教中使用的晶圆W载置于旋转载置台62上(载置步骤)。作为示教中使用的晶圆W，能够使用例如产品用晶圆、测试品用晶圆、监视用晶圆、搬送检查晶圆、假片等各种晶圆。
在步骤S2中，使搬送装置31的拾取器34移动到作为示教开始位置的晶圆W的下方(第一移动步骤)。由此，搬送装置31的多关节臂33成为伸展的状态。
在步骤S3中，通过将插入设置在排气管34f上的阀34h打开，来开始对排气路径34d和排气管34f内进行抽吸。但是，开始对排气路径34d和排气管34f内进行抽吸的时刻不限定于此，例如也可以是在使拾取器34向示教开始位置移动之前，也可以是使拾取器34向示教开始位置移动的中途。
在步骤S4中，在对排气路径34d和排气管34f内进行抽吸的状态下，使拾取器34向上方移动规定距离(例如0.1mm)后停止(第二移动步骤)。由此，拾取器34的上表面与晶圆W的下表面之间的距离变短。
在步骤S5中，控制装置100判定拾取器34是否吸附了晶圆W(判定步骤)。例如，控制装置100基于由压力传感器34g检测的吸附压力是否在规定时间内达到规定的阈值以下，来判定拾取器34是否吸附了晶圆W。具体地说，在该吸附压力在规定时间内达到了规定的阈值以下的情况下，控制装置100判定为拾取器34吸附了晶圆W。另一方面，在该吸附压力在规定时间内没有达到规定的阈值以下的情况下，控制装置100判定为拾取器34没有吸附晶圆W。规定时间能够设为例如直至由压力传感器34g检测的吸附压力变为大致固定为止所需要的时间。另外，例如控制装置100也可以基于使拾取器34向上方移动了规定距离时的吸附压力相对于拾取器34处于示教开始位置时的吸附压力的变化量是否为规定的阈值以上，来判定拾取器34是否吸附了晶圆W。具体地说，在该吸附压力的变化量为规定的阈值以上的情况下，控制装置100判定为拾取器34吸附了晶圆W。另一方面，在该吸附压力的变化量小于规定的阈值的情况下，控制装置100判定为拾取器34没有吸附晶圆W。另外，例如在搬送装置31具有能够基于吸附压力来判定拾取器34是否吸附了晶圆W的控制器的情况下，控制装置100也可以基于该控制器的判定结果来判定拾取器34是否吸附了晶圆W。具体地说，在该控制器判定为拾取器34吸附了晶圆W的情况下，控制装置100接受该控制器的判定结果来判定为拾取器34吸附了晶圆W。另一方面，在该控制器判定为拾取器34没有吸附晶圆W的情况下，控制装置100接受该控制器的判定结果来判定为拾取器34没有吸附晶圆W。
在步骤S5中判定为拾取器34没有吸附晶圆W的情况下，控制装置100判定为晶圆W的下表面没有接触到拾取器34的上表面，使处理返回步骤S4。即，控制装置100间歇地使拾取器34向上方移动，直到拾取器34吸附晶圆W为止。另一方面，在步骤S5中判定为拾取器34吸附了晶圆W的情况下，控制装置100判定为晶圆W的下表面接触到拾取器34的上表面，使处理前进到步骤S6。
在步骤S6中，将在步骤S5中判定为晶圆W的下表面接触到拾取器34的上表面时的拾取器34的位置(以下也称为“当前位置”)作为拾取器34的基准位置存储到辅助存储装置102等(存储步骤)，结束处理。
通过以上的步骤S1～S6，能够示教拾取器34与晶圆W接触的位置。
如以上说明的那样，在一个实施方式所涉及的搬送装置31的示教方法中，基于使用于通过抽吸来吸附保持晶圆W的拾取器34从晶圆W的下方朝向上方移动时的吸附压力来示教拾取器34与晶圆W接触的位置。由此，不需要作业者通过目视进行位置检测，因此能够抑制因作业者的熟练度不同而产生的搬送装置31的铅垂方向的示教精度的偏差。另外，能够削减搬送装置31的示教所需要的工时。另外，不需要示教专用的治具，且对作业者的技术教育容易，因此能够削减示教所需要的费用。
另外，在一个实施方式中，在使多关节臂33伸展的状态下，检测拾取器34的上表面与晶圆W的下表面接触的铅垂方向的位置。由此，能够抑制由于使多关节臂33伸展时因拾取器34的自重而可能产生的拾取器34的挠性导致示教精度降低。
接下来，对使用上述的搬送装置31的示教方法时的拾取器34的高度与吸附压力之间的关系进行说明。图8是示出拾取器34的高度与吸附压力之间的关系的图，纵轴表示由压力传感器34g检测出的吸附压力，横轴表示拾取器34的高度方向上的位置(以下也称为“Z轴高度”)。图9是示出拾取器34与晶圆W的位置关系的图，图9的(a)～(c)分别示出在图8中的Z轴高度为Z1～Z3时的拾取器34与晶圆W的位置关系。
在拾取器34位于远离晶圆W的位置时(参照图9的(a))，拾取器34的抽吸孔34e被打开，因此如图8所示，吸附压力变高。
在拾取器34位于接近晶圆W的位置时(参照图9的(b))，如图8所示，吸附压力随着拾取器34的上表面靠近晶圆W的下表面而变低。
在拾取器34的上表面接触到晶圆W的下表面的位置时(参照图9的(c))，拾取器34的抽吸孔34e被封闭，因此如图8所示，吸附压力变低。
像这样，在拾取器34的上表面接触到晶圆W的下表面之前和之后，由压力传感器34g检测的吸附压力发生变化。
在一个实施方式中，如图8所示，将比在拾取器34的上表面接触到晶圆W的下表面的位置时的吸附压力大、且比在拾取器34远离晶圆W的位置时的吸附压力小的压力设定为阈值。而且，在由压力传感器34g检测的吸附压力为阈值以下的情况下，控制装置100判定为拾取器34的上表面接触到晶圆W的下表面，并将当前位置作为基准位置存储到辅助存储装置102等。
〔晶圆的搬送方法〕
关于晶圆W的搬送方法，例举如下情况为例来进行说明：利用使用上述的示教方法被进行了示教的搬送装置31将晶圆W搬入到定位器60内并对晶圆W的搬送位置进行调整后，将晶圆W从定位器60内搬出。图10是说明在拾取器34与旋转载置台62之间交接晶圆W的动作的图。图10的(a)示出将由拾取器34保持的晶圆W载置到旋转载置台62时的动作。图10的(b)示出要由拾取器34保持载置于旋转载置台62上的晶圆W时的动作。
首先，将收容晶圆W的搬送容器51载置于加载埠50。接下来，在使搬送装置31的拾取器34进入搬送容器51内抬起并保持晶圆W之后，从搬送容器51内退出。
接下来，如用图10的(a)的箭头A1表示的那样，使保持着晶圆W的拾取器34从相比于通过上述的示教方法存储的基准位置而言向上方离开规定距离Za(例如2mm～3mm)的第一高度进入定位器60内的旋转载置台62的上方。
接下来，如用图10的(a)的箭头A2表示的那样，使拾取器34下降至相比于基准位置而言向下方离开规定距离Zb(例如2mm～3mm)的第二高度。此时，在基准位置处晶圆W的下表面接触到旋转载置台62的上表面，通过使拾取器34下降至第二高度来将晶圆W载置于旋转载置台62。
接下来，如用图10的(a)的箭头A3表示的那样，使拾取器34从定位器60内退出。另外，在使拾取器34从定位器60内退出之后，利用定位器60对晶圆W相对于加载互锁模块40的搬送位置进行调整。
接下来，如用图10的(b)的箭头B1表示的那样，使没有保持晶圆W的拾取器34从相比于基准位置而言向下方离开规定距离Zb(例如2mm～3mm)的第二高度进入定位器60内的旋转载置台62的下方。
接下来，如用图10的(b)的箭头B2表示的那样，使拾取器34上升至相比于基准位置而言向上方离开规定距离Za的第一高度。此时，在基准位置处晶圆W的下表面接触到拾取器34的上表面，通过使拾取器34上升至第一高度来将晶圆W保持于拾取器34。
接下来，如用图10的(b)的箭头B3表示的那样，使保持着晶圆W的拾取器34从定位器60内退出。
通过以上步骤，能够利用搬送装置31将晶圆W搬入到定位器60内并对晶圆W的搬送位置进行调整后，将晶圆W从定位器60内搬出。
以上，说明了用于实施本发明的方式，但上述内容不是对发明的内容进行限定，在本发明的范围内能够进行各种变形和改进。
在上述的实施方式中，例举基板为半导体晶圆的情况为例进行了说明，但本发明不限定于此。例如，基板也可以是玻璃基板、LCD基板等。

Claims (6)

1.一种搬送装置的示教方法，其中，所述搬送装置具有：基板保持部，其具备用于通过抽吸来吸附保持基板的抽吸孔；驱动机构，其使所述基板保持部移动；以及压力检测部，其检测与所述抽吸孔连通的抽吸路径的压力，所述搬送装置的示教方法包括以下步骤：
第一移动步骤，使所述基板保持部移动到所述基板的下方；
第二移动步骤，在对所述抽吸路径进行抽吸的状态下检测所述抽吸路径的压力，并且使所述基板保持部从所述基板的下方朝向上方移动；
判定步骤，基于所述抽吸路径的压力来判定所述基板保持部是否接触到所述基板；以及
存储步骤，将判定为所述基板保持部接触到所述基板时的所述基板保持部的位置存储为基准位置。
2.根据权利要求1所述的搬送装置的示教方法，其特征在于，
在所述第二移动步骤中，使所述基板保持部以规定距离间歇地进行移动。
3.根据权利要求2所述的搬送装置的示教方法，其特征在于，
在所述判定步骤中，基于所述基板保持部停止时的所述抽吸路径的压力，来判定所述基板保持部是否接触到所述基板。
4.根据权利要求1至3中的任一项所述的搬送装置的示教方法，其特征在于，
在所述判定步骤中，在所述抽吸路径的压力为阈值以下的情况下，判定为所述基板保持部接触到所述基板。
5.根据权利要求1至4中的任一项所述的搬送装置的示教方法，其特征在于，
所述驱动机构包含多关节臂。
6.根据权利要求5所述的搬送装置的示教方法，其特征在于，
在所述多关节臂伸展的状态下执行所述第二移动步骤。
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