TW202146192A - 搬運裝置之教示方法及處理系統 - Google Patents
搬運裝置之教示方法及處理系統 Download PDFInfo
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Abstract
本發明係提供一種技術,可縮短搬運裝置之教示作業所需要的時間。依本發明之一態樣的搬運裝置之教示方法,係具有固持基板之基板固持部及設於該基板固持部之第一檢測部的搬運裝置之教示方法,其包含以下步驟:一邊使該基板固持部在鉛直方向移動,一邊藉由該第一檢測部檢測檢測物體的高度位置,並基於檢測到的該檢測物體之高度位置,而設定該基板固持部之鉛直方向上之教示位置的步驟;及一邊使該基板固持部在水平方向移動,一邊基於設在有別於該搬運裝置之位置的第二檢測部檢測該基板固持部時的該基板固持部之水平位置,而設定該基板固持部之水平方向上之教示位置的步驟。
Description
本發明係關於一種搬運裝置之教示方法及處理系統。
在製造半導體裝置時,係使用處理系統,其具備對複數模組進行基板之搬運的搬運裝置。在處理系統中,為了精度良好地將基板搬運至各模組內,會進行搬運裝置的教示(調整校正)作業。
關於搬運裝置的教示作業,吾人知悉一種方法,係在進行完粗略的位置對準後,將基板搬運至對準器以測量偏心量及偏心方向,並基於該偏心量及該偏心方向而修正暫時的位置座標,使其成為正確的位置座標(例如,參照專利文獻1)。
[先前技術文獻]
[專利文獻]
[專利文獻1]日本特開2000-127069號公報
[發明所欲解決之問題]
本發明係提供一種可縮短搬運裝置之教示作業所需要之時間的技術。
[解決問題之技術手段]
依本發明之一態樣的搬運裝置之教示方法,係具有「固持基板之基板固持部、及設於該基板固持部之第一檢測部」的搬運裝置之教示方法,其包含以下步驟:一邊使該基板固持部在鉛直方向移動,一邊藉由該第一檢測部檢測檢測物體的高度位置,並基於檢測到之該檢測物體的高度位置,而設定該基板固持部之鉛直方向上之教示位置的步驟;及一邊使該基板固持部在水平方向移動,一邊基於設在有別於該搬運裝置之位置的第二檢測部檢測該基板固持部時的該基板固持部之水平位置,而設定該基板固持部之水平方向上之教示位置的步驟。
[發明效果]
依本發明,可縮短搬運裝置之教示作業所需要的時間。
以下,一邊參照附加之圖式,一邊說明非限定本發明之例示的實施態樣。附加的全部圖式中,對於相同或是對應的構件或零件,係賦予相同或是對應的參照符號,並省略重複的說明。
[處理系統]
參照圖1~圖5,並說明應用實施態樣之教示(調整校正)方法的處理系統之一例。圖1係顯示實施態樣之處理系統之概略構成的圖式。圖2係顯示載入埠之剖面之一例的圖式。圖3係顯示對準器之剖面之一例的圖式。圖4係顯示裝載鎖定模組之剖面之一例的圖式。圖5係顯示控制裝置之硬體構成之一例的圖式。
處理系統1包含:傳送模組10、處理模組20、裝載模組30、裝載鎖定模組40及控制裝置100。在本實施態樣中,係設置四個處理模組20,並設置兩個裝載鎖定模組40,但處理模組20及裝載鎖定模組40的數量並非限定於此。傳送模組10、處理模組20、裝載模組30及裝載鎖定模組40係構成處理裝置。
傳送模組10在俯視觀下具有略六角形。傳送模組10係由真空室構成,並具有配置於內部的搬運裝置11。搬運裝置11係由能夠在可進出處理模組20及裝載鎖定模組40之位置上,屈伸、升降及迴旋的多關節臂部而形成。搬運裝置11具有互相朝相反方向,獨立且可屈伸的兩個拾取器12,可一次搬運兩片晶圓W。又,搬運裝置11只要可在處理模組20及裝載鎖定模組40之間搬運晶圓W即可,並不限定於圖1所示之構成。
處理模組20係輻射狀地配置於傳送模組10的周圍,並與傳送模組10連接。處理模組20係由處理室構成,並在內部具有載置晶圓W之圓柱狀的載置台21。在處理模組20中,係對載置於載置台21的晶圓W實施各種半導體製程。半導體製程例如包含成膜處理、蝕刻處理、熱處理等用於製造半導體的各種製程處理。傳送模組10與處理模組20,係以可開閉的閘門閥22加以分隔。
裝載模組30係與傳送模組10對向配置。裝載模組30呈直方體狀,並且係保持於大氣壓環境的大氣搬運室。在裝載模組30內配置有搬運裝置31。搬運裝置31係以能滑移的方式受支撐於導軌32上,而導軌32係設置成在裝載模組30內之中心部沿著裝載模組30的長邊延伸。在導軌32中例如內建了具有編碼器的線性馬達(未圖示),並藉由驅動線性馬達而使搬運裝置31沿著導軌32移動。
搬運裝置31具有配置成上下兩段的兩個多關節臂部33。在各多關節臂部33的前端安裝有形成為雙叉狀的拾取器34。在各拾取器34上固持晶圓W。各多關節臂部33可從中心朝徑向屈伸及升降。各多關節臂部33的屈伸動作可個別地控制。多關節臂部33的各旋轉軸,係分別相對於基座35以可同軸旋轉的方式連接,例如朝相對於基座35之迴旋方向作為一體地旋轉。導軌32及多關節臂部33係作為使拾取器34移動的驅動機構而發揮功能。搬運裝置31係在後述的裝載鎖定模組40、搬運容器51及對準器60之間搬運晶圓W。又,搬運裝置31只要可在裝載鎖定模組40、搬運容器51及對準器60之間搬運晶圓W即可,並不限定於圖1所示之構成。
在沿著裝載模組30之長邊的一側面中,係連接有兩個裝載鎖定模組40。另一方面,在沿著裝載模組30之長邊的另一側面中,設有用於導入晶圓W的一個或是複數個搬入口36。在圖示的例子中,係設有三個搬入口36。在各搬入口36中,設有可開閉的開閉門37。又,分別對應於各搬入口36而設有載入埠50。在載入埠50中,係載置收納晶圓W並加以搬運的搬運容器51。搬運容器51宜為具有既定間隔而多段地固持並收納複數(例如25片)晶圓W的FOUP(Front-Opening Unified Pod:前開式晶圓傳送盒)。在各載入埠50中,設有為了開閉搬運容器51之開閉蓋52而可升降及進退的開閉門37之驅動機構38(圖2)。
在裝載模組30的各搬入口36中,設有突出檢測感測器81(圖2)。突出檢測感測器81係檢測載置於載入埠50之搬運容器51內的晶圓W有無突出,並將檢測結果傳輸至控制裝置100。在本實施態樣中,突出檢測感測器81包含隔著搬入口36且在鉛直方向上對向配置的投光部81a及受光部81b。投光部81a係設於搬入口36的下方,並朝受光部81b照射偵測光。受光部81b係設於搬入口36的上方,並接收投光部81a所照射的偵測光。此突出檢測感測器81係在投光部81a所照射之偵測光未被受光部81b所接收時,判斷在投光部81a與受光部81b之間存在晶圓W,並將表示具有晶圓W突出的資訊傳輸至控制裝置100。又,投光部81a與受光部81b的位置關係亦可上下顛倒。
在沿著裝載模組30之短邊的一側面中,連接有對準器60。對準器60係進行晶圓W的位置對準。對準器60具有藉由驅動馬達61(圖3)而旋轉的旋轉平台62。旋轉平台62係在頂面載置有晶圓W的狀態下旋轉。旋轉平台62具有小於晶圓W之直徑的直徑。在旋轉平台62的外周,設有以光學式檢測晶圓W之周緣部的光學感測器63。對準器60係藉由光學感測器63,而檢測晶圓W的中心位置、及相對於晶圓W之中心的切口之方向,並進行晶圓W的位置對準,以在裝載鎖定模組40內使晶圓W的中心位置及切口的方向成為既定位置及既定方向。
在裝載模組30中的與對準器60之連接部中,設有突出檢測感測器82(圖3)。突出檢測感測器82係檢測載置於對準器60內之旋轉平台62的晶圓W有無突出,並將檢測結果傳輸至控制裝置100。在本實施態樣中,突出檢測感測器82包含隔著連接部而在鉛直方向上對向配置的投光部82a及受光部82b。投光部82a係設於連接部的下方,並朝受光部82b照射偵測光。受光部82b係設於連接部的上方,並接收投光部82a所照射的偵測光。此突出檢測感測器82係在投光部82a所照射之偵測光未被受光部82b所接收時,判斷在投光部82a與受光部82b之間存在晶圓W,並將表示具有晶圓W突出的資訊,傳輸至控制裝置100。又,投光部82a與受光部82b的位置關係亦可上下顛倒。
裝載鎖定模組40係配置於傳送模組10與裝載模組30之間。裝載鎖定模組40係由可將內部在真空與大氣壓之間進行切換的內壓可變室所構成,並在內部具有載置晶圓W的圓柱狀之平台41。平台41具有小於晶圓W之直徑的直徑。裝載鎖定模組40在將晶圓W從裝載模組30搬入傳送模組10時,係先將內部維持在大氣壓並在從裝載模組30承接到晶圓W後,再將內部減壓而將晶圓W搬入傳送模組10。又,在將晶圓W從傳送模組10搬出至裝載模組30時,係先將內部維持在真空並在從傳送模組10承接到晶圓W後,再將內部升壓至大氣壓而將晶圓W搬入裝載模組30。裝載鎖定模組40與傳送模組10係以可開閉的閘門閥42加以分隔。又,裝載鎖定模組40與裝載模組30係以可開閉的閘門閥43加以分隔。
在裝載模組30中的與裝載鎖定模組40之連接部中,設有突出檢測感測器83(圖4)。突出檢測感測器83係檢測載置於裝載鎖定模組40內之平台41的晶圓W有無突出,並將檢測結果傳輸至控制裝置100。在本實施態樣中,突出檢測感測器83包含隔著連接部並在鉛直方向上對向配置的投光部83a及受光部83b。投光部83a係設於連接部的下方,並朝受光部83b照射偵測光。受光部83b係設於連接部的上方,並接收投光部83a所照射的偵測光。此突出檢測感測器83係在投光部83a所照射的偵測光未被受光部83b所接收時,判斷在投光部83a與受光部83b之間存在晶圓W,並將表示具有晶圓W突出的資訊,傳輸至控制裝置100。又,投光部83a與受光部83b的位置關係亦可上下顛倒。
控制裝置100係控制處理系統1之各構成元件的動作。如圖5所示,控制裝置100係具有分別以匯流排B相互連接的「驅動裝置101、補助儲存裝置102、記憶體裝置103、CPU104及介面裝置105」等的電腦。實現控制裝置100中之處理的程式,係由CD-ROM等記錄媒體106提供。若將儲存程式的記錄媒體106設置於驅動裝置101,則程式會從記錄媒體106經由驅動裝置101而安裝至補助儲存裝置102。然而,程式的安裝並不一定要藉由記錄媒體106進行,亦可經由網路而從其他電腦下載。補助儲存裝置102係儲存安裝的程式、處理程序等必要的資料。記憶體裝置103在具有程式之啟動指示的情況下,係從補助儲存裝置102讀取程式並加以儲存。CPU104係依照儲存於記憶體裝置103之程式而執行與處理系統1有關的功能。介面裝置105係作為用於和網路連接的介面而使用。
[拾取器]
參照圖6,並說明搬運裝置31之拾取器34之一例。圖6係顯示拾取器34之概略構成之一例的圖式。
拾取器34包含:底部34a、前端部34b、爪部34c及排氣路徑34d。底部34a係安裝於多關節臂部33。前端部34b係從底部34a朝拾取器34的前進方向延伸並形成為略圓弧狀。爪部34c係朝底部34a及前端部34b所包圍的區域(以下稱為「晶圓固持區域」)之中心部突出而形成。四個爪部34c係沿著晶圓固持區域的周向而互相具有間隔地配置。在爪部34c的頂部形成有抽吸孔34e,並使晶圓W之底面的周緣部吸附固持爪部34c上,以封閉抽吸孔34e。排氣路徑34d係形成於底部34a及前端部34b,並構成抽吸路徑。排氣路徑34d的一端係連接於各爪部34c的抽吸孔34e,另一端係連通至與拾取器34連接之構成抽吸路徑的排氣管34f內。
在排氣管34f中,插設有壓力檢測部亦即壓力感測器34g、及閥34h。壓力感測器34g係檢測排氣管34f內的壓力(以下稱為「吸附壓力」),並將與檢測到之壓力對應的訊號,傳輸至控制裝置100。在排氣管34f之閥34h的下游側,係連接有排氣裝置34i。排氣裝置34i包含調節器、真空泵等,並一邊調整壓力一邊將排氣路徑34d及排氣管34f內進行抽吸。閥34h係以下述方式控制開閉:在「執行後述的搬運裝置31之教示方法時」、或是「在搬運裝置31即將從一個模組承接晶圓W之前,到剛將晶圓W載置於另一模組後為止的期間」開啟,並在除此以外的期間關閉。藉此,在搬運裝置31之教示作業時、及從搬運裝置31即將固持晶圓W之前到剛釋放晶圓W後為止,進行來自抽吸孔34e的抽吸。
在拾取器34的前端部34b之前端,設有映射感測器84。映射感測器84係檢測載置於載入埠50之搬運容器51內的晶圓W之有無及高度位置,並將檢測結果傳輸至控制裝置100。又,映射感測器84係檢測「載置於裝載鎖定模組40內之平台41的晶圓W」、及「載置於對準器60內之旋轉平台62的晶圓W」之有無及高度位置,並將檢測結果傳輸至控制裝置100。在本實施態樣中,映射感測器84包含在水平方向上對向配置的投光部84a及受光部84b。投光部84a係設於拾取器34的其中一個前端部34b之前端,並朝受光部84b照射偵測光。受光部84b係設於拾取器34之另一前端部34b之前端,並接收投光部84a所照射的偵測光。此映射感測器84係在投光部84a所照射的偵測光未被受光部84b所接收時,判斷在投光部84a與受光部84b之間存在晶圓W,並將表示晶圓W存在的資訊,傳輸至控制裝置100。又,投光部84a與受光部84b的位置關係亦可相反。
[搬運裝置的教示方法]
參照圖7~圖14,並說明搬運裝置31的教示方法之一例。實施態樣的搬運裝置31之教示方法,係控制裝置100控制處理系統1之各構成元件的動作,而對搬運裝置31設定教示位置的方法。在本實施態樣中,係說明對於載入埠50設定搬運裝置31之教示位置的情況,但例如對於裝載鎖定模組40或對準器60設定搬運裝置31之教示位置的情況,亦同樣如此。
實施態樣的搬運裝置31之教示方法,例如係在「處理系統1的啟用時」、「更換搬運裝置31或該搬運裝置31的零件後」、「將藉由搬運裝置31搬入晶圓W之對象維修後」執行。又,作為搬運裝置31的零件例如可列舉:多關節臂部33、拾取器34。又,作為藉由搬運裝置31搬入晶圓W之對象例如可列舉:裝載鎖定模組40、載入埠50、對準器60。
圖7係顯示實施態樣的搬運裝置31之教示方法的流程圖。實施態樣的搬運裝置31之教示方法包含第一教示步驟S1及第二教示步驟S2。第一教示步驟S1係對搬運裝置31設定教示位置的步驟。第二教示步驟S2係在第一教示步驟S1之後執行的步驟,係將在第一教示步驟S1設定好的搬運裝置31之教示位置加以修正而提高精度的步驟。
參照圖8並說明第一教示步驟S1。圖8係顯示第一教示步驟S1之一例的流程圖。第一教示步驟S1包含:第一步驟S11,暫時決定鉛直方向之教示位置;第二步驟S12,決定水平方向之教示位置;及第三步驟S13,決定鉛直方向之教示位置。
第一步驟S11係包含以下動作:一邊使拾取器34在鉛直方向移動,一邊藉由映射感測器84檢測晶圓W的高度位置,並基於檢測到的晶圓W之高度位置,而暫時決定拾取器34之鉛直方向上的教示位置。第一步驟S11亦可包含以下動作:將暫時決定好的該教示位置,例如儲存於補助儲存裝置102。
圖9係用於說明暫時決定鉛直方向上之教示位置的步驟(第一步驟S11)的圖式。圖9(a)及圖9(b)係分別顯示搬運容器51內的晶圓W與拾取器34之間的位置關係的剖面圖及立體圖。
在本實施態樣中,控制裝置100係控制搬運裝置31,一邊使拾取器34上下移動而涵蓋晶圓W之高度位置,一邊接近晶圓W。亦即,控制裝置100係重複執行以下動作:使拾取器34接近晶圓W的動作、使拾取器34下降而涵蓋晶圓W之高度位置的動作、使拾取器34接近晶圓W的動作及使拾取器34上升而涵蓋晶圓W之高度位置的動作。又,控制裝置100係將「從映射感測器84的投光部84a朝受光部84b照射之偵測光被晶圓W遮蔽時的拾取器34之高度位置」,作為晶圓W的位置(拾取器34之高度方向上的教示位置)而儲存於補助儲存裝置102。又,在圖9(b)中,係以實線顯示處於上升後之位置的拾取器34,並以虛線顯示處於下降後之位置的拾取器34,同時以點線顯示偵測光。
第二步驟S12係在第一步驟S11後執行。然而,第二步驟S12亦可在第一步驟S11前執行。第二步驟S12包含以下動作:一邊使拾取器34在水平方向移動,一邊基於設在載入埠50之突出檢測感測器81檢測拾取器34時的拾取器34之水平位置,而決定拾取器34之水平方向上的教示位置。第二步驟S12亦可包含以下動作:將決定好的該教示位置,例如儲存於補助儲存裝置102。
圖10係用於說明決定水平方向之教示位置之步驟(第二步驟S12)的圖式。圖10(a)及圖10(b)係分別顯示設於載入埠50的突出檢測感測器81與拾取器34之間的位置關係的剖面圖及立體圖。
在本實施態樣中,控制裝置100係控制搬運裝置31,使拾取器34在水平方向移動而涵蓋遮蔽及未遮蔽「從突出檢測感測器81之投光部81a朝受光部81b照射之偵測光」的位置。遮蔽偵測光的位置,例如係拾取器34的底部34a或前端部34b。未遮蔽偵測光的位置,例如係設於拾取器34之底部34a並貫通該底部34a的孔(未圖示)、或拾取器34的晶圓固持區域。又,控制裝置100係基於受光部81b所接收之偵測光的光量顯示既定變化時的拾取器34之水平位置,而決定拾取器34之水平方向上的教示位置,並將決定好的教示位置儲存於補助儲存裝置102。更具體而言,控制裝置100係基於「該偵測光之光量顯示既定變化時的拾取器34之水平位置」、及「突出檢測感測器81與搬運容器51內的晶圓W之中心的位置關係」,而決定拾取器34之水平方向上的教示位置。突出檢測感測器81與搬運容器51內的晶圓W之中心的位置關係,係在設計上定義的間隔,例如係預先儲存於補助儲存裝置102。又,在圖10(b)中,係以實線顯示處於未遮蔽偵測光之位置的拾取器34,並以虛線顯示相對於該位置而在水平方向移動時的拾取器34之位置,同時以點線顯示偵測光。
第三步驟S13係在第二步驟S12後執行。第三步驟S13係包含以下動作:決定「在第一步驟S11中暫時決定的拾取器34之鉛直方向的教示位置」。第三步驟S13亦可包含以下動作:將決定好的該教示位置,例如儲存於補助儲存裝置102。
圖11係用於說明決定鉛直方向之教示位置之步驟(第三步驟S13)的流程圖。第三步驟S13包含步驟S131~S136。
在步驟S131中,控制裝置100係將收納有晶圓W的搬運容器51載置於載入埠50上。然而,在接著第二步驟S12而執行第三步驟S13的情況下,亦可利用在第二步驟S12中載置於載入埠50上的搬運容器51,此情況下可省略步驟S131。
在步驟S132中,控制裝置100係將在第一步驟S11暫時決定的鉛直方向之教示位置、及在第二步驟S12中決定的水平方向之教示位置作為基準,而使搬運裝置31的拾取器34往晶圓W的下方位置移動。此時,搬運裝置31的多關節臂部33係處於伸長的狀態。
在步驟S133中,控制裝置100係藉由開啟插設於排氣管34f的閥34h,而開始排氣路徑34d及排氣管34f內的抽吸。然而,開始排氣路徑34d及排氣管34f內之抽吸的時間點並未限定於此,例如,亦可在使拾取器34往晶圓W的下方位置移動前,亦可在使拾取器34往晶圓W之下方位置移動的途中。
在步驟S134中,控制裝置100係在將排氣路徑34d及排氣管34f內進行抽吸的狀態下,使拾取器34往上方移動既定距離(例如,0.1mm)後停止。藉此,拾取器34之頂面與晶圓W之底面的距離會縮短。
在步驟S135中,控制裝置100係判斷晶圓W是否被吸附於拾取器34。例如,控制裝置100係基於「藉由壓力感測器34g檢測之吸附壓力是否在既定時間內達到既定閾值以下」,而判斷晶圓W是否被吸附於拾取器34。具體而言,當該吸附壓力在既定時間內達到既定閾值以下時,控制裝置100會判斷晶圓W吸附於拾取器34。另一方面,當該吸附壓力在既定時間內未達到既定閾值以下時,控制裝置100會判斷晶圓W未吸附於拾取器34。既定時間,例如宜為藉由壓力感測器34g檢測之吸附壓力直到大致固定為止所需要的時間。又,例如,控制裝置100亦可基於「使拾取器34往上方移動既定距離後的吸附壓力」相對於「拾取器34位於晶圓W之下方位置時的吸附壓力」的變化量,是否在既定閾值以上,而判斷晶圓W是否被吸附於拾取器34。具體而言,當該吸附壓力的變化量在既定閾值以上時,控制裝置100會判斷晶圓W吸附於拾取器34。另一方面,當該吸附壓力的變化量未滿既定閾值時,控制裝置100會判斷晶圓W未吸附於拾取器34。又,例如,當搬運裝置31具有可基於吸附壓力而判斷晶圓W是否被吸附於拾取器34的控制器之情況下,控制裝置100亦可基於該控制器的判斷結果,而判斷晶圓W是否被吸附於拾取器34。具體而言,當該控制器判斷為晶圓W吸附於拾取器34時,控制裝置100會接收該控制器的判斷結果而判斷晶圓W吸附於拾取器34。另一方面,當該控制器判斷晶圓W未吸附於拾取器34時,控制裝置100會接收該控制器的判斷結果而判斷晶圓W未吸附於拾取器34。
在步驟S135中,判斷為晶圓W未吸附於拾取器34時,控制裝置100會判斷晶圓W的底面未接觸於拾取器34的頂面,並使處理回到步驟S134。亦即,直到使晶圓W吸附於拾取器34為止,控制裝置100係間歇地使拾取器34往上方移動。另一方面,在步驟S135中.判斷為晶圓W吸附於拾取器34時,控制裝置100會判斷晶圓W的底面接觸於拾取器34的頂面,並使處理前進至步驟S136。
在步驟S136中,係將步驟S135中判斷晶圓W之底面接觸於拾取器34之頂面時的拾取器34之位置(以下稱為「現在位置」),作為拾取器34之鉛直方向上的教示位置而儲存於補助儲存裝置102,並結束處理。
藉由以上的步驟S131~S136,可決定搬運裝置31之鉛直方向的教示位置。
如以上所說明,在第三步驟S13中,係基於「使抽吸而吸附固持晶圓W的拾取器34從晶圓W的下方朝上方移動後的吸附壓力」,而決定搬運裝置31之鉛直方向的教示位置。藉此,由於作業者不需進行藉由目視所進行之位置檢測,可抑制因作業者之熟練度而造成的搬運裝置31之鉛直方向的教示精度之差異。又,可減少搬運裝置31之教示所需要的工時。又,由於不需要教示專用的治具,並且對作業者的技術教育較為容易,故可減少教示所需要的費用。
又,在第三步驟S13中,係在使多關節臂部33伸長的狀態下,檢測拾取器34之頂面與晶圓W之底面接觸的鉛直方向之位置。藉此,可抑制因「使多關節臂部33伸長時,由於拾取器34之本身重量而產生的拾取器34之撓曲」而使教示精度下降之情形。
接著,說明第三步驟S13中的拾取器34的高度與吸附壓力之關係。圖12係顯示拾取器34的高度與吸附壓力之關係的圖式,縱軸係表示藉由壓力感測器34g檢測到的吸附壓力,橫軸係表示拾取器34的高度方向之位置(以下稱為「Z軸高度」)。圖13係顯示拾取器34與晶圓W之位置關係的圖式,圖13(a)~(c)係分別顯示圖12中之Z軸高度為Z1~Z3時的拾取器34與晶圓W之位置關係。
如圖13(a)所示,在Z軸高度為Z1的情況,由於拾取器34係與晶圓W分離,且拾取器34的抽吸孔34e為開放,因此如圖12所示般吸附壓力較高。
如圖13(b)所示,在Z軸高度為Z2的情況,由於與Z軸高度為Z1的情況相同,拾取器34係與晶圓W分離,且拾取器34的抽吸孔34e為開放,因此如圖12所示般吸附壓力較高。
如圖13(c)所示,在Z軸高度為Z3的情況,由於拾取器34的頂面會與晶圓W的底面接觸,且拾取器34的抽吸孔34e為封閉,因此如圖12所示般吸附壓力較低。
如此,在拾取器34之頂面與晶圓W之底面接觸的前後,藉由壓力感測器34g檢測的吸附壓力會變化。
在本實施態樣中,如圖12所示,係將「大於拾取器34之頂面與晶圓W之底面接觸之位置Z3上的吸附壓力」,且「小於拾取器34與晶圓W分離之位置Z1、Z2上的吸附壓力」的壓力設定為閾值。又,當藉由壓力感測器34g檢測之吸附壓力在閾值以下時,控制裝置100會判斷拾取器34之頂面接觸於晶圓W之底面,並將現在位置作為基準位置而儲存於補助儲存裝置102等。
參照圖14,並說明第二教示步驟S2。圖14係用於說明第二教示步驟S2之一例的圖式。
首先,手動且正確地將晶圓W位置對準並收納,以使晶圓W之中心與搬運容器51內之既定位置亦即基準位置P1一致(參照圖14(a))。在本實施態樣中,係將搬運容器51的25個插槽內的例如最下段的第一插槽界定為既定位置,並將晶圓W正確地位置對準而收納至第一插槽。
接著,控制裝置100係以在第一教示步驟S1所決定好的載入埠50之教示位置為基準,而驅動搬運裝置31,並使拾取器34進入搬運容器51內以固持晶圓W(參照圖14(b))。
接著,控制裝置100係控制搬運裝置31,而使固持有晶圓W之狀態的拾取器34進入對準器60內,並將該晶圓W載置於對準器60的旋轉平台62上(參照圖14(c))。
接著,控制裝置100係使載置於旋轉平台62上的晶圓W旋轉,並在使該晶圓W旋轉時,基於光學感測器63所檢測的值,而計算該晶圓W的偏心量Δr及偏心方向(參照圖14(d))。
接著,控制裝置100係基於計算出的偏心量Δr及偏心方向,而修正教示位置(參照圖14(e))。更具體而言,控制裝置100,在相應於計算出之偏心量Δr的與偏心方向相反之方向上,修正該教示位置而設定新的教示位置。又,在圖14(e)中,係以虛線顯示修正前的教示位置,並以實線顯示修正後的教示位置。
藉由以上的第二教示步驟S2,可提高搬運裝置31之水平方向上的教示位置之精度。
如以上所說明,依實施態樣,控制裝置100係一邊使拾取器34在鉛直方向移動,一邊藉由映射感測器84檢測晶圓W的高度位置,並基於檢測到的晶圓W之高度位置,而設定拾取器34之鉛直方向上的教示位置。又,控制裝置100係一邊使拾取器34在水平方向移動,一邊基於設在裝載模組30之突出檢測感測器81~83檢測拾取器34時的拾取器34之水平位置,而設定拾取器34之水平方向上的教示位置。如此,依實施態樣,不需作業者一邊以目視確認拾取器34,一邊設定搬運裝置31的教示位置,而係藉控制裝置100自動地執行教示作業。藉此,可縮短搬運裝置31之教示作業所需要的時間。其結果,可減少處理系統1的啟用工時。又,可縮短「更換搬運裝置31或該搬運裝置31之零件」、或「維修藉由搬運裝置31搬入晶圓W之對象」所伴隨之處理系統1的停機時間。又,可抑制因作業者之熟練度而造成的搬運裝置31之教示精度的差異。又,由於不需要教示專用的治具,且對作業者的技術教育較為容易,因此可減少教示所需要的費用。
又,在上述實施態樣中,晶圓W係基板之一例,拾取器34係基板固持部之一例,突出檢測感測器81~83係第二檢測部之一例,映射感測器84係第一檢測部之一例。
吾人應瞭解到,本次所揭露之實施態樣其所有內容僅為例示而非限制。上述實施態樣只要在不脫離附加之請求範圍及其主旨的情況下,能以各式各樣的形態進行省略、替換、變更。
又,在上述實施態樣中,係說明了突出檢測感測器81~83及映射感測器84為透射型感測器的情況,但本發明並非限定於此。例如,突出檢測感測器81~83及映射感測器84亦可為反射型感測器。又,例如,突出檢測感測器81~83及映射感測器84亦可為利用相機的感測器。
又,上述實施態樣中,係在第一步驟S11中,利用晶圓W作為藉由映射感測器84檢測的檢測物體,但本發明並非限定於此。例如,檢測物體亦可為安裝於裝載模組30、裝載鎖定模組40、載入埠50及對準器60等的制動爪(dog)。
又,在上述實施態樣中,係說明設定設於大氣搬運室的搬運裝置31之教示位置的教示方法,但本發明並非限定於此。例如,同樣可應用於設定設於真空室的搬運裝置11之教示位置的教示方法。
又,在上述實施態樣中,係說明了藉由搬運裝置31所搬運之搬運對象為晶圓W的情況,但本發明並非限定於此。例如,藉由搬運裝置31所搬運的搬運對象亦可為平板顯示器(FPD:Flat Panel Display)用的大型基板、有機電致發光元件面板用的基板、太陽電池用的基板。
1:處理系統
10:傳送模組
11:搬運裝置
12:拾取器
20:處理模組
21:載置台
22:閘門閥
30:裝載模組
31:搬運裝置
32:導軌
33:多關節臂部
34:拾取器
34a:底部
34b:前端部
34c:爪部
34d:排氣路徑
34e:抽吸孔
34f:排氣管
34g:壓力感測器
34h:閥
34i:排氣裝置
35:基座
36:搬入口
37:開閉門
38:驅動機構
40:裝載鎖定模組
41:平台
42:閘門閥
43:閘門閥
50:載入埠
51:搬運容器
52:開閉蓋
60:對準器
61:驅動馬達
62:旋轉平台
63:光學感測器
81~83:突出檢測感測器
81a~84a:投光部
81b~84b:受光部
84:映射感測器
100:控制裝置
101:驅動裝置
102:補助儲存裝置
103:記憶體裝置
104:CPU
105:介面裝置
106:記錄媒體
B:匯流排
P1:基準位置
S1~S2,S11~S13,S131~S136:步驟
W:晶圓
Z1~Z3:Z軸高度
圖1係顯示實施態樣之處理系統之概略構成的圖式。
圖2係顯示載入埠之剖面之一例的圖式。
圖3係顯示對準器之剖面之一例的圖式。
圖4係顯示裝載鎖定模組之剖面之一例的圖式。
圖5係顯示控制裝置之硬體構成之一例的圖式。
圖6係顯示拾取器之概略構成之一例的圖式。
圖7係顯示實施態樣之搬運裝置之教示方法的流程圖。
圖8係顯示第一教示步驟之一例的流程圖。
圖9(a)、(b)係用於說明暫時決定鉛直方向之教示位置之步驟的圖式。
圖10(a)、(b)係用於說明決定水平方向之教示位置之步驟的圖式。
圖11係用於說明決定鉛直方向之教示位置之步驟的流程圖。
圖12係顯示拾取器之高度與吸附壓力之關係的圖式。
圖13(a)~(c)係顯示拾取器與晶圓之位置關係的圖式。
圖14(a)~(e)係用於說明第二教示步驟之一例的圖式。
1:處理系統
10:傳送模組
11:搬運裝置
12:拾取器
20:處理模組
21:載置台
22:閘門閥
30:裝載模組
31:搬運裝置
32:導軌
33:多關節臂部
34:拾取器
35:基座
36:搬入口
37:開閉門
40:裝載鎖定模組
41:平台
42:閘門閥
43:閘門閥
50:載入埠
51:搬運容器
60:對準器
62:旋轉平台
63:光學感測器
100:控制裝置
W:晶圓
Claims (9)
- 一種搬運裝置之教示方法,係具有固持基板之基板固持部及設於該基板固持部之第一檢測部的搬運裝置之教示方法,其包含以下步驟: 一邊使該基板固持部在鉛直方向移動,一邊藉由該第一檢測部檢測檢測物體的高度位置,並基於檢測到的該檢測物體之高度位置,而設定該基板固持部之鉛直方向上之教示位置的步驟;及 一邊使該基板固持部在水平方向移動,一邊基於設在有別於該搬運裝置之位置的第二檢測部檢測該基板固持部時,該基板固持部之水平位置,而設定該基板固持部之水平方向上之教示位置的步驟。
- 如請求項1所述之搬運裝置之教示方法,其中, 該第一檢測部包含: 投光部,對該檢測物體照射偵測光;及 受光部,接收該偵測光; 該基板固持部之鉛直方向上的教示位置,係基於該偵測光受到該檢測物體遮蔽時的該基板固持部之高度位置而設定。
- 如請求項1或2所述之搬運裝置之教示方法,其中, 該第一檢測部係設於該基板固持部的前端部。
- 如請求項1至3中任一項所述之搬運裝置之教示方法,其中, 該檢測物體為基板; 該第一檢測部為檢測該基板之有無的映射感測器。
- 如請求項4所述之搬運裝置之教示方法,其中, 該第二檢測部係檢測該基板相對於收納該基板之搬運容器之突出的突出檢測感測器。
- 如請求項1至5中任一項所述之搬運裝置之教示方法,其中, 該第二檢測部包含: 投光部,對該檢測物體照射偵測光;及 受光部,接收該偵測光; 該基板固持部之水平方向上的教示位置,係基於該基板固持部遮蔽住該第二檢測部之該偵測光時的該基板固持部之水平位置而設定。
- 請求項1至6中任一項所述之搬運裝置之教示方法,更包含以下步驟: 在設定該基板固持部之鉛直方向上的教示位置之步驟後,修正該鉛直方向之教示位置的步驟。
- 如請求項7所述之搬運裝置之教示方法,其中, 該搬運裝置更包含: 抽吸孔,抽吸載置於該基板固持部之頂面的該基板而吸附固持;及 壓力檢測部,檢測與該抽吸孔連通之抽吸路徑的壓力; 修正該鉛直方向之教示位置的步驟包含以下步驟: 使該基板固持部往該基板之下方移動的步驟; 在抽吸該抽吸路徑的狀態下,一邊檢測該抽吸路徑的壓力,一邊使該基板固持部從該基板的下方朝上方移動的步驟; 基於該抽吸路徑的壓力,而判斷該基板固持部是否已與該基板接觸的步驟;及 將判斷為該基板固持部已與該基板接觸時的該基板固持部之位置,作為該基板固持部之鉛直方向上的教示位置而加以修正的步驟。
- 一種處理系統,係具有處理裝置及控制裝置的處理系統; 該處理裝置包含: 搬運裝置,具備固持基板的基板固持部、及設於該基板固持部的第一檢測部;及 第二檢測部,有別於該搬運裝置而設置; 該控制裝置係控制該處理裝置而執行以下步驟: 一邊使該基板固持部在鉛直方向移動,一邊藉由該第一檢測部檢測檢測物體的高度位置,並基於檢測到的該檢測物體之高度位置,而設定該基板固持部之鉛直方向上之教示位置的步驟;及 一邊使該基板固持部在水平方向移動,一邊基於設在有別於該搬運裝置之位置的第二檢測部檢測該基板固持部時,該基板固持部之水平位置,而設定該基板固持部之水平方向上之教示位置的步驟。
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