TW202401639A - 異常偵測方法及搬運裝置 - Google Patents

異常偵測方法及搬運裝置 Download PDF

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TW202401639A
TW202401639A TW112116355A TW112116355A TW202401639A TW 202401639 A TW202401639 A TW 202401639A TW 112116355 A TW112116355 A TW 112116355A TW 112116355 A TW112116355 A TW 112116355A TW 202401639 A TW202401639 A TW 202401639A
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substrate
detected
pressure
substrate holding
arm
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豊巻俊明
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日商東京威力科創股份有限公司
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Abstract

本發明之課題係提供偵測搬運裝置之異常的異常偵測方法及搬運裝置。 本發明係搬運裝置之異常偵測方法，該搬運裝置具備：具有固持基板之基板固持部的臂部；將該臂部升降之升降機構；檢測該基板固持部之位置的位置檢測部；設於該基板固持部之抽吸孔；及檢測與該抽吸孔連通之抽吸道的壓力之壓力檢測部，該異常偵測方法具有下列步驟：控制該臂部，而使該基板固持部移動至載置於載置部之基板的下方；控制該升降機構，而使該臂部及該基板固持部上升；依據以該壓力檢測部檢測出之壓力變化，偵測該基板接觸到該基板固持部；依據該位置檢測部，檢測於檢測出該基板的接觸之際的該基板固持部之位置；依據檢測出之該位置，偵測該搬運裝置之異常狀態。

Description

異常偵測方法及搬運裝置
本揭示係有關於異常偵測方法及搬運裝置。
於專利文獻1揭示有一種基板搬運系統，該基板搬運系統具備：具有第1側壁與在該第1側壁之對側的第2側壁之大氣搬運模組；安裝於該第1側壁之裝載鎖定模組；安裝於該第2側壁之裝載埠；及設於該大氣搬運模組內之基板搬運機器人。 [先前技術文獻] [專利文獻]
[專利文獻1]日本專利公開公報2021-141136號
[發明欲解決之課題]
在一方面，本揭示提供偵測搬運裝置之異常的異常偵測方法及搬運裝置。 [用以解決課題之手段]
為解決上述課題，根據一態樣，可提供一種異常偵測方法，其係搬運裝置之異常偵測方法，該搬運裝置具備：具有固持基板之基板固持部的臂部；將該臂部升降之升降機構；檢測該基板固持部之位置的位置檢測部；設於該基板固持部之抽吸孔；及檢測與該抽吸孔連通之抽吸道的壓力之壓力檢測部，該異常偵測方法具有下列步驟：控制該臂部，而使該基板固持部移動至載置於載置部之基板的下方；控制該升降機構，而使該臂部及該基板固持部上升；依據以該壓力檢測部檢測出之壓力變化，偵測到該基板接觸了該基板固持部；依據該位置檢測部，檢測於檢測出該基板的接觸之際的該基板固持部之位置；依據檢測出之該位置，偵測該搬運裝置之異常狀態。 [發明效果]
根據一方面，可提供偵測搬運裝置之異常的異常偵測方法及搬運裝置。
[用以實施發明之形態]
以下，參照圖式，就各種例示實施形態，詳細地說明。此外，在各圖式，對同一或相當之部分附上同一符號。
[處理系統] 就處理系統1之一例，使用圖1至圖4來說明。圖1係顯示實施形態之處理系統1的概略結構之一例的圖。圖2係顯示對準器60之截面的一例之圖。圖3係顯示裝載鎖定模組40之截面的一例之圖。圖4係顯示控制裝置(控制部)100之硬體結構的一例之圖。
處理系統1具備傳送模組10、處理模組20、裝載模組30、裝載鎖定模組40及控制裝置100。在本實施形態，設有四個處理模組20，且設有二個裝載鎖定模組40，處理模組20及裝載鎖定模組40之數量並不限於此。傳送模組10、處理模組20、裝載模組30、及裝載鎖定模組40構成處理裝置。
傳送模組10俯視下呈大約六角形狀。傳送模組10由真空室構成，且具有配置於內部之搬運裝置11。搬運裝置11以可屈伸、升降及旋繞至可進入處理模組20及裝載鎖定模組40之位置的多關節臂形成。搬運裝置11具有可獨立往相互相反方向屈伸之二個拾取器(亦稱為叉、末端效應器、基板固持部)12，而可一次搬運二片基板W。此外，搬運裝置11只要可在處理模組20與裝載鎖定模組40之間搬運晶圓等基板W即可，並不限於圖1所示之結構。
處理模組20於傳送模組10之周圍配置成放射狀並連接於傳送模組10。處理模組20由處理室構成，且於內部具有載置基板W之圓柱狀載置台21。在處理模組20，對載置於載置台21之基板W實施各種半導體製造程序。半導體製造程序包含例如成膜處理、蝕刻處理、熱處理等用以製造半導體之各種處理。傳送模組10與處理模組20以可開閉之閘閥22分隔。
裝載模組30與傳送模組10成對向配置。裝載模組30為長方體，係維持在大氣壓氣體環境之大氣搬運室。於裝載模組30內配置有搬運裝置31。搬運裝置31可滑動移動地受導軌32支持，該導軌32設置成在裝載模組30內之中心部沿著長邊延伸。於導軌32內置有具有例如編碼器之線性馬達(圖中未示)，藉驅動線性馬達，搬運裝置31可沿著導軌32移動。
搬運裝置31具有上下配置成二段之二個多關節臂33。於各多關節臂33之前端安裝有形成叉狀之拾取器(亦稱為叉、末端效應器、基板固持部)34。可於各拾取器34上固持(載置)基板W。各多關節臂33可從中心往半徑方向屈伸及升降。各多關節臂33之屈伸動作可個別控制。多關節臂33之各旋轉軸分別對基台35連結成可同軸狀地旋轉，而可往對例如基台35之旋繞方向一體地旋轉。導軌32及多關節臂33具有使拾取器34移動之驅動機構的功能。搬運裝置31在後述裝載鎖定模組40、搬運容器51與對準器60之間搬運基板W。此外，搬運裝置31只要可在裝載鎖定模組40、搬運容器51與對準器60之間搬運基板W即可，並不限於圖1所示之結構。
即，搬運裝置31具有藉驅動多關節臂33之各關節而使拾取器34於水平方向移動之臂部驅動機構(圖中未示)、使多關節臂33及拾取器34於上下方向移動之臂部升降機構(升降機構)(圖中未示)。臂部驅動機構(圖中未示)具有驅動多關節臂33之驅動馬達(圖中未示)及編碼器(圖中未示)。控制裝置100被輸入臂部驅動機構之編碼器的檢測信號，而控制臂部驅動機構之驅動馬達。又，臂部升降機構(圖中未示)具有使多關節臂33及拾取器34於上下方向移動之驅動馬達(圖中未示)及編碼器(位置檢測部)35a。控制裝置100被輸入臂部升降機構之編碼器35a的檢測信號，而控制臂部升降機構之驅動馬達。
於裝載模組30之沿著長邊的一側面連接有二個裝載鎖定模組40。另一方面，於裝載模組30之沿著長邊的另一側面設有用以導入基板W之一個或複數個搬入口36。在圖示之例，設有三個搬入口36。於各搬入口36設有可開閉之開閉門37。又，對應各搬入口36而分別設有裝載埠50。於裝載埠50載置用以收納並搬運基板W之搬運容器51。搬運容器51可為具有預定間隔而將複數片(例如二十五片)基板W多段地固持收納之FOUP(Front-Opening Unified Pod：前開式晶圓傳送盒)。搬運容器51具有具開口部而收納基板W之容器本體部、塞住開口部之開閉蓋。於各裝載埠50設有可升降及進退，以將搬運容器51之開閉蓋開閉的開閉門37之驅動機構(圖中未示)。
於裝載模組30之沿著短邊的一側面連接有對準器60。對準器60進行基板W之對位。對準器60具有藉驅動馬達61(圖2)而旋轉之旋轉台62。旋轉台62以頂面載置有基板W之狀態旋轉。旋轉台62具有小於基板W之直徑的直徑。於旋轉台62之外周設有以光學方式檢測基板W之周緣部的光學感測器63。對準器60藉光學感測器63，檢測基板W之中心位置及相對於基板W中心之缺口的方向，進行基板W之對位，俾使在裝載鎖定模組40內，基板W之中心位置與缺口之方向為預定位置與預定方向。
裝載鎖定模組40配置於傳送模組10與裝載模組30之間。裝載鎖定模組40由可將內部在真空與大氣壓之間切換的內壓可變室構成，且內部具有載置基板W之圓柱狀台41。台41具有小於基板W之直徑的直徑。裝載鎖定模組40於將基板W從裝載模組30搬入至傳送模組10之際，將內部維持在大氣壓，而從裝載模組30接受基板W後，將內部減壓而將基板W搬入至傳送模組10。又，於將基板W從傳送模組10搬出至裝載模組30之際，將內部維持真空而從傳送模組10接受基板W後，將內部升壓至大氣壓，而將基板W搬入至裝載模組30。裝載鎖定模組40與傳送模組10以可開閉之閘閥42分隔。又，裝載鎖定模組40與裝載模組30以可開閉之閘閥43分隔。
控制裝置100控制處理系統1之各構成要件的動作。如圖4所示，控制裝置100係具有分別以匯流排B相互連接之驅動裝置101、輔助記憶裝置102、記憶體裝置103、CPU104、介面裝置105等之電腦。實現控制裝置100之處理的程式由CD-ROM等記錄媒體106提供。當將記憶有程式之記錄媒體106設置於驅動裝置101時，可將程式從記錄媒體106透過驅動裝置101而安裝於輔助記憶裝置102。惟，程式之安裝未必需由記錄媒體106進行，亦可透過網路，從其他電腦下載。輔助記憶裝置102儲存安裝之程式、配方等的必要資料。記憶體裝置103於有程式之啟動指示時，從輔助記憶裝置102讀取程式而儲存。CPU104根據儲存於記憶體裝置103之程式，執行有關處理系統1之功能。介面裝置105用作連接於網路用之介面。
[拾取器] 參照圖5，就搬運裝置31之拾取器34的一例作說明。圖5係顯示拾取器34之概略結構的一例之圖。
拾取器34具有基部34a、前端部34b、爪部34c、吸附墊34d及排氣道34e。基部34a安裝於多關節臂33。前端部34b朝拾取器34之前進方向，從基部34a延伸形成大約圓弧狀。爪部34c往被基部34a及前端部34b包圍之區域(以下稱為「晶圓固持區域」)的中心部突出形成。四個爪部34c沿著晶圓固持區域之周向，相互具有間隔而配置。於爪部34c之上部形成有吸附墊34d及抽吸孔34f。吸附墊34d配置成包圍抽吸孔34f。藉基板W之底面的周緣部與吸附墊34d接觸而封住抽吸孔34f，可將基板W吸附固持於爪部34c上。排氣道34e形成於基部34a及前端部34b，而構成抽吸道。排氣道34e之一端連接於各爪部34c之抽吸孔34f，另一端連通於構成連接於拾取器34的抽吸道之排氣管34g內。
於排氣管34g介設有壓力檢測部亦即壓力感測器(壓力檢測部)34h及閥34i。壓力感測器34h檢測排氣管34g內之壓力(以下亦稱為「吸附壓力」)，將對應檢測出之壓力的信號發送至控制裝置100。於排氣管34g之閥34i的下游側連接有排氣裝置34j。排氣裝置34j包含調整器、真空泵等，而一面調整壓力，一面抽吸排氣道34e及排氣管34g內部。將閥34i之開閉控制成在以下的期間開啟：在搬運裝置31從一模組接受基板W前的瞬間，至將基板W載置於另一模組後的瞬間；在上述期間以外之期間則控制成關閉。藉此，從搬運裝置31將固持基板W前的瞬間至放開基板W後的瞬間為止，進行從抽吸孔34f之抽吸。
[異常偵測方法] 接著，就搬運裝置31之異常偵測方法，使用圖6至圖9來說明。圖6係顯示將基板W傳遞至搬運裝置31的拾取器34之際的控制裝置100之處理的一例之流程圖。圖7係顯示圖6的各處理時之拾取器34的狀態之一例的示意圖。圖8係顯示以壓力感測器34h檢測出之吸附壓力的一例之圖表。圖9係顯示以編碼器35a檢測出之拾取器34的高度之一例的圖表。此外，在圖7，以中空箭頭顯示拾取器34之移動。又，在圖8，吸附壓力在以壓力感測器34h檢測出之排氣管34g的壓力係大氣壓之狀態時為0(kPa)，在以壓力感測器34h檢測出之排氣管34g的壓力低於大氣壓時為負(–)，在高於大氣壓時為正(+)。
在此，以將載置於對準器60之旋轉台62的基板W以拾取器34傳遞之動作為例來說明。
在步驟S101，控制裝置100控制多關節臂33，而使拾取器34移動至基板W之下方(參照圖7(a))。如圖7(a)所示，將拾取器34之前端部34b配置於基板W之下方。在此，閥34i關閉，吸附壓力為0(kPa)(參照圖8)。又，拾取器34之高度為高度H1(參照圖9)。
在步驟S102，控制裝置100開始抽吸孔34f之抽吸。即，控制裝置100開啟閥34i，使排氣裝置34j運作，從抽吸孔34f開始抽吸(參照圖7(b))。藉此，如圖8所示，以壓力感測器34h檢測出之吸附壓力為壓力P1。
在步驟S103，控制裝置100開始拾取器34之上升(參照圖7(c))。藉此，如圖9所示，拾取器34從高度H1朝後述高度H2上升。此外，如圖8所示，在吸附墊34d與基板W之背面抵接前的狀態下，吸附壓力為P1。
在步驟S104，控制裝置100判定是否偵測到基板W之吸附(接觸)。當未偵測到基板W之吸附(接觸)時(S104、否)，控制裝置100之處理係重覆步驟S104。當偵測到基板W之吸附(接觸)時(S104、是)，控制裝置100之處理係前進至步驟S105。
在拾取器34上升當中，如圖9所示，拾取器34之高度從高度H1上升至高度H2(後述上升位置)。在此，在圖7(c)所示，吸附墊34d與基板W之背面接觸前的狀態(換言之，吸附基板W前之狀態)下，抽吸孔34f未被塞住，而如圖8所示，以壓力感測器34h檢測出之吸附壓力為壓力P1。另一方面，在圖7(d)所示，吸附墊34d與基板W之背面接觸的狀態(換言之，吸附基板W之狀態)下，抽吸孔34f被基板W塞住，而如圖8所示，以壓力感測器34h檢測出之吸附壓力為壓力P2。控制裝置100於以壓力感測器34h檢測出之吸附壓力為基準壓力Pa(P2＜Pa＜P1)以下時，判定為吸附(接觸)了基板W。
在步驟S105，控制裝置100檢測吸附基板時之拾取器34的位置(高度)。即，控制裝置100於以壓力感測器34h檢測出之吸附壓力為基準壓力Pa以下時(S104、是)，檢測依據編碼器35a之檢測信號算出的拾取器34之位置(高度)作為吸附位置Ha(參照圖9)。又，控制裝置100將檢測出之吸附位置Ha記憶於輔助記憶裝置102。
在步驟S106，控制裝置100判定吸附位置Ha是否在預定之閾值範圍內(在後述圖11，為下限閾值Hb與上限閾值Hc之範圍內)。當吸附位置Ha在預定之閾值範圍內時(S106、是)，控制裝置100之處理係前進至步驟S108。另一方面，當吸附位置Ha不在預定之閾值範圍內時(S106、否)，控制裝置100之處理係前進至步驟S107。在步驟S107，控制裝置100發出警告。然後，控制裝置100之處理係前進至步驟S108。
在步驟S108，控制裝置100判定拾取器34之位置(高度)是否已移動至預定之拾取器上升位置(圖9所示之高度H2)。當未移動至拾取器上升位置時(S108、否)，控制裝置100之處理係重覆步驟S108。當已移動至拾取器上升位置時(S108、是)，控制裝置100之處理則係前進至步驟S109。
在步驟S109，控制裝置100停止拾取器34之上升(參照圖7(e))。
在步驟S110，控制裝置100控制多關節臂33，而使拾取器34移動至裝載模組30內之拾取器待機位置。如圖7(f)所示，從對準器60搬出被真空吸附至拾取器34之基板W。
圖10係固持基板時之拾取器34的樣子之一例。圖11係顯示基板吸附檢出位置之隨時間變化的圖表之一例。在圖11，縱軸顯示檢測出基板W之吸附的位置(基板吸附檢出位置、吸附位置Ha)，橫軸顯示檢測出吸附位置之樣本數，各黑色圓點顯示各個檢測出吸附之位置。
在此，搬運裝置31之拾取器34可裝卸地安裝於多關節臂33。舉例而言，拾取器34以螺栓等固定構件固定於多關節臂33。在此，因搬運裝置31之隨時間變化，螺栓等固定構件產生變形等，而有安裝於多關節臂33之拾取器34的安裝狀態變化之情形。
圖10(a)係顯示拾取器34正常安裝之狀態的一例之側視圖。基板W載置於旋轉台62。旋轉台62之載置部(載置面)的高度位置為一定。在拾取器34正常安裝之狀態下，基板W從旋轉台62傳遞至拾取器34之位置(高度)為一定之位置(高度)。換言之，偵測到基板W的吸附之際的吸附位置Ha在預定之閾值範圍(下限閾值Hb以上、上限閾值Hc以下)。
圖10(b)係顯示拾取器34之安裝產生異常的狀態之一例的側視圖。在此，拾取器34之前端側向下傾斜而安裝於多關節臂33。藉此，將基板W從旋轉台62傳遞至拾取器34之際，以編碼器35a檢測之拾取器34的位置(高度)相較於拾取器34正常安裝之狀態，並不相同。圖10(b)所示，拾取器34之前端側向下傾斜而受多關節臂33所支持時，偵測到基板W的吸附之際的吸附位置Ha相較於拾取器34正常安裝之狀態，為較高之位置。又，雖省略圖示，拾取器34之前端側向上傾斜而受多關節臂33所支持時，偵測到基板W的吸附之際的吸附位置Ha相較於拾取器34正常安裝之狀態，為較低之位置。又，多關節臂33產生下垂或翹曲等異常時亦相同。
如圖6之步驟S106至S107所示，在搬運裝置31之異常偵測方法，控制裝置100依據吸附位置Ha，判定搬運裝置31之狀態。藉此，如圖11所示，在檢測出基板W之吸附的基板吸附檢出位置(吸附位置Ha)顯示於超過預定之閾值範圍(Hb~Hc)的範圍300之狀態下，可偵測到搬運裝置31之狀態發生了異常(例如拾取器34之安裝狀態不良等)。
如以上，根據搬運裝置31之異常偵測方法，可在不追加外部感測器等下，進行搬運裝置31之異常偵測。又，一偵測到異常，便發出警告。藉此，可促進搬運裝置31之維修。是故，藉在拾取器34之安裝狀態發生異常的狀態下，使搬運裝置31運作，可防止拾取器34無預期地與基板W等接觸。又，由於可在將基板W傳遞至拾取器34之動作中，進行搬運裝置31之異常偵測，故可防止生產量之降低。
又，結構亦可為每當將載置於旋轉台62之基板W傳遞至拾取器34，便預先記憶基板W之吸附位置Ha，而依據複數之吸附位置Ha的隨時間變化，進行異常偵測。
又，下限閾值Hb及上限閾值Hc亦可依據過去檢測出之吸附位置Ha而設定。舉例而言，亦可以過去檢測出之吸附位置Ha的平均值為基準，並使其具有預定幅度來設定下限閾值Hb及上限閾值Hc。
此外，在圖6至圖11，說明了將對準器60之旋轉台62作為載置部，而於接受載置於旋轉台62的基板W之際進行處理，但並不限於此。亦可將裝載鎖定模組40之台41作為載置部，而於接受載置於台41的基板W之際進行處理。又，亦可於裝載模組30設置複數之搬運裝置31，並具有「將基板W從其中一搬運裝置31之拾取器34傳遞至另一搬運裝置31的拾取器34之際，暫時載置基板W之載置部」，在此結構，於接受載置於可暫時載置之載置部的基板W之際進行處理。即，亦可於將基板W從載置基板W之載置面高度為一定之載置部傳遞至拾取器34之際，進行圖6所示之處理。
又，說明了步驟S106及步驟S107之處理在拾取器34吸附基板W後，拾取器到達拾取器上升位置(高度H2)前進行，但並不限於此。舉例而言，亦可於拾取器移動至待機位置後進行。
又，說明了當偵測到搬運裝置31之異常偵測時(S106、否)，發出警告，但並不限於此。亦可使搬運裝置31之動作停止。
以上，說明了處理系統1之實施形態等，本揭示並不限於上述實施形態等，在記載於申請專利範圍之本揭示的要旨之範圍內，可進行各種變形、改良。
1:處理系統 10:傳送模組 11:搬運裝置 12:拾取器 20:處理模組 21:載置台 22:閘閥 30:裝載模組 31:搬運裝置 32:導軌 33:多關節臂 34:拾取器(基板固持部) 34a:基部 34b:前端部 34c:爪部 34d:吸附墊 34e:排氣道(抽吸道) 34f:抽吸孔 34g:排氣管(抽吸道) 34h:壓力感測器(壓力檢測部) 34j:排氣裝置 34i:閥 35:基台 35a:編碼器(位置檢測部) 36:搬入口 37:開閉門 40:裝載鎖定模組 41:台(載置部) 42:閘閥 43:閘閥 50:裝載埠 51:搬運容器 60:對準器 61:驅動馬達 62:旋轉台(載置部) 63:光學感測器 100:控制裝置(控制部) 101:驅動裝置 102:輔助記憶裝置 103:記憶體裝置 104:CPU 105:介面裝置 106:記錄媒體 B:匯流排 H1:高度 H2:高度 Ha:吸附位置 Hb:下限閾值 Hc:上限閾值 P1:壓力 P2:壓力 S101:步驟 S102:步驟 S103:步驟 S104:步驟 S105:步驟 S106:步驟 S107:步驟 S108:步驟 S109:步驟 S110:步驟 W:基板
圖1係顯示實施形態之處理系統的概略結構之一例的圖。 圖2係顯示對準器之截面的一例之圖。 圖3係顯示裝載鎖定模組之截面的一例之圖。 圖4係顯示控制裝置之硬體結構的一例之圖。 圖5係顯示拾取器之概略結構的一例之圖。 圖6係顯示將基板W傳遞至搬運裝置的拾取器之際的控制裝置之處理的一例之流程圖。 圖7(a)~(f)係顯示各處理時之拾取器狀態的一例之示意圖。 圖8係顯示以壓力感測器檢測出之吸附壓力的一例之圖表。 圖9係顯示以編碼器檢測出之拾取器的高度之一例的圖表。 圖10(a)~(b)係固持基板時之拾取器的樣子之一例。 圖11係顯示基板吸附檢出位置之隨時間變化的圖表之一例。
34:拾取器(基板固持部)
34b:前端部
34d:吸附墊
62:旋轉台(載置部)
W:基板

Claims (7)

  1. 一種異常偵測方法，係搬運裝置之異常偵測方法，該搬運裝置具備：具有固持基板之基板固持部的臂部；將該臂部升降之升降機構；檢測該基板固持部之位置的位置檢測部；設於該基板固持部之抽吸孔；及檢測與該抽吸孔連通之抽吸道的壓力之壓力檢測部， 該異常偵測方法具有下列步驟： 控制該臂部，而使該基板固持部移動至載置於載置部之基板的下方； 控制該升降機構，而使該臂部及該基板固持部上升； 依據以該壓力檢測部檢測出之壓力變化，偵測到該基板接觸了該基板固持部； 依據該位置檢測部，檢測於檢測出該基板的接觸之際的該基板固持部之位置； 依據檢測出之該位置，偵測該搬運裝置之異常狀態。
  2. 如請求項1之異常偵測方法，其中， 當檢測出之該位置在預定之閾值範圍外時，將該搬運裝置之狀態判定為異常。
  3. 如請求項2之異常偵測方法，其中， 該預定之閾值範圍依據過去檢測出之該位置而設定。
  4. 如請求項1至請求項3中任一項之異常偵測方法，其中， 偵測到該基板接觸了該基板固持部之步驟係當以該壓力檢測部檢測出之壓力為預定之基準壓力以下時，偵測到該基板接觸了該基板固持部。
  5. 如請求項1至請求項3中任一項之異常偵測方法，其中， 該搬運裝置係在大氣壓氣體環境下搬運基板之裝置。
  6. 一種搬運裝置，具備： 臂部，其具有固持基板之基板固持部； 升降機構，其將該臂部升降； 位置檢測部，其檢測該基板固持部之位置； 抽吸孔及抽吸道，其設於該基板固持部； 壓力檢測部，其檢測該抽吸道之壓力；及 控制部； 該控制部構造成： 可控制該臂部，而使該基板固持部可移動至載置於載置部之基板的下方； 可控制該升降機構，而使該臂部及該基板固持部可上升； 可依據以該壓力檢測部檢測出之壓力變化，偵測到該基板接觸了該基板固持部； 可依據該位置檢測部，檢測於檢測出該基板的接觸之際的該基板固持部之位置； 可依據檢測出之該位置，可偵測該搬運裝置之異常狀態。
  7. 如請求項6之搬運裝置，其為在大氣壓氣體環境下搬運基板之裝置。
TW112116355A 2022-05-16 2023-05-03 異常偵測方法及搬運裝置 TW202401639A (zh)

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