CN109476826A - 高性能环氧粘合剂组合物 - Google Patents

高性能环氧粘合剂组合物 Download PDF

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Publication number
CN109476826A
CN109476826A CN201780046267.6A CN201780046267A CN109476826A CN 109476826 A CN109476826 A CN 109476826A CN 201780046267 A CN201780046267 A CN 201780046267A CN 109476826 A CN109476826 A CN 109476826A
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CN
China
Prior art keywords
weight
epoxy
epoxy resin
precursor composition
poidometer
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Pending
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CN201780046267.6A
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English (en)
Chinese (zh)
Inventor
苏海勃·埃尔吉姆阿维
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN109476826A publication Critical patent/CN109476826A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5006—Amines aliphatic
    • C08G59/502—Polyalkylene polyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5026—Amines cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2409/00—Presence of diene rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
CN201780046267.6A 2016-07-28 2017-07-25 高性能环氧粘合剂组合物 Pending CN109476826A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16181797.8 2016-07-28
EP16181797.8A EP3275913B1 (en) 2016-07-28 2016-07-28 High performance epoxy adhesive compositions
PCT/US2017/043622 WO2018022555A1 (en) 2016-07-28 2017-07-25 High performance epoxy adhesive compositions

Publications (1)

Publication Number Publication Date
CN109476826A true CN109476826A (zh) 2019-03-15

Family

ID=56557555

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780046267.6A Pending CN109476826A (zh) 2016-07-28 2017-07-25 高性能环氧粘合剂组合物

Country Status (8)

Country Link
US (1) US20190382634A1 (enExample)
EP (1) EP3275913B1 (enExample)
JP (1) JP2019527282A (enExample)
KR (1) KR20190033586A (enExample)
CN (1) CN109476826A (enExample)
BR (1) BR112019001649A2 (enExample)
CA (1) CA3031773A1 (enExample)
WO (1) WO2018022555A1 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113403013A (zh) * 2021-06-30 2021-09-17 武汉市三选科技有限公司 半导体封装用底部填充胶及芯片倒装的半导体封装结构
CN113614188A (zh) * 2019-04-02 2021-11-05 3M创新有限公司 结构粘合剂组合物的可固化前体
CN113614187A (zh) * 2019-04-02 2021-11-05 3M创新有限公司 制造结构粘合剂组合物的可固化前体的方法
CN114616303A (zh) * 2019-11-01 2022-06-10 塞特工业公司 用于粘合性粘结的底漆组合物及使用其的方法
CN114829445A (zh) * 2019-12-19 2022-07-29 3M创新有限公司 填隙粘合剂
CN115427477A (zh) * 2020-04-28 2022-12-02 3M创新有限公司 可固化组合物
CN115746259A (zh) * 2022-11-14 2023-03-07 北京高盟新材料股份有限公司 一种低热膨胀系数透明光固化改性树脂及制备方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
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CN109536102A (zh) * 2018-12-06 2019-03-29 中国建材检验认证集团厦门宏业有限公司 一种高密度水下环氧修补胶及其制备方法和用途
JP6651045B1 (ja) * 2019-09-30 2020-02-19 アイカ工業株式会社 エポキシ樹脂組成物
EP3882294A1 (de) * 2020-03-18 2021-09-22 Hilti Aktiengesellschaft Härterzusammensetzung auf basis von diaminomethylcyclohexan und 1,3-cyclo-hexan-bis(methylamin) für eine epoxidharzmasse, epoxidharzmasse und mehrkomponenten-epoxidharzsystem
US20230250222A1 (en) * 2020-07-02 2023-08-10 Socpra Sciences Et Génie S.E.C. Catalysts for crosslinking epoxy resins
EP4257339A4 (en) * 2020-12-04 2024-05-15 Mitsubishi Gas Chemical Company, Inc. METHOD FOR PRODUCING A MOLDED ARTICLE, RESIN IMPREGNATION DEVICE AND 3D PRINTER
EP4015559B1 (en) * 2020-12-21 2023-07-19 3M Innovative Properties Company Structural adhesive having superior compression properties
CN113372535A (zh) * 2021-05-31 2021-09-10 张家港衡业特种树脂有限公司 一种改性环氧树脂固化剂的制备方法及使用方法
KR102636434B1 (ko) * 2021-09-29 2024-02-14 주식회사 테라온 전력 반도체 패키지용 칩 본딩 조성물
CN114835882A (zh) * 2022-04-25 2022-08-02 四川星利石大涂装材料有限公司 一种低温固化环氧潜伏型固化剂的制备方法与应用
KR102754954B1 (ko) * 2022-10-14 2025-01-14 주식회사 테라온 전력 반도체 패키지용 칩 본딩 조성물
EP4442727A1 (en) * 2023-04-06 2024-10-09 3M Innovative Properties Company Epoxy resin compositions comprising a lewis acid

Citations (3)

* Cited by examiner, † Cited by third party
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US20090048422A1 (en) * 2007-08-14 2009-02-19 Swancor Industrial Co., Ltd. Resin composition for composite material parts
CN102333819A (zh) * 2009-02-25 2012-01-25 3M创新有限公司 在宽温度范围内具有高机械强度的环氧树脂粘合剂组合物
CN105567145A (zh) * 2016-03-15 2016-05-11 南京诺邦新材料有限公司 双组份结构胶及其制备方法

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DE69111576T2 (de) * 1990-11-29 1996-02-01 Ciba Geigy Ag Hochleistungsepoxydharzklebstoff.
JP2002265922A (ja) * 2001-03-08 2002-09-18 Konishi Co Ltd 自動車ガラス用接着剤
JP2003238929A (ja) * 2002-02-15 2003-08-27 Mitsubishi Electric Corp エポキシ系接着剤及びそれを用いた飛翔体用レドーム
JP4639766B2 (ja) * 2004-11-16 2011-02-23 横浜ゴム株式会社 二液型常温硬化性エポキシ樹脂組成物および金属接着剤組成物
EP2181156A1 (en) * 2007-08-17 2010-05-05 Dow Global Technologies Inc. Two part crash durable epoxy adhesives
CN101818037B (zh) 2009-02-27 2014-12-31 汉高（中国）投资有限公司 一种室温固化环氧结构胶粘剂组合物及其制备方法
CN102482548B (zh) * 2009-09-11 2014-03-12 3M创新有限公司 固化性和固化的粘合剂组合物
JP5478472B2 (ja) * 2010-12-07 2014-04-23 日本発條株式会社 ブッシュ・ブラケット一体スタビライザーバー
KR20170127472A (ko) * 2015-02-27 2017-11-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 이액형 구조용 접착제

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090048422A1 (en) * 2007-08-14 2009-02-19 Swancor Industrial Co., Ltd. Resin composition for composite material parts
CN102333819A (zh) * 2009-02-25 2012-01-25 3M创新有限公司 在宽温度范围内具有高机械强度的环氧树脂粘合剂组合物
CN105567145A (zh) * 2016-03-15 2016-05-11 南京诺邦新材料有限公司 双组份结构胶及其制备方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113614188A (zh) * 2019-04-02 2021-11-05 3M创新有限公司 结构粘合剂组合物的可固化前体
CN113614187A (zh) * 2019-04-02 2021-11-05 3M创新有限公司 制造结构粘合剂组合物的可固化前体的方法
CN113614187B (zh) * 2019-04-02 2022-09-16 3M创新有限公司 制造结构粘合剂组合物的可固化前体的方法
CN113614188B (zh) * 2019-04-02 2023-04-14 3M创新有限公司 结构粘合剂组合物的可固化前体
CN114616303A (zh) * 2019-11-01 2022-06-10 塞特工业公司 用于粘合性粘结的底漆组合物及使用其的方法
CN114829445A (zh) * 2019-12-19 2022-07-29 3M创新有限公司 填隙粘合剂
CN114829445B (zh) * 2019-12-19 2025-06-10 3M创新有限公司 填隙粘合剂
CN115427477A (zh) * 2020-04-28 2022-12-02 3M创新有限公司 可固化组合物
CN115427477B (zh) * 2020-04-28 2024-09-24 3M创新有限公司 可固化组合物
CN113403013A (zh) * 2021-06-30 2021-09-17 武汉市三选科技有限公司 半导体封装用底部填充胶及芯片倒装的半导体封装结构
CN113403013B (zh) * 2021-06-30 2022-09-02 武汉市三选科技有限公司 半导体封装用底部填充胶及芯片倒装的半导体封装结构
CN115746259A (zh) * 2022-11-14 2023-03-07 北京高盟新材料股份有限公司 一种低热膨胀系数透明光固化改性树脂及制备方法

Also Published As

Publication number Publication date
EP3275913B1 (en) 2021-11-10
WO2018022555A1 (en) 2018-02-01
US20190382634A1 (en) 2019-12-19
BR112019001649A2 (pt) 2019-05-07
CA3031773A1 (en) 2018-02-01
EP3275913A1 (en) 2018-01-31
KR20190033586A (ko) 2019-03-29
JP2019527282A (ja) 2019-09-26

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Application publication date: 20190315