KR20190033586A - 고성능 에폭시 접착제 조성물 - Google Patents

고성능 에폭시 접착제 조성물 Download PDF

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Publication number
KR20190033586A
KR20190033586A KR1020197005537A KR20197005537A KR20190033586A KR 20190033586 A KR20190033586 A KR 20190033586A KR 1020197005537 A KR1020197005537 A KR 1020197005537A KR 20197005537 A KR20197005537 A KR 20197005537A KR 20190033586 A KR20190033586 A KR 20190033586A
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KR
South Korea
Prior art keywords
epoxy
weight
epoxy resin
curing agent
precursor composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
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KR1020197005537A
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English (en)
Korean (ko)
Inventor
소하이브 엘지미아비
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20190033586A publication Critical patent/KR20190033586A/ko
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5006—Amines aliphatic
    • C08G59/502—Polyalkylene polyamines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5026—Amines cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2409/00—Presence of diene rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
KR1020197005537A 2016-07-28 2017-07-25 고성능 에폭시 접착제 조성물 Withdrawn KR20190033586A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16181797.8 2016-07-28
EP16181797.8A EP3275913B1 (en) 2016-07-28 2016-07-28 High performance epoxy adhesive compositions
PCT/US2017/043622 WO2018022555A1 (en) 2016-07-28 2017-07-25 High performance epoxy adhesive compositions

Publications (1)

Publication Number Publication Date
KR20190033586A true KR20190033586A (ko) 2019-03-29

Family

ID=56557555

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197005537A Withdrawn KR20190033586A (ko) 2016-07-28 2017-07-25 고성능 에폭시 접착제 조성물

Country Status (8)

Country Link
US (1) US20190382634A1 (enExample)
EP (1) EP3275913B1 (enExample)
JP (1) JP2019527282A (enExample)
KR (1) KR20190033586A (enExample)
CN (1) CN109476826A (enExample)
BR (1) BR112019001649A2 (enExample)
CA (1) CA3031773A1 (enExample)
WO (1) WO2018022555A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023054945A1 (ko) * 2021-09-29 2023-04-06 주식회사 테라온 전력 반도체 패키지용 칩 본딩 조성물
KR20240052208A (ko) * 2022-10-14 2024-04-23 주식회사 테라온 전력 반도체 패키지용 칩 본딩 조성물

Families Citing this family (16)

* Cited by examiner, † Cited by third party
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CN109536102A (zh) * 2018-12-06 2019-03-29 中国建材检验认证集团厦门宏业有限公司 一种高密度水下环氧修补胶及其制备方法和用途
EP3719089B1 (en) 2019-04-02 2024-07-31 3M Innovative Properties Company Process of manufacturing a curable precursor of a structural adhesive composition
EP3719088B1 (en) * 2019-04-02 2024-09-04 3M Innovative Properties Company Curable precursor of a structural adhesive composition
JP6651045B1 (ja) * 2019-09-30 2020-02-19 アイカ工業株式会社 エポキシ樹脂組成物
CN114616303A (zh) * 2019-11-01 2022-06-10 塞特工业公司 用于粘合性粘结的底漆组合物及使用其的方法
US12486437B2 (en) 2019-12-19 2025-12-02 3M Innovative Properties Company Shimming adhesive
EP3882294A1 (de) 2020-03-18 2021-09-22 Hilti Aktiengesellschaft Härterzusammensetzung auf basis von diaminomethylcyclohexan und 1,3-cyclo-hexan-bis(methylamin) für eine epoxidharzmasse, epoxidharzmasse und mehrkomponenten-epoxidharzsystem
JP2023524676A (ja) * 2020-04-28 2023-06-13 スリーエム イノベイティブ プロパティズ カンパニー 硬化性組成物
WO2022000088A1 (en) * 2020-07-02 2022-01-06 Socpra Sciences Et Génie S.E.C. Catalysts for crosslinking epoxy resins
JPWO2022118581A1 (enExample) * 2020-12-04 2022-06-09
EP4015559B1 (en) * 2020-12-21 2023-07-19 3M Innovative Properties Company Structural adhesive having superior compression properties
CN113372535A (zh) * 2021-05-31 2021-09-10 张家港衡业特种树脂有限公司 一种改性环氧树脂固化剂的制备方法及使用方法
CN113403013B (zh) * 2021-06-30 2022-09-02 武汉市三选科技有限公司 半导体封装用底部填充胶及芯片倒装的半导体封装结构
CN114835882A (zh) * 2022-04-25 2022-08-02 四川星利石大涂装材料有限公司 一种低温固化环氧潜伏型固化剂的制备方法与应用
CN115746259B (zh) * 2022-11-14 2025-03-28 北京高盟新材料股份有限公司 一种低热膨胀系数透明光固化改性树脂及制备方法
EP4442727A1 (en) * 2023-04-06 2024-10-09 3M Innovative Properties Company Epoxy resin compositions comprising a lewis acid

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EP0488949B1 (en) * 1990-11-29 1995-07-26 Ciba-Geigy Ag High performance epoxy adhesive
JP2002265922A (ja) * 2001-03-08 2002-09-18 Konishi Co Ltd 自動車ガラス用接着剤
JP2003238929A (ja) * 2002-02-15 2003-08-27 Mitsubishi Electric Corp エポキシ系接着剤及びそれを用いた飛翔体用レドーム
JP4639766B2 (ja) * 2004-11-16 2011-02-23 横浜ゴム株式会社 二液型常温硬化性エポキシ樹脂組成物および金属接着剤組成物
US20090048422A1 (en) * 2007-08-14 2009-02-19 Swancor Industrial Co., Ltd. Resin composition for composite material parts
KR20100055478A (ko) * 2007-08-17 2010-05-26 다우 글로벌 테크놀로지스 인크. 2부분 충돌 내구성 에폭시 접착제
EP2223966B1 (en) * 2009-02-25 2017-08-16 3M Innovative Properties Company Epoxy adhesive compositions with high mechanical strength over a wide temperature range
CN101818037B (zh) 2009-02-27 2014-12-31 汉高（中国）投资有限公司 一种室温固化环氧结构胶粘剂组合物及其制备方法
CN102482548B (zh) * 2009-09-11 2014-03-12 3M创新有限公司 固化性和固化的粘合剂组合物
JP5478472B2 (ja) * 2010-12-07 2014-04-23 日本発條株式会社 ブッシュ・ブラケット一体スタビライザーバー
CN107406575B (zh) * 2015-02-27 2020-01-14 3M创新有限公司 两部分结构化粘合剂
CN105567145B (zh) * 2016-03-15 2020-03-06 南京诺邦新材料有限公司 双组份结构胶及其制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023054945A1 (ko) * 2021-09-29 2023-04-06 주식회사 테라온 전력 반도체 패키지용 칩 본딩 조성물
KR20240052208A (ko) * 2022-10-14 2024-04-23 주식회사 테라온 전력 반도체 패키지용 칩 본딩 조성물

Also Published As

Publication number Publication date
EP3275913A1 (en) 2018-01-31
EP3275913B1 (en) 2021-11-10
CN109476826A (zh) 2019-03-15
CA3031773A1 (en) 2018-02-01
WO2018022555A1 (en) 2018-02-01
US20190382634A1 (en) 2019-12-19
BR112019001649A2 (pt) 2019-05-07
JP2019527282A (ja) 2019-09-26

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Date Code Title Description
PA0105 International application

Patent event date: 20190225

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination