BR112019001649A2 - composições adesivas de epóxi de alto desempenho - Google Patents

composições adesivas de epóxi de alto desempenho

Info

Publication number
BR112019001649A2
BR112019001649A2 BR112019001649-0A BR112019001649A BR112019001649A2 BR 112019001649 A2 BR112019001649 A2 BR 112019001649A2 BR 112019001649 A BR112019001649 A BR 112019001649A BR 112019001649 A2 BR112019001649 A2 BR 112019001649A2
Authority
BR
Brazil
Prior art keywords
epoxy resin
epoxy
present disclosure
curing agent
amine
Prior art date
Application number
BR112019001649-0A
Other languages
English (en)
Portuguese (pt)
Inventor
Elgimiabi Sohaib
Original Assignee
3M Innovative Properties Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Company filed Critical 3M Innovative Properties Company
Publication of BR112019001649A2 publication Critical patent/BR112019001649A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5006—Amines aliphatic
    • C08G59/502—Polyalkylene polyamines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5026—Amines cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2409/00—Presence of diene rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
BR112019001649-0A 2016-07-28 2017-07-25 composições adesivas de epóxi de alto desempenho BR112019001649A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16181797.8 2016-07-28
EP16181797.8A EP3275913B1 (en) 2016-07-28 2016-07-28 High performance epoxy adhesive compositions
PCT/US2017/043622 WO2018022555A1 (en) 2016-07-28 2017-07-25 High performance epoxy adhesive compositions

Publications (1)

Publication Number Publication Date
BR112019001649A2 true BR112019001649A2 (pt) 2019-05-07

Family

ID=56557555

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112019001649-0A BR112019001649A2 (pt) 2016-07-28 2017-07-25 composições adesivas de epóxi de alto desempenho

Country Status (8)

Country Link
US (1) US20190382634A1 (enExample)
EP (1) EP3275913B1 (enExample)
JP (1) JP2019527282A (enExample)
KR (1) KR20190033586A (enExample)
CN (1) CN109476826A (enExample)
BR (1) BR112019001649A2 (enExample)
CA (1) CA3031773A1 (enExample)
WO (1) WO2018022555A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109536102A (zh) * 2018-12-06 2019-03-29 中国建材检验认证集团厦门宏业有限公司 一种高密度水下环氧修补胶及其制备方法和用途
EP3719088B1 (en) * 2019-04-02 2024-09-04 3M Innovative Properties Company Curable precursor of a structural adhesive composition
EP3719089B1 (en) * 2019-04-02 2024-07-31 3M Innovative Properties Company Process of manufacturing a curable precursor of a structural adhesive composition
JP6651045B1 (ja) * 2019-09-30 2020-02-19 アイカ工業株式会社 エポキシ樹脂組成物
BR112022007500A2 (pt) * 2019-11-01 2022-07-12 Cytec Ind Inc Composição iniciadora para ligação adesiva e método de uso da mesma
WO2021124049A1 (en) 2019-12-19 2021-06-24 3M Innovative Properties Company Shimming adhesive
EP3882294A1 (de) * 2020-03-18 2021-09-22 Hilti Aktiengesellschaft Härterzusammensetzung auf basis von diaminomethylcyclohexan und 1,3-cyclo-hexan-bis(methylamin) für eine epoxidharzmasse, epoxidharzmasse und mehrkomponenten-epoxidharzsystem
US11958938B2 (en) 2020-04-28 2024-04-16 3M Innovative Properties Company Curable composition
US20230250222A1 (en) * 2020-07-02 2023-08-10 Socpra Sciences Et Génie S.E.C. Catalysts for crosslinking epoxy resins
EP4257339A4 (en) * 2020-12-04 2024-05-15 Mitsubishi Gas Chemical Company, Inc. METHOD FOR PRODUCING A MOLDED ARTICLE, RESIN IMPREGNATION DEVICE AND 3D PRINTER
EP4015559B1 (en) * 2020-12-21 2023-07-19 3M Innovative Properties Company Structural adhesive having superior compression properties
CN113372535A (zh) * 2021-05-31 2021-09-10 张家港衡业特种树脂有限公司 一种改性环氧树脂固化剂的制备方法及使用方法
CN113403013B (zh) * 2021-06-30 2022-09-02 武汉市三选科技有限公司 半导体封装用底部填充胶及芯片倒装的半导体封装结构
KR102636434B1 (ko) * 2021-09-29 2024-02-14 주식회사 테라온 전력 반도체 패키지용 칩 본딩 조성물
CN114835882A (zh) * 2022-04-25 2022-08-02 四川星利石大涂装材料有限公司 一种低温固化环氧潜伏型固化剂的制备方法与应用
KR102754954B1 (ko) * 2022-10-14 2025-01-14 주식회사 테라온 전력 반도체 패키지용 칩 본딩 조성물
CN115746259B (zh) * 2022-11-14 2025-03-28 北京高盟新材料股份有限公司 一种低热膨胀系数透明光固化改性树脂及制备方法
EP4442727A1 (en) * 2023-04-06 2024-10-09 3M Innovative Properties Company Epoxy resin compositions comprising a lewis acid

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69111576T2 (de) * 1990-11-29 1996-02-01 Ciba Geigy Ag Hochleistungsepoxydharzklebstoff.
JP2002265922A (ja) * 2001-03-08 2002-09-18 Konishi Co Ltd 自動車ガラス用接着剤
JP2003238929A (ja) * 2002-02-15 2003-08-27 Mitsubishi Electric Corp エポキシ系接着剤及びそれを用いた飛翔体用レドーム
JP4639766B2 (ja) * 2004-11-16 2011-02-23 横浜ゴム株式会社 二液型常温硬化性エポキシ樹脂組成物および金属接着剤組成物
US20090048422A1 (en) * 2007-08-14 2009-02-19 Swancor Industrial Co., Ltd. Resin composition for composite material parts
EP2181156A1 (en) * 2007-08-17 2010-05-05 Dow Global Technologies Inc. Two part crash durable epoxy adhesives
EP2223966B1 (en) * 2009-02-25 2017-08-16 3M Innovative Properties Company Epoxy adhesive compositions with high mechanical strength over a wide temperature range
CN101818037B (zh) 2009-02-27 2014-12-31 汉高（中国）投资有限公司 一种室温固化环氧结构胶粘剂组合物及其制备方法
CN102482548B (zh) * 2009-09-11 2014-03-12 3M创新有限公司 固化性和固化的粘合剂组合物
JP5478472B2 (ja) * 2010-12-07 2014-04-23 日本発條株式会社 ブッシュ・ブラケット一体スタビライザーバー
KR20170127472A (ko) * 2015-02-27 2017-11-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 이액형 구조용 접착제
CN105567145B (zh) * 2016-03-15 2020-03-06 南京诺邦新材料有限公司 双组份结构胶及其制备方法

Also Published As

Publication number Publication date
EP3275913B1 (en) 2021-11-10
WO2018022555A1 (en) 2018-02-01
US20190382634A1 (en) 2019-12-19
CN109476826A (zh) 2019-03-15
CA3031773A1 (en) 2018-02-01
EP3275913A1 (en) 2018-01-31
KR20190033586A (ko) 2019-03-29
JP2019527282A (ja) 2019-09-26

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]