BR112023026586A2 - Composição adesiva para laminação de chapa de aço eletromagnética - Google Patents

Composição adesiva para laminação de chapa de aço eletromagnética

Info

Publication number
BR112023026586A2
BR112023026586A2 BR112023026586A BR112023026586A BR112023026586A2 BR 112023026586 A2 BR112023026586 A2 BR 112023026586A2 BR 112023026586 A BR112023026586 A BR 112023026586A BR 112023026586 A BR112023026586 A BR 112023026586A BR 112023026586 A2 BR112023026586 A2 BR 112023026586A2
Authority
BR
Brazil
Prior art keywords
steel sheet
electromagnetic steel
epoxy resin
adhesive composition
adhesive
Prior art date
Application number
BR112023026586A
Other languages
English (en)
Inventor
Aramaki Takashi
Ishikawa Kazunori
Ito Tsubasa
Oishi Hiroshi
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Publication of BR112023026586A2 publication Critical patent/BR112023026586A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3227—Compounds containing acyclic nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • C08G65/2603—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen
    • C08G65/2606—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups
    • C08G65/2612—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups containing aromatic or arylaliphatic hydroxyl groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

composição adesiva para laminação de chapa de aço eletromagnética. o objetivo da presente invenção é fornecer uma composição adesiva para laminar uma chapa de aço eletromagnética, que possua excelentes propriedades de ausência de pegajosidade antes da preparação de uma chapa de aço eletromagnética laminada, tenha excelente desempenho adesivo mesmo após armazenamento a longo prazo e forneça um produto curado com adesivo com excelente tenacidade em uma ampla faixa de temperatura. a presente invenção é uma composição adesiva para laminação de uma chapa de aço eletromagnética, incluindo uma resina epóxi (aa) contendo uma resina epóxi (a) tendo igual ou mais que 3 grupos epóxi em uma molécula, uma resina fenóxi (b) tendo uma temperatura vítrea de transição superior a 120 °c em um estado não curado em calorimetria diferencial de varredura, e um agente de cura latente à base de amina (c), em que a resina epóxi (a) contém uma resina epóxi com uma temperatura de amolecimento igual ou superior a 60 °c, um teor da resina fenóxi (b) é de 20 a 80 partes em massa com base em 100 partes em massa da resina epóxi (aa), e uma temperatura de transição vítrea do produto curado com adesivo resultante em calorimetria de varredura diferencial excede 160 °c.
BR112023026586A 2021-06-21 2022-04-28 Composição adesiva para laminação de chapa de aço eletromagnética BR112023026586A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021102360 2021-06-21
PCT/JP2022/019251 WO2022270154A1 (ja) 2021-06-21 2022-04-28 電磁鋼板積層用接着剤組成物

Publications (1)

Publication Number Publication Date
BR112023026586A2 true BR112023026586A2 (pt) 2024-03-05

Family

ID=84545648

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112023026586A BR112023026586A2 (pt) 2021-06-21 2022-04-28 Composição adesiva para laminação de chapa de aço eletromagnética

Country Status (8)

Country Link
EP (1) EP4361230A1 (pt)
JP (1) JPWO2022270154A1 (pt)
KR (1) KR20240017060A (pt)
CN (1) CN117580925A (pt)
BR (1) BR112023026586A2 (pt)
CA (1) CA3222811A1 (pt)
TW (1) TWI824572B (pt)
WO (1) WO2022270154A1 (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024024835A1 (ja) * 2022-07-26 2024-02-01 日本製鉄株式会社 接着樹脂組成物被覆電磁鋼板およびその製造方法
WO2024024834A1 (ja) * 2022-07-26 2024-02-01 日本製鉄株式会社 接着樹脂組成物被覆電磁鋼板およびその製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48100602A (pt) * 1972-04-05 1973-12-19
JP4581228B2 (ja) 2000-11-14 2010-11-17 Ｊｆｅスチール株式会社 加工性に優れる積層電磁鋼板
JP4118096B2 (ja) 2002-07-10 2008-07-16 三井化学株式会社 電気自動車用、電動機または発電機用積層板及び、電動機または発電機
US20070116961A1 (en) * 2005-11-23 2007-05-24 3M Innovative Properties Company Anisotropic conductive adhesive compositions
JP5761639B2 (ja) * 2010-09-30 2015-08-12 日本発條株式会社 接着剤樹脂組成物、その硬化物、及び接着剤フィルム
JP6134497B2 (ja) * 2012-11-08 2017-05-24 京セラ株式会社 積層コアの製造方法
KR101561280B1 (ko) 2013-11-27 2015-10-16 주식회사 포스코 무방향성 전기 강판 코팅 조성물, 무방향성 전기 강판 제품의 제조 방법 및 무방향성 전기 강판 제품
JP2016039042A (ja) * 2014-08-08 2016-03-22 株式会社日立製作所 絶縁電線、回転電機及び絶縁電線の製造方法
WO2017094789A1 (ja) * 2015-12-04 2017-06-08 古河電気工業株式会社 自己融着性絶縁電線、コイル及び電気・電子機器
CN109651988A (zh) * 2018-12-21 2019-04-19 苏州赛伍应用技术股份有限公司 一种粘合剂和包含其的绝缘补强胶带
JP2020171171A (ja) 2019-04-05 2020-10-15 デュポン帝人アドバンスドペーパー株式会社 環状積層コア材、及び、環状積層コア材の製造方法
JP2021102360A (ja) 2019-12-24 2021-07-15 トヨタ自動車株式会社 ハイブリッド車両の制御装置

Also Published As

Publication number Publication date
JPWO2022270154A1 (pt) 2022-12-29
KR20240017060A (ko) 2024-02-06
TWI824572B (zh) 2023-12-01
WO2022270154A1 (ja) 2022-12-29
CA3222811A1 (en) 2022-12-29
EP4361230A1 (en) 2024-05-01
CN117580925A (zh) 2024-02-20
TW202309232A (zh) 2023-03-01

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