BR112022007500A2 - Composição iniciadora para ligação adesiva e método de uso da mesma - Google Patents
Composição iniciadora para ligação adesiva e método de uso da mesmaInfo
- Publication number
- BR112022007500A2 BR112022007500A2 BR112022007500A BR112022007500A BR112022007500A2 BR 112022007500 A2 BR112022007500 A2 BR 112022007500A2 BR 112022007500 A BR112022007500 A BR 112022007500A BR 112022007500 A BR112022007500 A BR 112022007500A BR 112022007500 A2 BR112022007500 A2 BR 112022007500A2
- Authority
- BR
- Brazil
- Prior art keywords
- initiator composition
- solvent
- adhesive bond
- metal surface
- bonding
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/166—Metal in the pretreated surface to be joined
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
- C09J2463/003—Presence of epoxy resin in the primer coating
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
COMPOSIÇÃO INICIADORA PARA LIGAÇÃO ADESIVA E MÉTODO DE USO DA MESMA. A presente invenção refere-se a uma composição iniciadora de ligação à base de solvente contendo um ou mais solventes orgânicos, uma ou mais resinas epóxi, um ou mais agentes de cura, um composto de silano e uma baixa quantidade de partículas de borracha de núcleo-casca em tamanho nanométrico, submícrom ou tamanho mícron. Também é divulgado um método de aplicação da composição iniciadora de ligação à base de solvente em uma superfície metálica de um primeiro substrato antes de ligar a superfície metálica a um segundo substrato por meio de um adesivo curável.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962929536P | 2019-11-01 | 2019-11-01 | |
PCT/US2020/058177 WO2021087238A1 (en) | 2019-11-01 | 2020-10-30 | Primer composition for adhesive bonding and method of using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112022007500A2 true BR112022007500A2 (pt) | 2022-07-12 |
Family
ID=73544369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112022007500A BR112022007500A2 (pt) | 2019-11-01 | 2020-10-30 | Composição iniciadora para ligação adesiva e método de uso da mesma |
Country Status (6)
Country | Link |
---|---|
US (1) | US20230313001A1 (pt) |
EP (1) | EP4051744A1 (pt) |
JP (1) | JP2023500616A (pt) |
CN (1) | CN114616303A (pt) |
BR (1) | BR112022007500A2 (pt) |
WO (1) | WO2021087238A1 (pt) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3655646B2 (ja) | 1993-05-24 | 2005-06-02 | 日産自動車株式会社 | エポキシ樹脂用接着補強剤及び該補強剤を含有する自動車用エポキシ樹脂系構造接着性組成物 |
WO2007041133A2 (en) * | 2005-10-03 | 2007-04-12 | Lake Randall T | Radiation curable coating composition and method |
CA2757078C (en) | 2009-03-31 | 2016-08-30 | Cytec Technology Corp. | Water based non-chromated primers for structural bonding applications |
KR20120044969A (ko) * | 2009-07-10 | 2012-05-08 | 다우 글로벌 테크놀로지스 엘엘씨 | 전기 라미네이트 조성물에 사용하기 위한 코어/쉘 고무 |
GB201005444D0 (en) * | 2010-03-31 | 2010-05-19 | 3M Innovative Properties Co | Epoxy adhesive compositions comprising an adhesion promoter |
CA2812018C (en) * | 2010-09-13 | 2014-06-03 | Sumitomo Metal Mining Co., Ltd. | Primer composition |
WO2015132372A1 (de) * | 2014-03-07 | 2015-09-11 | Henkel Ag & Co. Kgaa | Photohärtbare epoxidharzsysteme |
WO2017166188A1 (en) * | 2016-03-31 | 2017-10-05 | Henkel Ag & Co. Kgaa | A latent curing accelerator composition and a one-part curable adhesive composition comprising the same |
EP3275913B1 (en) * | 2016-07-28 | 2021-11-10 | 3M Innovative Properties Company | High performance epoxy adhesive compositions |
WO2019135857A1 (en) * | 2018-01-08 | 2019-07-11 | Dow Global Technologies Llc | Epoxy resin adhesive compositions |
WO2020003122A1 (en) * | 2018-06-27 | 2020-01-02 | 3M Innovative Properties Company | Curable compositions and related methods |
EP3924535A1 (en) * | 2019-02-11 | 2021-12-22 | PPG Industries Ohio Inc. | Systems for treating a metal substrate |
-
2020
- 2020-10-30 WO PCT/US2020/058177 patent/WO2021087238A1/en unknown
- 2020-10-30 US US17/772,436 patent/US20230313001A1/en active Pending
- 2020-10-30 EP EP20811889.3A patent/EP4051744A1/en active Pending
- 2020-10-30 CN CN202080076128.XA patent/CN114616303A/zh active Pending
- 2020-10-30 BR BR112022007500A patent/BR112022007500A2/pt unknown
- 2020-10-30 JP JP2022524188A patent/JP2023500616A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2023500616A (ja) | 2023-01-10 |
CN114616303A (zh) | 2022-06-10 |
WO2021087238A1 (en) | 2021-05-06 |
US20230313001A1 (en) | 2023-10-05 |
EP4051744A1 (en) | 2022-09-07 |
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