CN1092399C - 半导体装置的制造方法 - Google Patents

半导体装置的制造方法 Download PDF

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CN1092399C
CN1092399C CN97110389A CN97110389A CN1092399C CN 1092399 C CN1092399 C CN 1092399C CN 97110389 A CN97110389 A CN 97110389A CN 97110389 A CN97110389 A CN 97110389A CN 1092399 C CN1092399 C CN 1092399C
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佐藤寿巳江
大森纯
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Abstract

本发明揭示了一种半导体装置的制造方法，包括将对应于树脂封止部开有多个孔的粘合剂片(1)粘到芯片接连排列的基板(4)上，然后一起冲切基板(4)与粘合剂片(1)。本发明解决了已有粘合方法中，从粘合剂片中切出粘合剂，然后贴到从树脂封装的半导体芯片基板上切出的单体半导体模块上，粘合半导体模块与支承基板的方法中由于粘合剂又小又薄造成的操作困难和难于位置对准、作业费时等问题。

Description

半导体装置的制造方法
本发明涉及半导体装置的制造方法，特别是有关模块与支持它的基板的粘合方法。
近年来，IC卡等卡型存储装置正在实用化。在这种IC卡中，正在开发含有存储器的卡型模块可能装卸在IC卡上的IC卡，图4示出这种卡型模块的一例。
图5与图6示出用于卡型模块中的半导体模块。图5(a)是半导体模块的树脂封装面的立体图，图5(b)是半导体模块的外部连接用端子面的立体图。图6是模块的剖视图。在这种半导体模块中，半导体芯片25装在基板的一个面上，半导体芯片25的焊接点与基板13的芯片连接用端子26之间用金丝27连接。也可通过采用碰接的倒装片连接技术接到基板上的芯片连接用端子上。然后用树脂封装部14模压半导体芯片25。这里，例如半导体芯片25用作非易失性半导体存储器的NAND型快擦写型E2PROM。在树脂封装部14的周边，露出基板13。
基板的反面上设有平面型的外部连接用端子12。外部连接用端子12通过通孔28与芯片连接用端子26相接续。这种半导体模块10如图4所示被埋人并固定在树脂制的模块支承基板11的凹部11a中。半导体模块的外部连接用端子12大致与模块支承基板同平面地露出。一般采用液体状粘合剂或不是一般公知的以往技术的片状粘合剂，将半导体模块的树脂封装部外周未作树脂封装的基板13与模块支承基板11的凹部11a相粘合。
图7是表示使用片状粘合剂粘合半导体模块与模块支承基板工艺的一例。
首先，如图7(a)所示，从做在一块基板15上的多个半导体模块接连排列的半导体模块群中切下单体的半导体模块。16是树脂封装部。而且如图7(b)所示从粘合剂片18切下具有半导体模块与模块支承基板之间粘合形状的粘合剂19。这一切下的粘合剂19例如是环状的。这里粘合剂片18及粘合剂19的两面都有粘合剂。然后，如图7(c)所示，将粘合剂19贴到模块支承基板11的凹部11a中。最后，如图7(c)所示，在模块支承基板11的粘合剂19上置放半导体模块17，粘合半导体模块17与模块支承基板11。
图8示出使用片状粘合剂粘合半导体模块与模块支承基板工艺的另一例。
首先，如图8(a)所示，从做在一块基板15上的多个半导体模块接连排列的半导体模块群中切下单体半导体基板17。其次，如图8(b)所示，从粘合剂18上切下一个半导体模块大小的粘合剂19。然后，如图8(c)所示，将粘合剂19贴到单体半导体模块17上，如图8(d)所示将半导体模块17装入模块支承基板11的凹部11a内，粘合贴有粘合剂19的半导体模块17与支承基板11。
另外，在使用液体粘合剂粘合半导体模块与模块支承基板的场合，首先从做在一块基板上多个半导体模块群中切下单体半导体模块，将液体状粘合剂涂布在模块支承基板的半导体模块粘合部分，粘合半导体模块与模块支承基板。
在已有的方法中，从粘合剂片中切出粘合区域形状的粘合剂是困难的。粘合区域的形状例如对应半导体模块的树脂封装部分的周围那样是环状的。为了用金属模子冲切粘合剂片，形成这种形状的粘合剂，必须将粘合剂分割成环外部、环部和环内部三部分，需要特殊的金属模子。而且，在粘合剂带有粘性的场合，有弄污金属模、不利于金属模冲切的问题。
而且，由于加工成粘合区域形状的粘合剂片又薄又小、而且轻，将它搬运到粘合部分的工作存在困难。特别是在谋求自动化的场合，用机械操作加工成那样的粘合剂片成为问题。而且在片子有粘性的场合，更加难以搬运。
而且，由于这种片子又小又薄又轻，难于使加工成粘合区域形状的粘合剂正确定位于粘合部分并粘牢。特别是一旦粘合剂粘贴偏离所要的贴合位置，则在粘合半导体模块与模块支承基板时，粘合剂溢出到设于半导体模块粘合面的反面上的外部连接用电极上，或有损于外观，或造成不合格品。
为避免这种溢出，虽然可用比粘合面小一圈的粘合剂，但会有降低粘接强度那样不方便的情况。
本发明有鉴于上述课题，其目的在于，使用操作简便的粘合剂，高成品率地使模块粘合在模块支承基板上。
本发明为解决上述课题，在基板上以规定间隔多个配置的半导体模块，包括在基板第1主面上由保护材料覆盖的半导体元件，和形成于上述基板的第2主面上、对上述半导体元件作电气连接的外部连接端子，其制造工序包括：准备上述多个半导体模块的工序；将在对应于所述多个半导体模块的位置上开口部那样设置的片状粘合剂、贴到所述基板的第1主面上的工序；在所述半导体模块的所述保护材料的周边设置片状粘合剂，切出所述基板及所述片状粘合剂，使切出的所述基板上各自设有所述半导体元件的工序；以及切出的所述基板含有所述半导体模块，粘合该基板与支承基板的工序。
在第2发明中，在基板上以规定间隔多个配置的半导体模块，包括在基板第1主面上由保护材料覆盖的半导体元件，和形成于上述基板的第2主面上，对1个上述半导体元件作电气连接的外部连接端子，其制造工序包括：准备上述多个半导体模块的工序；配置在对应于所述多个半导体模块的位置上设置的、将有多数个包围所述半导体模块的周边的粘合剂部的片状粘合剂贴到所述基板的第1主面上的工序；在所述半导体模块的所述保护材料的周边上设置片状粘合剂、切出所述基板及所述粘合剂使切出的所述基板上各自设有所述半导体元件的工序；切出的所述基板包含所述半导体模块，粘合该基板与支承基板的工序。
附图的简要说明：
图1示出本发明的第1实施例图，其中图1(a)表示粘合剂片被冲孔后形成开口部，图1(b)表示将粘合剂片卷成卷轴状，图1(c)表示将粘合剂片贴到基板上使开口部与树脂封装部吻合，图1(d)表示沿冲切线冲切已贴上粘合剂片的基板。
图2示出本发明的第1实施例图，其中图2(a)表示带有粘合剂的半导体模块，图2(b)表示将带有粘合剂的半导体模块贴到模块支承基板的凹部内，图2(c)是图2(b)中沿X-X’面的剖视图。
图3示出本发明的第2实施例图，其中图3(a)表示粘合剂在例如剥离纸上粘贴着环状粘合剂，图3(b)表示将粘合剂片卷成轴状，图3(c)表示将粘合剂贴到基板上，使开口部与树脂封装部吻合。
图4示出卡型模块图。
图5示出半导体模块图，其中图5(a)表示半导体模块的树脂封装面的立体图，图5(b)表示半导体模块的外部连接用端子面的立体图。
图6示出半导体模块剖视图。
图7示出已有的粘合方法图，其中图7(a)表示从做在一块基板上的半导体模块群中切下单体的半导体模块，图7(b)表示从粘合剂片切下具有半导体模块与模块支承基板之间粘合形状的粘合剂，图7(c)表示将粘合剂贴到模块支承基板的凹部中。
图8示出已有的粘合方法图，其中图8(a)表示从做在一块基板上的半导体模块群中切下单体的半导体基板，图8(b)表示从粘合剂上切下一个半导体模块大小的粘合剂，图8(c)表示将粘合剂贴到单体半导体模块上，图8(d)表示将半导体模块装入支承基板的凹部内。
以下，参照附图对本发明的实施例进行说明。
实施例1
图1与图2表示本发明的实施例1。
如图1(c)所示，图中未画出的多个半导体芯片以规定的间隔配置在例如由树脂或带子做成的基板4上，树脂封装覆盖在各个半导体芯片上。作为双面粘合剂的粘合剂片1，事先在剥离纸(未图示)的一面涂布粘合剂，如图1(a)所示，在例如对应于半导体模块的树脂封装部3的部分被冲孔，形成开口部2。粘合剂片1可如图1(b)那样卷成卷轴状。这时由于涂布在剥离纸上，粘合剂片1可容易地从卷轴状中带状地剥离。接着，如图1(c)所示，将粘合剂片1贴到接连在排列的模块基板4上，使开口部2吻合基板4上的树脂封装部3。
其次，将如图1(d)所示已贴上粘合剂片1的基板4沿冲切线23冲切。这时，粘合剂与半导体模块一起被冲切。结果形成如图2(a)所示的带有粘合剂6的半导体模块5。粘合剂片的剥离纸在冲切前或冲切后被剥除。
最后，如图2(b)所示，将带有粘合剂6的半导体模块5贴到模块支承基板7的凹部7a内。
这里是通过热压将粘合剂片1与粘合剂6加以粘合的情况，在将粘合剂片贴到接连排列的模块4上之际以及在将半导体模块5贴到模块支承基板7上之际分别进行热压。
还有，在将粘合剂片1贴到接连排列的模块4上之际，可采取减弱粘合强度的临时粘合状态，而在将半导体模块5贴到模块支承基板7上之际作正式粘合。
在不需要热压的粘合剂场合，可不进行此工序。
在将粘合剂片1贴到接连排列的模块4上时，可用在接连排列的模块4的整面上总括地贴合粘合剂片1的方法，或者也可用从接连排列的模块4的端部开始依次贴合粘合剂片1的方法。
这样，在本实施例中，由于一次粘贴对准开有多个孔的粘合剂片与多个半导体模块，因此位置对准容易，而且粘贴一次就成。
图2(c)是从图2(b)的X-X’面看的剖视图，如图2(c)所示，在将带有粘合剂6的半导体模块5贴到模块支承基板7的凹部7a内时，将树脂封装3的部分插入凹部7a内使留有间隙。由于这一间隙可以缓和加在模块支承基板7上的弯曲应力加到树脂封装3内的半导体芯片25上。这里在树脂封装3上不会形成粘合剂片。而且，在将粘合剂片整体地贴到半导体模块5使带粘合剂6的半导体模块5的树脂封装3上也包括，则产生容易将加在模块支承基板7上的弯曲应力加到半导体芯片25上那样的问题。
而且还产生难以在半导体芯片5上均匀地粘贴粘合剂片1那样的问题。
采用本发明可以解决这些问题。还有，在下述的实施例中，半导体模块5与模块支承基板7的凹部7a的关系也一样(未图示)，使在凹部7a内生成间隙。
实施例2
图3表示本发明的实施例2。以下用同样符号标注同样的构成要素，并省略其说明。
如图3(c)所示，多个半导体芯片(未图示)以规定的间隔配置在例如由树脂或带子做成的基板4上，树脂封装3覆盖每个半导体芯片。如图3(a)所示，粘合剂片22在例如剥离纸上粘贴着环状粘合剂8。粘合剂8的内径跟半导体模块与模块支承基板的粘接形状大致相同，外形比其粘接形状大，以与基板4上配置的树脂封装部3的间隔相同的间隔贴在剥离纸上。对该粘合剂片22，与环状粘合剂8的内径相对应于的剥离纸9也冲切形成开口部9a。如图3(b)所示，该粘合剂片也可绕成卷轴状。
其次，如图3(c)所示，将该片9上的粘合剂8依次贴到接连排列的半导体模块基板4上，使粘合剂8的开口部9a吻合树脂封装部3。
再次，如图3(c)所示，将贴有粘合剂8的基板11沿冲切线24冲切。这时，粘合剂与半导体模块一起被冲切，形成图2(a)所示那样的带有粘合剂的半导体模块5。剥离纸在冲切前或冲切后被剥除。
最后如图2(b)所示，将带有粘合剂6的半导体模块5贴到半导体模块支承基板7上。
这样，在本实施例中，由于一次粘贴对准开有多个孔的粘合剂片与多个半导体模块，因此位置对准容易，而且粘贴一次就成。
还有，在以上说明的单体半导体模块的树脂封装面的反面上，设有如图5(b)那样外部连接用端子12。
模块支承基板11的外形尺寸例如为37mm×45mm×0.76mm。
这样设置半导体模块的卡型模块，一般装置于PCMCIA卡尺寸的适配器卡中(未图示)，进而装入个人计算机的PCMCIA卡槽中使用。在适配器卡中，一般具备与卡型模块的外部连接端子相连接用的接头和进行信号发送接收的接口电路(图中未示出)。
还有，适配器卡不一定要求是卡型的，例如个人计算机主机与数字摄像机主机中具备与外部连接端子相连接用的接头与接口电路等也可以。
如前所述，采用本发明，则由于多个半导体模块和与之对应的粘合剂一次贴合对准，因此工艺时间缩短，位置对准容易。
而且，采用本发明，则由于同时冲切半导体模块和粘合剂，与已有的相比，削减了工序数。而且，在粘合剂粘贴之后冲切半导体模块，不会由于粘贴位置偏离引起粘合剂向外部电极部溢出，改善了外观，且不会由于溢出造成不合格品，提高了成品率。
而且，采用本发明，在整个半导体模块的粘接区域都涂上粘合剂。

Claims (13)

1.一种半导体装置的制造方法，其特征在于，在基板上以规定间隔多个配置的半导体模块，包括在基板第1主面上由保护材料覆盖的半导体元件，和形成于所述基板的第2主面上、对所述半导体元件作电气连接的外部连接端子，其制造工序包括：准备所述多个半导体模块的工序；将对应于所述多个半导体模块的位置上配置开口部那样设置的片状粘合剂、贴到所述基板的第1主面上的工序；按照在所述半导体模块的所述保护材料的周边带有片状粘合剂并在切出所述基板上备有各所述半导体元件那样来切割所述基板及所述片状粘合剂的工序；以及切出的所述基板含有所述半导体模块，粘合该基板及支承基板的工序。
2.如权利要求1所述的半导体装置的制造方法，其特征还在于，所述片状粘合剂取卷轴状。
3.如权利要求1所述的半导体装置的制造方法，其特征还在于，所述保护材料是树脂。
4.如权利要求1所述的半导体装置的制造方法，其特征还在于，所述支承基板具有保持所述半导体模块的凹部，所述保护材料的周边准确地装入所述凹部内，使易于连接所述半导体元件。
5.如权利要求4所述的半导体装置的制造方法，其特征还在于，由于覆盖所述半导体的保护材料比所述支承基板的凹部小，所以在所述保护材料与所述支承基板之间留有间隙。
6.如权利要求1所述的半导体装置的制造方法，其特征还在于，所述片状粘合剂能取下剥离纸装配。
7.一种半导体装置的制造方法，其特征在于，在基板上以规定间隔多个配置的半导体模块，包括在基板第1主面上由保护材料覆盖的半导体元件，和形成于所述基板的第2主面上、对所述半导体元件作电气连接的外部连接端子，其制造工序包括：准备所述多个半导体模块的工序；将在对应于所述多个半导体模块的位置上配置的、有多个包围所述半导体模块的周边的粘合剂部的片状粘合剂、贴到所述基板的第1主面上的工序；按照在所述半导体模块的所述保护材料的周边带有片状粘合剂并在切出所述基板上备有各所述半导体元件那样来切割所述基板及所述片状粘合剂的工序；以及
切出的所述基板包含所述半导体模块，粘合该基板与支承基板的工序。
8.如权利要求7所述的半导体装置的制造方法，其特征还在于，所述片状粘合剂取卷轴状。
9.如权利要求7所述的半导体装置的制造方法，其特征还在于，所述保护材料是树脂。
10.如权利要求7所述的半导体装置的制造方法，其特征还在于，所述支承基板具有保持所述半导体模块的凹部，所述保护材料的周边准确地装入所述凹部内，使易于连接所述半导体元件。
11.如权利要求10所述的半导体装置的制造方法，其特征还在于，由于覆盖所述半导体的保护材料比所述支承基板的凹部小，所述在所述保护材料与所述支承基板之间留有间隙。
12.如权利要求7所述的半导体装置的制造方法，其特征还在于，所述片状粘合剂包含能取下剥离纸装配的多个所述粘合剂部。
13.如权利要求7所述的半导体装置的制造方法，其特征还在于，所述粘合剂部具有与覆盖所述半导体元件的保护材料的长方形形状相对应的长方形框。
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