CN108885397B - 表面处理方法及表面处理液 - Google Patents

表面处理方法及表面处理液 Download PDF

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Publication number
CN108885397B
CN108885397B CN201780021452.XA CN201780021452A CN108885397B CN 108885397 B CN108885397 B CN 108885397B CN 201780021452 A CN201780021452 A CN 201780021452A CN 108885397 B CN108885397 B CN 108885397B
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China
Prior art keywords
group
surface treatment
formula
resin
functional
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CN201780021452.XA
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English (en)
Chinese (zh)
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CN108885397A (zh
Inventor
先崎尊博
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Tokyo Ohka Kogyo Co Ltd
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Tokyo Ohka Kogyo Co Ltd
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Publication of CN108885397A publication Critical patent/CN108885397A/zh
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/18—Materials not provided for elsewhere for application to surfaces to minimize adherence of ice, mist or water thereto; Thawing or antifreeze materials for application to surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Combustion & Propulsion (AREA)
  • Materials For Photolithography (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
CN201780021452.XA 2016-03-30 2017-03-23 表面处理方法及表面处理液 Active CN108885397B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-068130 2016-03-30
JP2016068130 2016-03-30
PCT/JP2017/011824 WO2017170167A1 (ja) 2016-03-30 2017-03-23 表面処理方法、及び表面処理液

Publications (2)

Publication Number Publication Date
CN108885397A CN108885397A (zh) 2018-11-23
CN108885397B true CN108885397B (zh) 2022-03-01

Family

ID=59965566

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780021452.XA Active CN108885397B (zh) 2016-03-30 2017-03-23 表面处理方法及表面处理液

Country Status (5)

Country Link
JP (1) JP6609370B2 (ja)
KR (1) KR102391565B1 (ja)
CN (1) CN108885397B (ja)
TW (1) TWI737707B (ja)
WO (1) WO2017170167A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7017436B2 (ja) * 2017-10-31 2022-02-08 東京応化工業株式会社 表面処理方法、表面処理液、及び表面処理された物品
US11066531B2 (en) * 2018-07-10 2021-07-20 Tokyo Ohka Kogyo Co., Ltd. Surface treatment liquid and hydrophilic treatment method
JP7289718B2 (ja) * 2019-05-13 2023-06-12 東京応化工業株式会社 流路デバイスの製造方法
KR20220117240A (ko) * 2019-12-24 2022-08-23 도오꾜오까고오교 가부시끼가이샤 표면 처리액, 및 친수화 처리 방법

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002083809A (ja) * 2000-09-06 2002-03-22 Hitachi Ltd 半導体装置及びその製造方法
JP2004004227A (ja) * 2002-05-31 2004-01-08 Fuji Photo Film Co Ltd ポジ型レジスト組成物
WO2006129800A1 (ja) * 2005-06-03 2006-12-07 Daikin Industries, Ltd. パターン形成用表面処理剤
JP2010215818A (ja) * 2009-03-17 2010-09-30 Jsr Corp 樹脂組成物及びバイオチップの製造方法
CN102193316A (zh) * 2010-03-15 2011-09-21 富士胶片株式会社 正型感光性树脂组合物、固化膜的形成方法、固化膜、有机el显示装置以及液晶显示装置
JP2013166812A (ja) * 2012-02-14 2013-08-29 Shin-Etsu Chemical Co Ltd ケイ素含有表面改質剤、これを含むレジスト下層膜形成用組成物、及びパターン形成方法
CN103988127A (zh) * 2011-12-09 2014-08-13 旭化成电子材料株式会社 感光性树脂组合物、固化浮雕图案的制造方法、半导体装置及显示体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437523B2 (ja) 1973-01-16 1979-11-15
JPH04261483A (ja) * 1991-02-14 1992-09-17 Showa Denko Kk 被覆物品
JPH08190200A (ja) * 1995-01-09 1996-07-23 Oki Electric Ind Co Ltd Ｓｉ含有薄膜の形成方法および該薄膜のパターン形成方法
JP2009002999A (ja) * 2007-06-19 2009-01-08 Tokyo Ohka Kogyo Co Ltd レジストパターン形成方法、表面改質材料
JP2009134255A (ja) * 2007-10-31 2009-06-18 Sekisui Chem Co Ltd マイクロパターン形成用材料、マイクロパターン複合材及びその製造方法並びに微小３次元構造基板の製造方法
JP2015196285A (ja) * 2014-03-31 2015-11-09 新日鉄住金化学株式会社 インクジェット下地用処理剤

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002083809A (ja) * 2000-09-06 2002-03-22 Hitachi Ltd 半導体装置及びその製造方法
JP2004004227A (ja) * 2002-05-31 2004-01-08 Fuji Photo Film Co Ltd ポジ型レジスト組成物
WO2006129800A1 (ja) * 2005-06-03 2006-12-07 Daikin Industries, Ltd. パターン形成用表面処理剤
JP2010215818A (ja) * 2009-03-17 2010-09-30 Jsr Corp 樹脂組成物及びバイオチップの製造方法
CN102193316A (zh) * 2010-03-15 2011-09-21 富士胶片株式会社 正型感光性树脂组合物、固化膜的形成方法、固化膜、有机el显示装置以及液晶显示装置
CN103988127A (zh) * 2011-12-09 2014-08-13 旭化成电子材料株式会社 感光性树脂组合物、固化浮雕图案的制造方法、半导体装置及显示体装置
JP2013166812A (ja) * 2012-02-14 2013-08-29 Shin-Etsu Chemical Co Ltd ケイ素含有表面改質剤、これを含むレジスト下層膜形成用組成物、及びパターン形成方法

Also Published As

Publication number Publication date
TWI737707B (zh) 2021-09-01
JP6609370B2 (ja) 2019-11-20
WO2017170167A1 (ja) 2017-10-05
TW201807150A (zh) 2018-03-01
JPWO2017170167A1 (ja) 2019-03-07
CN108885397A (zh) 2018-11-23
KR102391565B1 (ko) 2022-04-27
KR20180129803A (ko) 2018-12-05

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