CN108866585B - 一种表面具有电镀层的难熔金属或不锈钢，以及一种难熔金属或不锈钢表面的电镀工艺 - Google Patents
一种表面具有电镀层的难熔金属或不锈钢，以及一种难熔金属或不锈钢表面的电镀工艺 Download PDFInfo
- Publication number
- CN108866585B CN108866585B CN201710318166.1A CN201710318166A CN108866585B CN 108866585 B CN108866585 B CN 108866585B CN 201710318166 A CN201710318166 A CN 201710318166A CN 108866585 B CN108866585 B CN 108866585B
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- CN
- China
- Prior art keywords
- layer
- refractory metal
- stainless steel
- rhodium
- ruthenium alloy
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- 239000003870 refractory metal Substances 0.000 title claims abstract description 60
- 229910001220 stainless steel Inorganic materials 0.000 title claims abstract description 57
- 239000010935 stainless steel Substances 0.000 title claims abstract description 57
- 238000009713 electroplating Methods 0.000 title claims description 43
- 238000000034 method Methods 0.000 title claims description 23
- 230000008569 process Effects 0.000 title claims description 22
- YPPQDPIIWDQYRY-UHFFFAOYSA-N [Ru].[Rh] Chemical compound [Ru].[Rh] YPPQDPIIWDQYRY-UHFFFAOYSA-N 0.000 claims abstract description 73
- 229910000929 Ru alloy Inorganic materials 0.000 claims abstract description 66
- 239000000463 material Substances 0.000 claims abstract description 41
- 238000007747 plating Methods 0.000 claims abstract description 33
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 26
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 25
- 239000010955 niobium Substances 0.000 claims abstract description 25
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims abstract description 25
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000010936 titanium Substances 0.000 claims abstract description 17
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 17
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 14
- 239000000956 alloy Substances 0.000 claims abstract description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 52
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 44
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 36
- 229910052737 gold Inorganic materials 0.000 claims description 36
- 239000010931 gold Substances 0.000 claims description 36
- 239000002253 acid Substances 0.000 claims description 35
- 239000002585 base Substances 0.000 claims description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 26
- 229910052802 copper Inorganic materials 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 26
- 229910052759 nickel Inorganic materials 0.000 claims description 26
- 229910052763 palladium Inorganic materials 0.000 claims description 26
- 238000005868 electrolysis reaction Methods 0.000 claims description 25
- 239000003513 alkali Substances 0.000 claims description 24
- 238000002791 soaking Methods 0.000 claims description 23
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 20
- 229910052731 fluorine Inorganic materials 0.000 claims description 20
- 239000011737 fluorine Substances 0.000 claims description 20
- 230000004913 activation Effects 0.000 claims description 15
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 14
- 229910052707 ruthenium Inorganic materials 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 10
- 239000012459 cleaning agent Substances 0.000 claims description 10
- 229910052698 phosphorus Inorganic materials 0.000 claims description 10
- 239000011574 phosphorus Substances 0.000 claims description 10
- 230000003213 activating effect Effects 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 abstract description 13
- 230000007797 corrosion Effects 0.000 abstract description 12
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 167
- 238000005238 degreasing Methods 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000010948 rhodium Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000002390 adhesive tape Substances 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- 229910052703 rhodium Inorganic materials 0.000 description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 4
- 210000004243 sweat Anatomy 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- UUWCBFKLGFQDME-UHFFFAOYSA-N platinum titanium Chemical compound [Ti].[Pt] UUWCBFKLGFQDME-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710318166.1A CN108866585B (zh) | 2017-05-08 | 2017-05-08 | 一种表面具有电镀层的难熔金属或不锈钢，以及一种难熔金属或不锈钢表面的电镀工艺 |
| PCT/CN2017/085647 WO2018205307A1 (zh) | 2017-05-08 | 2017-05-24 | 一种表面具有电镀层的难熔金属或不锈钢，以及一种难熔金属或不锈钢表面的电镀工艺 |
| JP2020513383A JP7078232B2 (ja) | 2017-05-08 | 2017-05-24 | 表面に電気めっき層を有する難溶融金属またはステンレス鋼、および難溶融金属またはステンレス鋼の表面の電気めっきプロセス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710318166.1A CN108866585B (zh) | 2017-05-08 | 2017-05-08 | 一种表面具有电镀层的难熔金属或不锈钢，以及一种难熔金属或不锈钢表面的电镀工艺 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108866585A CN108866585A (zh) | 2018-11-23 |
| CN108866585B true CN108866585B (zh) | 2021-01-05 |
Family
ID=64104227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710318166.1A Active CN108866585B (zh) | 2017-05-08 | 2017-05-08 | 一种表面具有电镀层的难熔金属或不锈钢，以及一种难熔金属或不锈钢表面的电镀工艺 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7078232B2 (ja) |
| CN (1) | CN108866585B (ja) |
| WO (1) | WO2018205307A1 (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110416782A (zh) * | 2019-08-27 | 2019-11-05 | 问问智能信息科技有限公司 | 一种充电触点组合结构及其制备方法 |
| CN110829080B (zh) * | 2019-10-30 | 2021-06-18 | 富士康(昆山)电脑接插件有限公司 | 导电端子 |
| CN111466687A (zh) * | 2020-05-20 | 2020-07-31 | 东莞美景实业有限公司 | 一种手机饰品制作工艺 |
| CN113897648A (zh) * | 2021-11-22 | 2022-01-07 | 东莞中探探针有限公司 | 一种连接器端子电镀工艺 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3309292A (en) * | 1964-02-28 | 1967-03-14 | Richard L Andrews | Method for obtaining thick adherent coatings of platinum metals on refractory metals |
| CN103614752A (zh) * | 2013-12-10 | 2014-03-05 | 西部新锆核材料科技有限公司 | 一种锆材表面镀铜方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL241456A (ja) * | 1958-07-22 | 1900-01-01 | ||
| NL127936C (ja) * | 1964-03-04 | |||
| US4203810A (en) * | 1970-03-25 | 1980-05-20 | Imi Marston Limited | Electrolytic process employing electrodes having coatings which comprise platinum |
| JPS543825B1 (ja) * | 1970-12-26 | 1979-02-27 | ||
| CH525964A (fr) * | 1971-01-07 | 1972-07-31 | Oxy Metal Finishing Europ S A | Procédé pour déposer un revêtement métallique sur une pièce de titane ou en alliage de titane, et pièce de titane ou en alliage de titane munie d'un revêtement métallique obtenu par la mise en oeuvre de ce procédé |
| US3892638A (en) * | 1973-06-21 | 1975-07-01 | Oxy Metal Industries Corp | Electrolyte and method for electrodepositing rhodium-ruthenium alloys |
| JPS63310993A (ja) * | 1987-06-10 | 1988-12-19 | Bikutoria:Kk | チタン系素材への貴金属メッキ方法 |
| KR100231828B1 (ko) * | 1997-02-20 | 1999-12-01 | 유무성 | 다층 도금 리드프레임 |
| CN101096769A (zh) * | 2006-06-26 | 2008-01-02 | 比亚迪股份有限公司 | 一种电镀方法 |
| WO2016093329A1 (ja) * | 2014-12-11 | 2016-06-16 | 田中貴金属工業株式会社 | 過酸化水素分解用触媒およびその製造方法ならびに該触媒を用いた過酸化水素を分解する方法 |
| CN106245084A (zh) * | 2016-07-29 | 2016-12-21 | 成都立威讯科技有限公司 | 一种半导体用钼片镀铑工艺 |
-
2017
- 2017-05-08 CN CN201710318166.1A patent/CN108866585B/zh active Active
- 2017-05-24 WO PCT/CN2017/085647 patent/WO2018205307A1/zh active Application Filing
- 2017-05-24 JP JP2020513383A patent/JP7078232B2/ja active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3309292A (en) * | 1964-02-28 | 1967-03-14 | Richard L Andrews | Method for obtaining thick adherent coatings of platinum metals on refractory metals |
| CN103614752A (zh) * | 2013-12-10 | 2014-03-05 | 西部新锆核材料科技有限公司 | 一种锆材表面镀铜方法 |
Non-Patent Citations (1)
| Title |
|---|
| 电镀铑钌合金新工艺;袁国良;《电镀与环保》;19920531;第12卷(第3期);第9-11页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7078232B2 (ja) | 2022-05-31 |
| CN108866585A (zh) | 2018-11-23 |
| WO2018205307A1 (zh) | 2018-11-15 |
| JP2020523486A (ja) | 2020-08-06 |
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