CN108630565B - 基板处理系统 - Google Patents

基板处理系统 Download PDF

Info

Publication number
CN108630565B
CN108630565B CN201711426674.8A CN201711426674A CN108630565B CN 108630565 B CN108630565 B CN 108630565B CN 201711426674 A CN201711426674 A CN 201711426674A CN 108630565 B CN108630565 B CN 108630565B
Authority
CN
China
Prior art keywords
substrate
substrates
pair
unit
interval
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201711426674.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN108630565A (zh
Inventor
谷口竹志
芳谷光明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Publication of CN108630565A publication Critical patent/CN108630565A/zh
Application granted granted Critical
Publication of CN108630565B publication Critical patent/CN108630565B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201711426674.8A 2017-03-23 2017-12-25 基板处理系统 Active CN108630565B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-057562 2017-03-23
JP2017057562A JP6864514B2 (ja) 2017-03-23 2017-03-23 基板処理システムおよび基板処理方法

Publications (2)

Publication Number Publication Date
CN108630565A CN108630565A (zh) 2018-10-09
CN108630565B true CN108630565B (zh) 2022-03-29

Family

ID=63705955

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711426674.8A Active CN108630565B (zh) 2017-03-23 2017-12-25 基板处理系统

Country Status (3)

Country Link
JP (1) JP6864514B2 (ja)
CN (1) CN108630565B (ja)
TW (1) TWI713810B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6899813B2 (ja) * 2018-11-27 2021-07-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7259476B2 (ja) * 2019-03-27 2023-04-18 東京エレクトロン株式会社 アライメント装置、基板処理装置、アライメント方法及び基板処理方法
JP2021150496A (ja) * 2020-03-19 2021-09-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システムおよび基板処理方法
JP7157786B2 (ja) * 2020-09-23 2022-10-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7185671B2 (ja) * 2020-09-23 2022-12-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1461726A (zh) * 2002-05-30 2003-12-17 东京毅力科创株式会社 基板搬运装置和基板处理装置
CN1975578A (zh) * 2005-11-29 2007-06-06 东京毅力科创株式会社 涂布、显影装置和涂布、显影方法
KR20090006960A (ko) * 2007-07-13 2009-01-16 (주)아이콘 반도체 패키지 이송/정렬 장치
JP2011210985A (ja) * 2010-03-30 2011-10-20 Dainippon Screen Mfg Co Ltd 基板搬送装置および基板処理装置
CN102730416A (zh) * 2011-04-06 2012-10-17 中外炉工业株式会社 基板搬送装置及具备该基板搬送装置的基板加工装置
CN102969261A (zh) * 2011-08-30 2013-03-13 大日本网屏制造株式会社 基板处理装置
CN104773450A (zh) * 2014-01-10 2015-07-15 株式会社大福 输送装置
CN105936415A (zh) * 2015-03-04 2016-09-14 东和株式会社 制造装置以及输送方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4476133B2 (ja) * 2005-02-24 2010-06-09 東京エレクトロン株式会社 処理システム
JP5274148B2 (ja) * 2008-08-19 2013-08-28 東京エレクトロン株式会社 処理システム
US9242279B2 (en) * 2011-05-24 2016-01-26 Tokyo Electron Limited Liquid processing apparatus and liquid processing method
JP6293645B2 (ja) * 2013-12-27 2018-03-14 東京エレクトロン株式会社 基板処理システム

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1461726A (zh) * 2002-05-30 2003-12-17 东京毅力科创株式会社 基板搬运装置和基板处理装置
CN1975578A (zh) * 2005-11-29 2007-06-06 东京毅力科创株式会社 涂布、显影装置和涂布、显影方法
KR20090006960A (ko) * 2007-07-13 2009-01-16 (주)아이콘 반도체 패키지 이송/정렬 장치
JP2011210985A (ja) * 2010-03-30 2011-10-20 Dainippon Screen Mfg Co Ltd 基板搬送装置および基板処理装置
CN102730416A (zh) * 2011-04-06 2012-10-17 中外炉工业株式会社 基板搬送装置及具备该基板搬送装置的基板加工装置
CN102969261A (zh) * 2011-08-30 2013-03-13 大日本网屏制造株式会社 基板处理装置
CN104773450A (zh) * 2014-01-10 2015-07-15 株式会社大福 输送装置
CN105936415A (zh) * 2015-03-04 2016-09-14 东和株式会社 制造装置以及输送方法

Also Published As

Publication number Publication date
CN108630565A (zh) 2018-10-09
TW201843096A (zh) 2018-12-16
JP2018160586A (ja) 2018-10-11
JP6864514B2 (ja) 2021-04-28
TWI713810B (zh) 2020-12-21

Similar Documents

Publication Publication Date Title
CN108630565B (zh) 基板处理系统
JP4896236B2 (ja) 基板搬送装置及び基板搬送方法
US8757180B2 (en) Substrate processing apparatus
KR100367963B1 (ko) 처리액도포용도포장치
KR100687565B1 (ko) 기판 처리 장치
JP5600624B2 (ja) 塗布膜形成装置及び塗布膜形成方法
KR101442334B1 (ko) 기판 처리 장치
JP4451385B2 (ja) 塗布処理装置及び塗布処理方法
CN101197255A (zh) 用于刻蚀基板的装置和使用其制造液晶显示器的生产线
CN111223794B (zh) 基板处理装置和基板处理方法
KR100837849B1 (ko) 처리액 공급방법 및 처리액 공급장치
CN110783166B (zh) 基板处理装置及基板处理方法
KR20110088367A (ko) 기판 처리 장치 및 기판 처리 방법
CN113496932A (zh) 基板处理系统及基板处理方法
JP3927758B2 (ja) 基板搬送装置及び処理装置
CN114256096B (zh) 基板处理装置和基板处理方法
JP2013102153A (ja) 処理ステージ装置及びそれを用いる塗布処理装置
KR102571030B1 (ko) 기판 처리 장치 및 기판 처리 방법
JP2002184833A (ja) 基板搬送装置
JPH10199843A (ja) 基板洗浄装置及び方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant