CN108620768B - 热固化性焊剂组合物及电子基板的制造方法 - Google Patents

热固化性焊剂组合物及电子基板的制造方法 Download PDF

Info

Publication number
CN108620768B
CN108620768B CN201710872626.5A CN201710872626A CN108620768B CN 108620768 B CN108620768 B CN 108620768B CN 201710872626 A CN201710872626 A CN 201710872626A CN 108620768 B CN108620768 B CN 108620768B
Authority
CN
China
Prior art keywords
flux composition
component
solder
thermosetting flux
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710872626.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN108620768A (zh
Inventor
喜多村明
饭岛纪成
谷口裕亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Publication of CN108620768A publication Critical patent/CN108620768A/zh
Application granted granted Critical
Publication of CN108620768B publication Critical patent/CN108620768B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81009—Pre-treatment of the bump connector or the bonding area
    • H01L2224/81024—Applying flux to the bonding area

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201710872626.5A 2017-03-16 2017-09-25 热固化性焊剂组合物及电子基板的制造方法 Active CN108620768B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017050970A JP6557694B2 (ja) 2017-03-16 2017-03-16 熱硬化性フラックス組成物および電子基板の製造方法
JP2017-050970 2017-03-16

Publications (2)

Publication Number Publication Date
CN108620768A CN108620768A (zh) 2018-10-09
CN108620768B true CN108620768B (zh) 2022-04-08

Family

ID=63705692

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710872626.5A Active CN108620768B (zh) 2017-03-16 2017-09-25 热固化性焊剂组合物及电子基板的制造方法

Country Status (4)

Country Link
JP (1) JP6557694B2 (ko)
KR (1) KR102332799B1 (ko)
CN (1) CN108620768B (ko)
TW (1) TWI746647B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6766087B2 (ja) * 2018-03-23 2020-10-07 株式会社タムラ製作所 熱硬化性フラックス組成物および電子基板の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004202518A (ja) * 2002-12-24 2004-07-22 Nof Corp はんだ付け用フラックス組成物、はんだペースト及びはんだ付け方法
JP2005288490A (ja) * 2004-03-31 2005-10-20 Nof Corp はんだ付け用フラックス組成物およびはんだペースト
JP2006015348A (ja) * 2004-06-30 2006-01-19 Nof Corp はんだ付け用フラックス組成物およびはんだペースト
JP2006205203A (ja) * 2005-01-27 2006-08-10 Nof Corp はんだ付け用フラックス組成物およびはんだペースト
JP2011063727A (ja) * 2009-09-17 2011-03-31 Panasonic Electric Works Co Ltd カチオン硬化性樹脂組成物、回路装置及びその製造方法
CN103289621A (zh) * 2012-02-23 2013-09-11 株式会社田村制作所 热固性树脂组合物
CN106001996A (zh) * 2015-03-26 2016-10-12 株式会社田村制作所 焊料组合物及使用了该焊料组合物的电子基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7671114B2 (en) * 2004-01-26 2010-03-02 Henkel Corporation Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder
JP5415923B2 (ja) * 2009-12-14 2014-02-12 太陽ホールディングス株式会社 感光性樹脂組成物、そのドライフィルム及びそれらを用いたプリント配線板
WO2014175196A1 (ja) * 2013-04-23 2014-10-30 太陽ホールディングス株式会社 ソルダーレジスト組成物およびそれを用いたプリント配線板
JP5830196B1 (ja) * 2014-02-24 2015-12-09 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
WO2016104275A1 (ja) * 2014-12-26 2016-06-30 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004202518A (ja) * 2002-12-24 2004-07-22 Nof Corp はんだ付け用フラックス組成物、はんだペースト及びはんだ付け方法
JP2005288490A (ja) * 2004-03-31 2005-10-20 Nof Corp はんだ付け用フラックス組成物およびはんだペースト
JP2006015348A (ja) * 2004-06-30 2006-01-19 Nof Corp はんだ付け用フラックス組成物およびはんだペースト
JP2006205203A (ja) * 2005-01-27 2006-08-10 Nof Corp はんだ付け用フラックス組成物およびはんだペースト
JP2011063727A (ja) * 2009-09-17 2011-03-31 Panasonic Electric Works Co Ltd カチオン硬化性樹脂組成物、回路装置及びその製造方法
CN103289621A (zh) * 2012-02-23 2013-09-11 株式会社田村制作所 热固性树脂组合物
CN106001996A (zh) * 2015-03-26 2016-10-12 株式会社田村制作所 焊料组合物及使用了该焊料组合物的电子基板

Also Published As

Publication number Publication date
JP2018157007A (ja) 2018-10-04
TW201835209A (zh) 2018-10-01
KR20180106815A (ko) 2018-10-01
JP6557694B2 (ja) 2019-08-07
CN108620768A (zh) 2018-10-09
TWI746647B (zh) 2021-11-21
KR102332799B1 (ko) 2021-11-30

Similar Documents

Publication Publication Date Title
JP5342453B2 (ja) 導電性ペーストおよびこれを用いた電気電子機器
JP5387844B2 (ja) 鉛フリーはんだ用フラックス組成物及び鉛フリーはんだペースト
TWI465475B (zh) Solder paste and solder paste
US10906137B2 (en) Solder composition and electronic board
WO2018003820A1 (ja) フラックス組成物、ソルダペースト組成物及び電子回路基板
JP6452659B2 (ja) 熱硬化性フラックス組成物および電子基板の製造方法
CN108620768B (zh) 热固化性焊剂组合物及电子基板的制造方法
JP6619376B2 (ja) 熱硬化性フラックス組成物、はんだ組成物および電子基板の製造方法
JP6530734B2 (ja) 熱硬化性フラックス組成物および電子基板の製造方法
JP6628821B2 (ja) フラックス組成物、はんだ組成物および電子基板
JP2006035259A (ja) ソルダペースト
JP2015047614A (ja) 微細パターン塗布用はんだ組成物
JP6766087B2 (ja) 熱硬化性フラックス組成物および電子基板の製造方法
JP6766196B2 (ja) はんだ組成物および電子基板の製造方法
JP2019171474A (ja) フラックス組成物、はんだ組成物および電子基板
JP6913122B2 (ja) はんだ組成物および電子基板の製造方法
JP6990488B2 (ja) 熱硬化性フラックス組成物および電子基板の製造方法
JP6830934B2 (ja) 熱硬化性フラックス組成物および電子基板の製造方法
JP6967026B2 (ja) 熱硬化性フラックス組成物および電子基板の製造方法
JP2019096550A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP6830935B2 (ja) 熱硬化性フラックス組成物および電子基板の製造方法
JP2016181599A (ja) 電子部品の接合方法、並びに、その方法に用いるはんだ組成物および前処理剤
JP2016162778A (ja) 電子部品の接合方法、並びに、その方法に用いる導電性組成物および前処理剤

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant