CN108463882B - 导热片、导热片的制造方法、散热构件和半导体装置 - Google Patents

导热片、导热片的制造方法、散热构件和半导体装置 Download PDF

Info

Publication number
CN108463882B
CN108463882B CN201780006145.4A CN201780006145A CN108463882B CN 108463882 B CN108463882 B CN 108463882B CN 201780006145 A CN201780006145 A CN 201780006145A CN 108463882 B CN108463882 B CN 108463882B
Authority
CN
China
Prior art keywords
thermally conductive
conductive sheet
molded body
sheet
carbon fibers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201780006145.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN108463882A (zh
Inventor
金谷纮希
野村优
内田俊介
内田信一
荒卷庆辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of CN108463882A publication Critical patent/CN108463882A/zh
Application granted granted Critical
Publication of CN108463882B publication Critical patent/CN108463882B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/28Nitrogen-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/06Elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/22Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/25Arrangements for cooling characterised by their materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/25Arrangements for cooling characterised by their materials
    • H10W40/251Organics
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/25Arrangements for cooling characterised by their materials
    • H10W40/259Ceramics or glasses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/70Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/28Nitrogen-containing compounds
    • C08K2003/282Binary compounds of nitrogen with aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/013Manufacture or treatment of die-attach connectors
    • H10W72/01351Changing the shapes of die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/013Manufacture or treatment of die-attach connectors
    • H10W72/01365Thermally treating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • H10W72/321Structures or relative sizes of die-attach connectors
    • H10W72/325Die-attach connectors having a filler embedded in a matrix
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • H10W72/351Materials of die-attach connectors
    • H10W72/353Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • H10W72/351Materials of die-attach connectors
    • H10W72/353Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/877Bump connectors and die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/17Containers or parts thereof characterised by their materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Ceramic Engineering (AREA)
CN201780006145.4A 2016-01-26 2017-01-13 导热片、导热片的制造方法、散热构件和半导体装置 Active CN108463882B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-012663 2016-01-26
JP2016012663A JP6301978B2 (ja) 2016-01-26 2016-01-26 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
PCT/JP2017/001122 WO2017130755A1 (ja) 2016-01-26 2017-01-13 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置

Publications (2)

Publication Number Publication Date
CN108463882A CN108463882A (zh) 2018-08-28
CN108463882B true CN108463882B (zh) 2022-05-13

Family

ID=59398909

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780006145.4A Active CN108463882B (zh) 2016-01-26 2017-01-13 导热片、导热片的制造方法、散热构件和半导体装置

Country Status (5)

Country Link
US (1) US10526519B2 (https=)
JP (1) JP6301978B2 (https=)
KR (3) KR102075893B1 (https=)
CN (1) CN108463882B (https=)
WO (1) WO2017130755A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110612322B (zh) * 2017-05-12 2023-05-05 美国陶氏有机硅公司 高介电常数和低介电耗散的聚合物组合物
JP6613462B2 (ja) * 2017-06-27 2019-12-04 積水ポリマテック株式会社 熱伝導性シート
KR102540533B1 (ko) * 2018-06-01 2023-06-07 현대자동차주식회사 열전도성이 우수한 경량 고분자 조성물과 그 제조방법 및 이 조성물을 이용하여 제조한 물품
JP2020116873A (ja) * 2019-01-25 2020-08-06 デクセリアルズ株式会社 熱伝導性シートの製造方法
TWI896542B (zh) * 2019-07-23 2025-09-11 德商漢高股份有限及兩合公司 高熱通量多元件總成之熱管理
CN110625877B (zh) * 2019-09-05 2021-06-08 上海阿莱德实业股份有限公司 一种导热界面材料的制备方法
WO2021065522A1 (ja) * 2019-09-30 2021-04-08 積水ポリマテック株式会社 熱伝導性シート及びその製造方法
KR102280275B1 (ko) 2019-11-22 2021-07-21 더원씨엔티(주) 탄소복합 방열소재 및 그 제조방법
KR102384315B1 (ko) 2019-11-25 2022-04-07 재단법인 한국탄소산업진흥원 열가소성수지 기반 열전도성 마스터배치의 제조방법 및 그를 이용한 방열복합소재
JP7458775B2 (ja) * 2019-12-24 2024-04-01 デクセリアルズ株式会社 熱伝導性成形体の製造方法
CN117624899A (zh) * 2020-05-15 2024-03-01 迪睿合株式会社 导热性片和导热性片的制造方法
US20220240411A1 (en) * 2020-05-28 2022-07-28 Dexerials Corporation Thermal conductive sheet and method for producing the same, and heat dissipation structure and electronic device
JP2022064582A (ja) * 2020-10-14 2022-04-26 矢崎総業株式会社 熱伝導シート、電子機器及び車載装置
JP2022119196A (ja) * 2021-02-03 2022-08-16 デクセリアルズ株式会社 熱伝導性シート積層体及びこれを用いた電子機器
WO2022168729A1 (ja) * 2021-02-03 2022-08-11 デクセリアルズ株式会社 熱伝導性シート積層体及びこれを用いた電子機器
JP6983345B1 (ja) * 2021-02-18 2021-12-17 デクセリアルズ株式会社 熱伝導性シート、および電子機器
CN113150558B (zh) 2021-05-12 2021-11-26 广东思泉新材料股份有限公司 一种定向导热片及其制备方法、及半导体散热装置
US11615999B1 (en) 2022-07-22 2023-03-28 GuangDong Suqun New Material Co., Ltd Oriented heat conducting sheet and preparation method thereof, and semiconductor heat dissipating device
KR102842960B1 (ko) * 2023-09-11 2025-08-06 재단법인대구경북과학기술원 저자기장을 이용하여 배향이 가능한 열전도성 시트 및 이의 제조방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101275035A (zh) * 2007-03-27 2008-10-01 丰田合成株式会社 低导电性高散热性高分子材料及成型体

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5660324A (en) 1979-10-23 1981-05-25 Matsushita Electric Ind Co Ltd Infrared ray detector
JPS5671266A (en) 1979-11-15 1981-06-13 Jeol Ltd Scanning electron microscope
JP2992285B1 (ja) * 1998-11-10 1999-12-20 北川工業株式会社 熱伝導材
JP2001315244A (ja) * 2000-05-01 2001-11-13 Jsr Corp 熱伝導性シート、その製造方法およびその熱伝導性シートを用いた放熱構造
JP2002003717A (ja) 2000-06-21 2002-01-09 Polymatech Co Ltd 熱伝導性シート
JP2002088249A (ja) 2000-09-12 2002-03-27 Polymatech Co Ltd 熱伝導性高分子組成物及び熱伝導性成形体
US6597575B1 (en) * 2002-01-04 2003-07-22 Intel Corporation Electronic packages having good reliability comprising low modulus thermal interface materials
JP2005054094A (ja) 2003-08-06 2005-03-03 Bridgestone Corp 熱伝導性樹脂材料
JP4791146B2 (ja) 2005-11-01 2011-10-12 ポリマテック株式会社 熱伝導性部材およびその製造方法
JP4897360B2 (ja) * 2006-06-08 2012-03-14 ポリマテック株式会社 熱伝導性成形体及びその製造方法
JP5146256B2 (ja) * 2008-03-18 2013-02-20 富士通株式会社 シート状構造体及びその製造方法、並びに電子機器及びその製造方法
US8465666B2 (en) 2009-02-25 2013-06-18 Panasonic Corporation Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition
JP5671266B2 (ja) * 2010-06-17 2015-02-18 デクセリアルズ株式会社 熱伝導性シート
JP2012023335A (ja) * 2010-06-17 2012-02-02 Sony Chemical & Information Device Corp 熱伝導性シート及びその製造方法
US8808607B2 (en) * 2010-06-17 2014-08-19 Dexerials Corporation Thermally conductive sheet and process for producing same
JP5760397B2 (ja) * 2010-11-15 2015-08-12 日立化成株式会社 熱伝導シート、熱伝導シートの製造方法、及び放熱装置
JP5699556B2 (ja) 2010-11-15 2015-04-15 日立化成株式会社 熱伝導シート、熱伝導シートの製造方法、及び放熱装置
JP5660324B2 (ja) 2011-06-20 2015-01-28 株式会社豊田中央研究所 樹脂組成物およびその製造方法
JP5779693B2 (ja) 2013-06-27 2015-09-16 デクセリアルズ株式会社 熱伝導性シート、及びその製造方法、並びに半導体装置
JP5766335B2 (ja) 2013-07-01 2015-08-19 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び放熱部材
JP5752299B2 (ja) 2013-07-01 2015-07-22 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び放熱部材

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101275035A (zh) * 2007-03-27 2008-10-01 丰田合成株式会社 低导电性高散热性高分子材料及成型体

Also Published As

Publication number Publication date
US20190055443A1 (en) 2019-02-21
WO2017130755A1 (ja) 2017-08-03
JP2017135211A (ja) 2017-08-03
CN108463882A (zh) 2018-08-28
JP6301978B2 (ja) 2018-03-28
US10526519B2 (en) 2020-01-07
KR102075893B1 (ko) 2020-02-11
KR20180050392A (ko) 2018-05-14
KR102151931B1 (ko) 2020-09-04
KR20200070435A (ko) 2020-06-17
KR20190120421A (ko) 2019-10-23

Similar Documents

Publication Publication Date Title
CN108463882B (zh) 导热片、导热片的制造方法、散热构件和半导体装置
JP6813641B2 (ja) 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
CN110945647B (zh) 导热片
CN110739223B (zh) 导热性片的制造方法
CN107004651B (zh) 导热片的制造方法、导热片和半导体装置
CN107995999B (zh) 热传导片、热传导片的制造方法、散热构件和半导体装置
JPWO2020153377A1 (ja) 熱伝導性樹脂シート
TWI714804B (zh) 熱傳導片及半導體裝置
CN110739224A (zh) 导热性片的制造方法
CN113261398A (zh) 散热片的制备方法
JP6393816B2 (ja) 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
JP3568401B2 (ja) 高熱伝導性シート
US20240120254A1 (en) Thermally-conductive sheet and electronic device
WO2017122817A1 (ja) 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
WO2017130740A1 (ja) 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
WO2022181171A1 (ja) 熱伝導シート及び熱伝導シートの製造方法
JP6307288B2 (ja) 熱伝導性部材、及び半導体装置
TW202223063A (zh) 導熱性片材及導熱性片材之製造方法
CN114350153A (zh) 导热片、电子设备和车载设备
JP7701793B2 (ja) 熱伝導シート及び熱伝導シートの製造方法
WO2022176822A1 (ja) 放熱部材の製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: Maple County, Japan

Patentee after: DEXERIALS Corp.

Country or region after: Japan

Address before: Tokyo, Japan

Patentee before: DEXERIALS Corp.

Country or region before: Japan

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20251011

Address after: Osaka

Patentee after: SEKISUI CHEMICAL Co.,Ltd.

Country or region after: Japan

Address before: Maple County, Japan

Patentee before: DEXERIALS Corp.

Country or region before: Japan