CN108463882B - 导热片、导热片的制造方法、散热构件和半导体装置 - Google Patents
导热片、导热片的制造方法、散热构件和半导体装置 Download PDFInfo
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- CN108463882B CN108463882B CN201780006145.4A CN201780006145A CN108463882B CN 108463882 B CN108463882 B CN 108463882B CN 201780006145 A CN201780006145 A CN 201780006145A CN 108463882 B CN108463882 B CN 108463882B
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
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- C08K7/02—Fibres or whiskers
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- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
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- H—ELECTRICITY
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- H10W40/00—Arrangements for thermal protection or thermal control
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- H10W40/25—Arrangements for cooling characterised by their materials
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- H—ELECTRICITY
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- H10W40/00—Arrangements for thermal protection or thermal control
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- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/259—Ceramics or glasses
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- H—ELECTRICITY
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- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
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- C—CHEMISTRY; METALLURGY
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- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01351—Changing the shapes of die-attach connectors
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- H—ELECTRICITY
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- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01365—Thermally treating
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- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
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- H—ELECTRICITY
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- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/321—Structures or relative sizes of die-attach connectors
- H10W72/325—Die-attach connectors having a filler embedded in a matrix
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- H—ELECTRICITY
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- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/351—Materials of die-attach connectors
- H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
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- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
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- H10W72/351—Materials of die-attach connectors
- H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
- H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
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- H—ELECTRICITY
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- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
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- H—ELECTRICITY
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- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/17—Containers or parts thereof characterised by their materials
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- H—ELECTRICITY
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- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
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- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Combustion & Propulsion (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Ceramic Engineering (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-012663 | 2016-01-26 | ||
| JP2016012663A JP6301978B2 (ja) | 2016-01-26 | 2016-01-26 | 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 |
| PCT/JP2017/001122 WO2017130755A1 (ja) | 2016-01-26 | 2017-01-13 | 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108463882A CN108463882A (zh) | 2018-08-28 |
| CN108463882B true CN108463882B (zh) | 2022-05-13 |
Family
ID=59398909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780006145.4A Active CN108463882B (zh) | 2016-01-26 | 2017-01-13 | 导热片、导热片的制造方法、散热构件和半导体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10526519B2 (https=) |
| JP (1) | JP6301978B2 (https=) |
| KR (3) | KR102075893B1 (https=) |
| CN (1) | CN108463882B (https=) |
| WO (1) | WO2017130755A1 (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110612322B (zh) * | 2017-05-12 | 2023-05-05 | 美国陶氏有机硅公司 | 高介电常数和低介电耗散的聚合物组合物 |
| JP6613462B2 (ja) * | 2017-06-27 | 2019-12-04 | 積水ポリマテック株式会社 | 熱伝導性シート |
| KR102540533B1 (ko) * | 2018-06-01 | 2023-06-07 | 현대자동차주식회사 | 열전도성이 우수한 경량 고분자 조성물과 그 제조방법 및 이 조성물을 이용하여 제조한 물품 |
| JP2020116873A (ja) * | 2019-01-25 | 2020-08-06 | デクセリアルズ株式会社 | 熱伝導性シートの製造方法 |
| TWI896542B (zh) * | 2019-07-23 | 2025-09-11 | 德商漢高股份有限及兩合公司 | 高熱通量多元件總成之熱管理 |
| CN110625877B (zh) * | 2019-09-05 | 2021-06-08 | 上海阿莱德实业股份有限公司 | 一种导热界面材料的制备方法 |
| WO2021065522A1 (ja) * | 2019-09-30 | 2021-04-08 | 積水ポリマテック株式会社 | 熱伝導性シート及びその製造方法 |
| KR102280275B1 (ko) | 2019-11-22 | 2021-07-21 | 더원씨엔티(주) | 탄소복합 방열소재 및 그 제조방법 |
| KR102384315B1 (ko) | 2019-11-25 | 2022-04-07 | 재단법인 한국탄소산업진흥원 | 열가소성수지 기반 열전도성 마스터배치의 제조방법 및 그를 이용한 방열복합소재 |
| JP7458775B2 (ja) * | 2019-12-24 | 2024-04-01 | デクセリアルズ株式会社 | 熱伝導性成形体の製造方法 |
| CN117624899A (zh) * | 2020-05-15 | 2024-03-01 | 迪睿合株式会社 | 导热性片和导热性片的制造方法 |
| US20220240411A1 (en) * | 2020-05-28 | 2022-07-28 | Dexerials Corporation | Thermal conductive sheet and method for producing the same, and heat dissipation structure and electronic device |
| JP2022064582A (ja) * | 2020-10-14 | 2022-04-26 | 矢崎総業株式会社 | 熱伝導シート、電子機器及び車載装置 |
| JP2022119196A (ja) * | 2021-02-03 | 2022-08-16 | デクセリアルズ株式会社 | 熱伝導性シート積層体及びこれを用いた電子機器 |
| WO2022168729A1 (ja) * | 2021-02-03 | 2022-08-11 | デクセリアルズ株式会社 | 熱伝導性シート積層体及びこれを用いた電子機器 |
| JP6983345B1 (ja) * | 2021-02-18 | 2021-12-17 | デクセリアルズ株式会社 | 熱伝導性シート、および電子機器 |
| CN113150558B (zh) | 2021-05-12 | 2021-11-26 | 广东思泉新材料股份有限公司 | 一种定向导热片及其制备方法、及半导体散热装置 |
| US11615999B1 (en) | 2022-07-22 | 2023-03-28 | GuangDong Suqun New Material Co., Ltd | Oriented heat conducting sheet and preparation method thereof, and semiconductor heat dissipating device |
| KR102842960B1 (ko) * | 2023-09-11 | 2025-08-06 | 재단법인대구경북과학기술원 | 저자기장을 이용하여 배향이 가능한 열전도성 시트 및 이의 제조방법 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101275035A (zh) * | 2007-03-27 | 2008-10-01 | 丰田合成株式会社 | 低导电性高散热性高分子材料及成型体 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5660324A (en) | 1979-10-23 | 1981-05-25 | Matsushita Electric Ind Co Ltd | Infrared ray detector |
| JPS5671266A (en) | 1979-11-15 | 1981-06-13 | Jeol Ltd | Scanning electron microscope |
| JP2992285B1 (ja) * | 1998-11-10 | 1999-12-20 | 北川工業株式会社 | 熱伝導材 |
| JP2001315244A (ja) * | 2000-05-01 | 2001-11-13 | Jsr Corp | 熱伝導性シート、その製造方法およびその熱伝導性シートを用いた放熱構造 |
| JP2002003717A (ja) | 2000-06-21 | 2002-01-09 | Polymatech Co Ltd | 熱伝導性シート |
| JP2002088249A (ja) | 2000-09-12 | 2002-03-27 | Polymatech Co Ltd | 熱伝導性高分子組成物及び熱伝導性成形体 |
| US6597575B1 (en) * | 2002-01-04 | 2003-07-22 | Intel Corporation | Electronic packages having good reliability comprising low modulus thermal interface materials |
| JP2005054094A (ja) | 2003-08-06 | 2005-03-03 | Bridgestone Corp | 熱伝導性樹脂材料 |
| JP4791146B2 (ja) | 2005-11-01 | 2011-10-12 | ポリマテック株式会社 | 熱伝導性部材およびその製造方法 |
| JP4897360B2 (ja) * | 2006-06-08 | 2012-03-14 | ポリマテック株式会社 | 熱伝導性成形体及びその製造方法 |
| JP5146256B2 (ja) * | 2008-03-18 | 2013-02-20 | 富士通株式会社 | シート状構造体及びその製造方法、並びに電子機器及びその製造方法 |
| US8465666B2 (en) | 2009-02-25 | 2013-06-18 | Panasonic Corporation | Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition |
| JP5671266B2 (ja) * | 2010-06-17 | 2015-02-18 | デクセリアルズ株式会社 | 熱伝導性シート |
| JP2012023335A (ja) * | 2010-06-17 | 2012-02-02 | Sony Chemical & Information Device Corp | 熱伝導性シート及びその製造方法 |
| US8808607B2 (en) * | 2010-06-17 | 2014-08-19 | Dexerials Corporation | Thermally conductive sheet and process for producing same |
| JP5760397B2 (ja) * | 2010-11-15 | 2015-08-12 | 日立化成株式会社 | 熱伝導シート、熱伝導シートの製造方法、及び放熱装置 |
| JP5699556B2 (ja) | 2010-11-15 | 2015-04-15 | 日立化成株式会社 | 熱伝導シート、熱伝導シートの製造方法、及び放熱装置 |
| JP5660324B2 (ja) | 2011-06-20 | 2015-01-28 | 株式会社豊田中央研究所 | 樹脂組成物およびその製造方法 |
| JP5779693B2 (ja) | 2013-06-27 | 2015-09-16 | デクセリアルズ株式会社 | 熱伝導性シート、及びその製造方法、並びに半導体装置 |
| JP5766335B2 (ja) | 2013-07-01 | 2015-08-19 | デクセリアルズ株式会社 | 熱伝導シートの製造方法、熱伝導シート、及び放熱部材 |
| JP5752299B2 (ja) | 2013-07-01 | 2015-07-22 | デクセリアルズ株式会社 | 熱伝導シートの製造方法、熱伝導シート、及び放熱部材 |
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2016
- 2016-01-26 JP JP2016012663A patent/JP6301978B2/ja active Active
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2017
- 2017-01-13 KR KR1020187009825A patent/KR102075893B1/ko active Active
- 2017-01-13 CN CN201780006145.4A patent/CN108463882B/zh active Active
- 2017-01-13 WO PCT/JP2017/001122 patent/WO2017130755A1/ja not_active Ceased
- 2017-01-13 KR KR1020197030256A patent/KR20190120421A/ko not_active Ceased
- 2017-01-13 US US16/072,334 patent/US10526519B2/en active Active
- 2017-01-13 KR KR1020207016571A patent/KR102151931B1/ko active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101275035A (zh) * | 2007-03-27 | 2008-10-01 | 丰田合成株式会社 | 低导电性高散热性高分子材料及成型体 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20190055443A1 (en) | 2019-02-21 |
| WO2017130755A1 (ja) | 2017-08-03 |
| JP2017135211A (ja) | 2017-08-03 |
| CN108463882A (zh) | 2018-08-28 |
| JP6301978B2 (ja) | 2018-03-28 |
| US10526519B2 (en) | 2020-01-07 |
| KR102075893B1 (ko) | 2020-02-11 |
| KR20180050392A (ko) | 2018-05-14 |
| KR102151931B1 (ko) | 2020-09-04 |
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