CN108463511B - 导热片、导热片的制造方法、散热构件和半导体装置 - Google Patents

导热片、导热片的制造方法、散热构件和半导体装置 Download PDF

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CN108463511B
CN108463511B CN201780006275.8A CN201780006275A CN108463511B CN 108463511 B CN108463511 B CN 108463511B CN 201780006275 A CN201780006275 A CN 201780006275A CN 108463511 B CN108463511 B CN 108463511B
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thermally conductive
conductive sheet
coated carbon
carbon fibers
carbon fiber
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CN108463511A (zh
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金谷纮希
内田信一
内田俊介
古普塔·里夏
荒卷庆辅
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Dexerials Corp
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Dexerials Corp
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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