JP6294951B2 - 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 - Google Patents

熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 Download PDF

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Publication number
JP6294951B2
JP6294951B2 JP2016254263A JP2016254263A JP6294951B2 JP 6294951 B2 JP6294951 B2 JP 6294951B2 JP 2016254263 A JP2016254263 A JP 2016254263A JP 2016254263 A JP2016254263 A JP 2016254263A JP 6294951 B2 JP6294951 B2 JP 6294951B2
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Prior art keywords
carbon fiber
heat
conductive sheet
heat conductive
insulation
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JP2016254263A
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Japanese (ja)
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JP2017135371A (ja
Inventor
紘希 金谷
紘希 金谷
信一 内田
信一 内田
俊介 内田
俊介 内田
グプタ リシャブ
グプタ リシャブ
荒巻　慶輔
慶輔 荒巻
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Dexerials Corp
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Dexerials Corp
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Priority to TW106101096A priority Critical patent/TWI710590B/zh
Priority to PCT/JP2017/001039 priority patent/WO2017130740A1/ja
Priority to US16/072,671 priority patent/US10734305B2/en
Priority to KR1020187016452A priority patent/KR102141170B1/ko
Priority to EP17743971.8A priority patent/EP3409728B1/en
Priority to CN201780006275.8A priority patent/CN108463511B/zh
Priority to KR1020217011914A priority patent/KR102449343B1/ko
Priority to KR1020207022143A priority patent/KR102245167B1/ko
Publication of JP2017135371A publication Critical patent/JP2017135371A/ja
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Publication of JP6294951B2 publication Critical patent/JP6294951B2/ja
Priority to US16/854,267 priority patent/US20200251402A1/en
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/874—On different surfaces
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    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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