CN108352821B - 水晶振动元件、以及具备该水晶振动元件的水晶振子 - Google Patents

水晶振动元件、以及具备该水晶振动元件的水晶振子 Download PDF

Info

Publication number
CN108352821B
CN108352821B CN201680058556.3A CN201680058556A CN108352821B CN 108352821 B CN108352821 B CN 108352821B CN 201680058556 A CN201680058556 A CN 201680058556A CN 108352821 B CN108352821 B CN 108352821B
Authority
CN
China
Prior art keywords
crystal
vibration
piece
thickness
vibration region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201680058556.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN108352821A (zh
Inventor
木津彻
长谷贵志
镰田威
开田弘明
杉村茂昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN202110685427.XA priority Critical patent/CN113472310B/zh
Publication of CN108352821A publication Critical patent/CN108352821A/zh
Application granted granted Critical
Publication of CN108352821B publication Critical patent/CN108352821B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02062—Details relating to the vibration mode
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H03H9/131—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials consisting of a multilayered structure
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
CN201680058556.3A 2015-10-08 2016-10-07 水晶振动元件、以及具备该水晶振动元件的水晶振子 Active CN108352821B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110685427.XA CN113472310B (zh) 2015-10-08 2016-10-07 水晶振动元件、以及具备该水晶振动元件的水晶振子

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2015200232 2015-10-08
JP2015-200232 2015-10-08
JP2016-059077 2016-03-23
JP2016059077 2016-03-23
JP2016089765 2016-04-27
JP2016-089765 2016-04-27
PCT/JP2016/079920 WO2017061591A1 (ja) 2015-10-08 2016-10-07 水晶振動素子、及びこの水晶振動素子を備える水晶振動子

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202110685427.XA Division CN113472310B (zh) 2015-10-08 2016-10-07 水晶振动元件、以及具备该水晶振动元件的水晶振子

Publications (2)

Publication Number Publication Date
CN108352821A CN108352821A (zh) 2018-07-31
CN108352821B true CN108352821B (zh) 2021-11-23

Family

ID=58487901

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201680058556.3A Active CN108352821B (zh) 2015-10-08 2016-10-07 水晶振动元件、以及具备该水晶振动元件的水晶振子
CN202110685427.XA Active CN113472310B (zh) 2015-10-08 2016-10-07 水晶振动元件、以及具备该水晶振动元件的水晶振子

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202110685427.XA Active CN113472310B (zh) 2015-10-08 2016-10-07 水晶振动元件、以及具备该水晶振动元件的水晶振子

Country Status (5)

Country Link
US (4) US11277115B2 (https=)
JP (2) JP6268629B2 (https=)
CN (2) CN108352821B (https=)
TW (2) TWI718368B (https=)
WO (1) WO2017061591A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113472310B (zh) * 2015-10-08 2025-03-11 株式会社村田制作所 水晶振动元件、以及具备该水晶振动元件的水晶振子

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016132767A1 (ja) * 2015-02-18 2016-08-25 株式会社村田製作所 圧電振動デバイス及びその製造方法
JP6853085B2 (ja) * 2017-03-27 2021-03-31 京セラ株式会社 水晶素子および水晶デバイス
JP6797764B2 (ja) * 2017-08-09 2020-12-09 日本電波工業株式会社 水晶振動子およびその製造方法
WO2019167920A1 (ja) * 2018-02-28 2019-09-06 株式会社村田製作所 振動基板、振動素子、及び振動子
US10840882B2 (en) * 2018-04-24 2020-11-17 Nihon Dempa Kogyo Co., Ltd. Crystal unit and manufacturing method thereof
JP2019193066A (ja) * 2018-04-24 2019-10-31 日本電波工業株式会社 水晶振動子
JP6760430B1 (ja) * 2019-03-27 2020-09-23 株式会社大真空 水晶振動デバイス
US11145726B2 (en) * 2019-10-16 2021-10-12 Applied Materials, Inc. Doped through-contact structures
JP7396858B2 (ja) * 2019-11-01 2023-12-12 日本電波工業株式会社 圧電デバイス及びその製造方法
JP7514196B2 (ja) * 2021-02-12 2024-07-10 日本電波工業株式会社 圧電デバイス及びその製造方法
TWI773193B (zh) * 2021-03-15 2022-08-01 台灣嘉碩科技股份有限公司 晶體裝置及諧振元件
CN115412051A (zh) * 2021-05-28 2022-11-29 日本电波工业株式会社 晶体振子及晶体振子中间物以及晶体振子的制造方法
CN113556099B (zh) * 2021-06-11 2022-10-14 成都泰美克晶体技术有限公司 压电石英晶体振荡片、谐振器和振荡器

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5186977U (https=) * 1974-12-28 1976-07-12
JPS542092A (en) * 1977-06-07 1979-01-09 Nippon Denpa Kogyo Kk Thickness slide piezooelectric vibrator holding structure
JPS5677129U (https=) * 1979-11-16 1981-06-23
JPS61147613A (ja) * 1984-12-21 1986-07-05 Nippon Dempa Kogyo Co Ltd 厚みすべり型圧電振動子
CN101123423A (zh) * 2006-08-09 2008-02-13 爱普生拓优科梦株式会社 At切割水晶振动片及其制造方法
CN101286730A (zh) * 2007-04-10 2008-10-15 爱普生拓优科梦株式会社 轮廓振子
JP2010252303A (ja) * 2009-03-25 2010-11-04 Seiko Epson Corp 屈曲振動片およびそれを用いた発振器
CN104124937A (zh) * 2009-10-27 2014-10-29 精工爱普生株式会社 振动片和振子

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5186977A (ja) * 1975-01-29 1976-07-30 Hitachi Ltd Denkaikokatoranjisutatosonoseizohoho
JPS5636814B2 (https=) 1975-02-21 1981-08-26
JPS5494173U (https=) * 1977-12-16 1979-07-03
JPS5677129A (en) * 1979-11-29 1981-06-25 Yamashiro Seiki Seisakusho:Kk Small portable injection molding machine
JPS60160633U (ja) * 1984-03-31 1985-10-25 御代田精密株式会社 Ａｔカツト小型矩形水晶振動子の電極構造
JPS61123211A (ja) * 1984-11-19 1986-06-11 Murata Mfg Co Ltd 圧電振動子および圧電振動子の振動周波数調整方法
JPS61201512A (ja) * 1985-03-04 1986-09-06 Murata Mfg Co Ltd 圧電振動子
JPH07108039B2 (ja) * 1985-11-01 1995-11-15 耕司 戸田 正方形板振動子駆動方法
JPS63221706A (ja) * 1987-03-11 1988-09-14 Matsushima Kogyo Co Ltd 矩形状ａｔ振動子
JPH0748633B2 (ja) 1987-03-11 1995-05-24 日本ビクター株式会社 オ−デイオ用振幅及び群遅延の調整装置
JP2001007677A (ja) 1999-06-24 2001-01-12 Toyo Commun Equip Co Ltd 水晶振動子
US6621194B1 (en) 1999-11-15 2003-09-16 Matsushita Electric Industrial Co., Ltd. Piezoelectric element having thickness shear vibration and mobile communication device using the same
JP2002340559A (ja) * 2001-05-11 2002-11-27 Piedekku Gijutsu Kenkyusho:Kk 水晶角速度センサ
JP4249502B2 (ja) 2003-02-04 2009-04-02 日本電波工業株式会社 圧電結晶材料及び圧電振動子
JP2006166390A (ja) * 2004-02-05 2006-06-22 Seiko Epson Corp 圧電振動片、圧電振動子及び圧電発振器
JP3838260B2 (ja) 2004-10-14 2006-10-25 株式会社村田製作所 エネルギー閉じ込め型圧電共振子
WO2007023685A1 (ja) 2005-08-22 2007-03-01 Seiko Epson Corporation 圧電デバイス
JP5088613B2 (ja) * 2007-08-06 2012-12-05 セイコーエプソン株式会社 振動デバイスの周波数調整方法、並びに振動デバイスおよび電子デバイス
JP4458203B2 (ja) 2007-12-06 2010-04-28 株式会社村田製作所 圧電振動部品
JP4553047B2 (ja) * 2008-03-12 2010-09-29 セイコーエプソン株式会社 ラム波型共振子及び発振器
JP5589403B2 (ja) * 2010-01-22 2014-09-17 株式会社村田製作所 圧電共振子
JP5589167B2 (ja) * 2010-11-19 2014-09-17 セイコーエプソン株式会社 圧電振動片および圧電振動子
US8963402B2 (en) 2010-11-30 2015-02-24 Seiko Epson Corporation Piezoelectric vibrator element, piezoelectric module, and electronic device
JP2012156978A (ja) 2011-01-05 2012-08-16 Nippon Dempa Kogyo Co Ltd Ａｔカットの水晶振動片、水晶デバイス及び水晶振動片の製造方法
JP5708089B2 (ja) * 2011-03-18 2015-04-30 セイコーエプソン株式会社 圧電振動素子、圧電振動子、圧電発振器及び電子デバイス
JP5773418B2 (ja) * 2011-05-06 2015-09-02 日本電波工業株式会社 圧電振動片、圧電振動片を有する圧電デバイス及び圧電デバイスの製造方法
JP5804825B2 (ja) * 2011-07-29 2015-11-04 京セラクリスタルデバイス株式会社 水晶振動素子及び水晶デバイス
JP2013051512A (ja) 2011-08-30 2013-03-14 Nippon Dempa Kogyo Co Ltd 水晶振動子
JP2013192052A (ja) 2012-03-14 2013-09-26 Nippon Dempa Kogyo Co Ltd 水晶デバイス及びその製造方法。
JP5943186B2 (ja) * 2012-03-19 2016-06-29 セイコーエプソン株式会社 振動片、振動子、電子デバイス、および電子機器
JP5943187B2 (ja) 2012-03-21 2016-06-29 セイコーエプソン株式会社 振動素子、振動子、電子デバイス、および電子機器
JP2013255051A (ja) * 2012-06-06 2013-12-19 Seiko Epson Corp 振動素子、振動子、電子デバイス、電子機器及び振動素子の製造方法
JP2014036426A (ja) 2012-08-10 2014-02-24 Nippon Dempa Kogyo Co Ltd 圧電振動片及び圧電デバイス
JP5423870B2 (ja) 2012-12-25 2014-02-19 セイコーエプソン株式会社 メサ型圧電振動片及び圧電デバイス
US20160164490A1 (en) 2013-03-27 2016-06-09 Nihon Dempa Kogyo Co., Ltd. Piezoelectric device and method for fabricating the same
JP6133697B2 (ja) * 2013-06-12 2017-05-24 日本電波工業株式会社 圧電振動片、圧電デバイス、及び圧電デバイスの製造方法
JP6338367B2 (ja) * 2013-12-24 2018-06-06 日本電波工業株式会社 水晶振動子
US9503045B2 (en) 2015-01-19 2016-11-22 Seiko Epson Corporation Resonator element, resonator, oscillator, electronic apparatus, and moving object
WO2017061591A1 (ja) * 2015-10-08 2017-04-13 株式会社村田製作所 水晶振動素子、及びこの水晶振動素子を備える水晶振動子

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5186977U (https=) * 1974-12-28 1976-07-12
JPS542092A (en) * 1977-06-07 1979-01-09 Nippon Denpa Kogyo Kk Thickness slide piezooelectric vibrator holding structure
JPS5677129U (https=) * 1979-11-16 1981-06-23
JPS61147613A (ja) * 1984-12-21 1986-07-05 Nippon Dempa Kogyo Co Ltd 厚みすべり型圧電振動子
CN101123423A (zh) * 2006-08-09 2008-02-13 爱普生拓优科梦株式会社 At切割水晶振动片及其制造方法
CN101286730A (zh) * 2007-04-10 2008-10-15 爱普生拓优科梦株式会社 轮廓振子
JP2010252303A (ja) * 2009-03-25 2010-11-04 Seiko Epson Corp 屈曲振動片およびそれを用いた発振器
CN104124937A (zh) * 2009-10-27 2014-10-29 精工爱普生株式会社 振动片和振子

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
The finite element analysis of thickness-shear vibrations of quartz crystal plates with ANSYS;Ji Wang;《2009 Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA 2009)》;20100311;545-548 *
多方向宽频带压电式振动能量采集器研究进展;陈仁文;《仪器仪表学报》;20121231;2641-2652 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113472310B (zh) * 2015-10-08 2025-03-11 株式会社村田制作所 水晶振动元件、以及具备该水晶振动元件的水晶振子

Also Published As

Publication number Publication date
JP2017220954A (ja) 2017-12-14
TWI718368B (zh) 2021-02-11
US20180226944A1 (en) 2018-08-09
US20180226943A1 (en) 2018-08-09
US11075615B2 (en) 2021-07-27
JPWO2017061591A1 (ja) 2017-10-19
US11139796B2 (en) 2021-10-05
US11277115B2 (en) 2022-03-15
CN113472310B (zh) 2025-03-11
TW201727955A (zh) 2017-08-01
US20180241372A1 (en) 2018-08-23
TW201830741A (zh) 2018-08-16
TWI630737B (zh) 2018-07-21
US20180248536A1 (en) 2018-08-30
CN108352821A (zh) 2018-07-31
CN113472310A (zh) 2021-10-01
JP6819882B2 (ja) 2021-01-27
JP6268629B2 (ja) 2018-01-31
US11038485B2 (en) 2021-06-15
WO2017061591A1 (ja) 2017-04-13

Similar Documents

Publication Publication Date Title
CN108352821B (zh) 水晶振动元件、以及具备该水晶振动元件的水晶振子
US9948275B2 (en) Piezoelectric vibration element, piezoelectric vibrator, piezoelectric oscillator, and electronic device
JP4936221B2 (ja) メサ型圧電振動片、メサ型圧電振動デバイス、発振器、及び電子機器
JP5046012B2 (ja) 振動片、振動デバイス、発振器及び電子機器
JP5796355B2 (ja) 圧電振動素子、圧電振動子、電子デバイス、及び電子機器
JP5824967B2 (ja) 振動素子、振動子、電子デバイス、及び電子機器
US10848125B2 (en) Quartz crystal resonator unit
WO2007032444A1 (ja) 水晶振動子
JP5413486B2 (ja) 振動片、振動デバイス、発振器、及び電子機器
JP5293852B2 (ja) メサ型圧電振動片、メサ型圧電振動デバイス、発振器、及び電子機器
WO1991012662A1 (fr) Structure d'un resonateur piezoelectrique a couche ultra-mince
JP5943160B2 (ja) Ｓｃカット水晶基板、振動素子、電子デバイス、発振器、及び電子機器
JP5887968B2 (ja) Ｓｃカット水晶基板、振動素子、電子デバイス、発振器、及び電子機器
JP2001007676A (ja) 短冊形ａｔカット水晶振動子

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant