CN108350320B - 粘接剂组合物和结构体 - Google Patents

粘接剂组合物和结构体 Download PDF

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Publication number
CN108350320B
CN108350320B CN201680062847.XA CN201680062847A CN108350320B CN 108350320 B CN108350320 B CN 108350320B CN 201680062847 A CN201680062847 A CN 201680062847A CN 108350320 B CN108350320 B CN 108350320B
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China
Prior art keywords
mass
group
adhesive composition
silane compound
circuit
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CN201680062847.XA
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English (en)
Chinese (zh)
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CN108350320A (zh
Inventor
森尻智树
竹田津润
田中胜
立泽贵
工藤直
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Resonac Corp
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Showa Denko KK
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Combinations Of Printed Boards (AREA)
CN201680062847.XA 2015-11-04 2016-11-02 粘接剂组合物和结构体 Active CN108350320B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-216516 2015-11-04
JP2015216516 2015-11-04
PCT/JP2016/082645 WO2017078087A1 (ja) 2015-11-04 2016-11-02 接着剤組成物及び構造体

Publications (2)

Publication Number Publication Date
CN108350320A CN108350320A (zh) 2018-07-31
CN108350320B true CN108350320B (zh) 2021-11-26

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ID=58662435

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680062847.XA Active CN108350320B (zh) 2015-11-04 2016-11-02 粘接剂组合物和结构体

Country Status (5)

Country Link
JP (2) JP6915544B2 (enExample)
KR (1) KR102608218B1 (enExample)
CN (1) CN108350320B (enExample)
TW (1) TWI786036B (enExample)
WO (1) WO2017078087A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI671921B (zh) 2018-09-14 2019-09-11 頎邦科技股份有限公司 晶片封裝構造及其晶片
EP4240801B1 (en) * 2020-11-05 2025-09-03 Henkel AG & Co. KGaA Anti-flutter adhesive composition

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101675715A (zh) * 2007-05-09 2010-03-17 日立化成工业株式会社 膜状电路连接材料及电路部件的连接结构
CN102942881A (zh) * 2006-05-09 2013-02-27 日立化成工业株式会社 粘接片、使用其的电路构件的连接结构及半导体器件
CN103360956A (zh) * 2013-06-18 2013-10-23 明基材料有限公司 一种用于电子元件间电性导通的粘着剂
CN103764776A (zh) * 2011-09-06 2014-04-30 日立化成株式会社 粘接剂组合物和连接体
CN104559902A (zh) * 2013-10-09 2015-04-29 日立化成株式会社 电路连接材料、电路构件的连接结构体、和电路构件的连接结构体的制造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002285103A (ja) * 2001-03-26 2002-10-03 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JP4004333B2 (ja) * 2001-06-05 2007-11-07 松下電器産業株式会社 半導体モジュール
JP2004067908A (ja) * 2002-08-07 2004-03-04 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JP4146747B2 (ja) * 2003-03-26 2008-09-10 積水化学工業株式会社 硬化性組成物
JP2006022231A (ja) * 2004-07-08 2006-01-26 Sumitomo Bakelite Co Ltd 異方導電性接着剤および異方導電性接着剤フィルム
JPWO2009063827A1 (ja) 2007-11-12 2011-03-31 日立化成工業株式会社 回路接続材料、及び回路部材の接続構造
KR101343864B1 (ko) * 2009-03-23 2013-12-20 세메다인 가부시키 가이샤 경화성 조성물
JP2011199097A (ja) * 2010-03-23 2011-10-06 Sumitomo Bakelite Co Ltd 半導体装置の製造方法
JP2012072305A (ja) * 2010-09-29 2012-04-12 Hitachi Chemical Co Ltd 樹脂ペースト組成物
JP5909911B2 (ja) * 2011-07-29 2016-04-27 住友ベークライト株式会社 液状樹脂組成物および半導体装置
JP5934528B2 (ja) 2012-03-12 2016-06-15 デクセリアルズ株式会社 回路接続材料、及びそれを用いた実装体の製造方法
JP6250265B2 (ja) * 2012-03-16 2017-12-20 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
KR102329065B1 (ko) * 2012-04-25 2021-11-18 쇼와덴코머티리얼즈가부시끼가이샤 회로 접속 재료, 회로 접속 구조체, 접착 필름 및 권중체
JP2013253151A (ja) * 2012-06-06 2013-12-19 Hitachi Chemical Co Ltd 回路接続用接着フィルム、並びに回路部材の接続構造体及びその製造方法
CN103131336B (zh) * 2013-03-22 2015-06-10 苏州度辰新材料有限公司 一种硅烷交联的乙烯醋酸乙烯共聚物胶膜的制备方法
JP6437323B2 (ja) * 2014-02-14 2018-12-12 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102942881A (zh) * 2006-05-09 2013-02-27 日立化成工业株式会社 粘接片、使用其的电路构件的连接结构及半导体器件
CN101675715A (zh) * 2007-05-09 2010-03-17 日立化成工业株式会社 膜状电路连接材料及电路部件的连接结构
CN103764776A (zh) * 2011-09-06 2014-04-30 日立化成株式会社 粘接剂组合物和连接体
CN103360956A (zh) * 2013-06-18 2013-10-23 明基材料有限公司 一种用于电子元件间电性导通的粘着剂
CN104559902A (zh) * 2013-10-09 2015-04-29 日立化成株式会社 电路连接材料、电路构件的连接结构体、和电路构件的连接结构体的制造方法

Also Published As

Publication number Publication date
TW201724924A (zh) 2017-07-01
WO2017078087A1 (ja) 2017-05-11
TWI786036B (zh) 2022-12-11
JP2021165397A (ja) 2021-10-14
JP7124936B2 (ja) 2022-08-24
JPWO2017078087A1 (ja) 2018-09-06
KR20180079370A (ko) 2018-07-10
CN108350320A (zh) 2018-07-31
JP6915544B2 (ja) 2021-08-04
KR102608218B1 (ko) 2023-11-30

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