CN108290381A - 叠层体基板、导电性基板、叠层体基板的制造方法、导电性基板的制造方法 - Google Patents

叠层体基板、导电性基板、叠层体基板的制造方法、导电性基板的制造方法 Download PDF

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Publication number
CN108290381A
CN108290381A CN201680067064.0A CN201680067064A CN108290381A CN 108290381 A CN108290381 A CN 108290381A CN 201680067064 A CN201680067064 A CN 201680067064A CN 108290381 A CN108290381 A CN 108290381A
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CN
China
Prior art keywords
alloy
layer
copper
mass
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680067064.0A
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English (en)
Chinese (zh)
Inventor
永田纯
永田纯一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority claimed from PCT/JP2016/084949 external-priority patent/WO2017094611A1/ja
Publication of CN108290381A publication Critical patent/CN108290381A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0036—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
CN201680067064.0A 2015-11-30 2016-11-25 叠层体基板、导电性基板、叠层体基板的制造方法、导电性基板的制造方法 Pending CN108290381A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2015234107 2015-11-30
JP2015-234107 2015-11-30
JP2016-022265 2016-02-08
JP2016022265A JP6627551B2 (ja) 2015-11-30 2016-02-08 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法
PCT/JP2016/084949 WO2017094611A1 (ja) 2015-11-30 2016-11-25 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法

Publications (1)

Publication Number Publication Date
CN108290381A true CN108290381A (zh) 2018-07-17

Family

ID=59059848

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680067064.0A Pending CN108290381A (zh) 2015-11-30 2016-11-25 叠层体基板、导电性基板、叠层体基板的制造方法、导电性基板的制造方法

Country Status (3)

Country Link
JP (1) JP6627551B2 (ja)
KR (1) KR102544426B1 (ja)
CN (1) CN108290381A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115243545A (zh) * 2020-03-27 2022-10-25 三菱综合材料株式会社 抗菌部件

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022130892A1 (ja) * 2020-12-15 2022-06-23 国立研究開発法人物質・材料研究機構 銅ニッケル合金電極用導電性インク、銅ニッケル合金電極付基板、および、それらの製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61163289A (ja) * 1985-01-14 1986-07-23 Nippon Kagaku Sangyo Kk ニツケル及びニツケル合金による黒色電気めつき浴
CN102214539A (zh) * 2010-04-08 2011-10-12 旭硝子株式会社 带金属图案的基板的制造方法及带金属层叠体的基板
CN102751043A (zh) * 2011-04-20 2012-10-24 日东电工株式会社 导电性层叠薄膜的制造方法
US20140333855A1 (en) * 2013-05-10 2014-11-13 Samsung Electro-Mecahnics Co., Ltd. Touch sensor
JP2015069440A (ja) * 2013-09-30 2015-04-13 大日本印刷株式会社 タッチパネルセンサおよびタッチパネルモジュール
CN104775064A (zh) * 2014-01-14 2015-07-15 Sh铜制品株式会社 溅射靶材、溅射靶材的制造方法和配线层积体

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4086132B2 (ja) 2001-11-16 2008-05-14 株式会社ブリヂストン 透明導電性フィルムおよびタッチパネル
JP4411849B2 (ja) 2003-02-26 2010-02-10 セイコーエプソン株式会社 カラー表示装置
JP5361579B2 (ja) 2009-07-09 2013-12-04 信越ポリマー株式会社 大型ディスプレイ用のセンサパネル及びその製造方法
KR20120010795A (ko) 2010-07-27 2012-02-06 삼성전기주식회사 터치패널 일체형 전자종이
JP2013069261A (ja) 2011-09-08 2013-04-18 Dainippon Printing Co Ltd タッチパネル用電極基材、及びタッチパネル、並びに画像表示装置
JP5613143B2 (ja) * 2011-12-06 2014-10-22 株式会社神戸製鋼所 タッチパネルセンサー用Ｃｕ合金配線膜、及びタッチパネルセンサー
JP5364186B2 (ja) * 2012-02-27 2013-12-11 積水ナノコートテクノロジー株式会社 金属層付き導電性フィルム、その製造方法及びそれを含有するタッチパネル
JP5918614B2 (ja) * 2012-04-24 2016-05-18 グンゼ株式会社 導電性基板、タッチパネル、および導電性基板の製造方法
JP6207406B2 (ja) * 2014-01-14 2017-10-04 株式会社Ｓｈカッパープロダクツ スパッタリングターゲット材及び配線積層体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61163289A (ja) * 1985-01-14 1986-07-23 Nippon Kagaku Sangyo Kk ニツケル及びニツケル合金による黒色電気めつき浴
CN102214539A (zh) * 2010-04-08 2011-10-12 旭硝子株式会社 带金属图案的基板的制造方法及带金属层叠体的基板
CN102751043A (zh) * 2011-04-20 2012-10-24 日东电工株式会社 导电性层叠薄膜的制造方法
US20140333855A1 (en) * 2013-05-10 2014-11-13 Samsung Electro-Mecahnics Co., Ltd. Touch sensor
JP2015069440A (ja) * 2013-09-30 2015-04-13 大日本印刷株式会社 タッチパネルセンサおよびタッチパネルモジュール
CN104775064A (zh) * 2014-01-14 2015-07-15 Sh铜制品株式会社 溅射靶材、溅射靶材的制造方法和配线层积体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115243545A (zh) * 2020-03-27 2022-10-25 三菱综合材料株式会社 抗菌部件

Also Published As

Publication number Publication date
KR102544426B1 (ko) 2023-06-15
KR20180088800A (ko) 2018-08-07
JP2017107524A (ja) 2017-06-15
JP6627551B2 (ja) 2020-01-08

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Application publication date: 20180717