KR102544426B1 - 적층체 기판, 도전성 기판, 적층체 기판 제조방법 및 도전성 기판 제조방법 - Google Patents

적층체 기판, 도전성 기판, 적층체 기판 제조방법 및 도전성 기판 제조방법 Download PDF

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Publication number
KR102544426B1
KR102544426B1 KR1020187012913A KR20187012913A KR102544426B1 KR 102544426 B1 KR102544426 B1 KR 102544426B1 KR 1020187012913 A KR1020187012913 A KR 1020187012913A KR 20187012913 A KR20187012913 A KR 20187012913A KR 102544426 B1 KR102544426 B1 KR 102544426B1
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KR
South Korea
Prior art keywords
layer
alloy
copper
alloy layer
substrate
Prior art date
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KR1020187012913A
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English (en)
Korean (ko)
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KR20180088800A (ko
Inventor
준이치 나가타
Original Assignee
스미토모 긴조쿠 고잔 가부시키가이샤
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Priority claimed from PCT/JP2016/084949 external-priority patent/WO2017094611A1/ja
Publication of KR20180088800A publication Critical patent/KR20180088800A/ko
Application granted granted Critical
Publication of KR102544426B1 publication Critical patent/KR102544426B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0036—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
KR1020187012913A 2015-11-30 2016-11-25 적층체 기판, 도전성 기판, 적층체 기판 제조방법 및 도전성 기판 제조방법 KR102544426B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2015234107 2015-11-30
JPJP-P-2015-234107 2015-11-30
JPJP-P-2016-022265 2016-02-08
JP2016022265A JP6627551B2 (ja) 2015-11-30 2016-02-08 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法
PCT/JP2016/084949 WO2017094611A1 (ja) 2015-11-30 2016-11-25 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法

Publications (2)

Publication Number Publication Date
KR20180088800A KR20180088800A (ko) 2018-08-07
KR102544426B1 true KR102544426B1 (ko) 2023-06-15

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Application Number Title Priority Date Filing Date
KR1020187012913A KR102544426B1 (ko) 2015-11-30 2016-11-25 적층체 기판, 도전성 기판, 적층체 기판 제조방법 및 도전성 기판 제조방법

Country Status (3)

Country Link
JP (1) JP6627551B2 (ja)
KR (1) KR102544426B1 (ja)
CN (1) CN108290381A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230115585A1 (en) * 2020-03-27 2023-04-13 Mitsubishi Materials Corporation Antimicrobial member
WO2022130892A1 (ja) * 2020-12-15 2022-06-23 国立研究開発法人物質・材料研究機構 銅ニッケル合金電極用導電性インク、銅ニッケル合金電極付基板、および、それらの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
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JP2013119632A (ja) * 2011-12-06 2013-06-17 Kobe Steel Ltd タッチパネルセンサー用Ｃｕ合金配線膜、及びタッチパネルセンサー、並びにスパッタリングターゲット
JP2015131996A (ja) * 2014-01-14 2015-07-23 株式会社Ｓｈカッパープロダクツ スパッタリングターゲット材及び配線積層体

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JPS61163289A (ja) * 1985-01-14 1986-07-23 Nippon Kagaku Sangyo Kk ニツケル及びニツケル合金による黒色電気めつき浴
JP4086132B2 (ja) 2001-11-16 2008-05-14 株式会社ブリヂストン 透明導電性フィルムおよびタッチパネル
JP4411849B2 (ja) 2003-02-26 2010-02-10 セイコーエプソン株式会社 カラー表示装置
JP5361579B2 (ja) 2009-07-09 2013-12-04 信越ポリマー株式会社 大型ディスプレイ用のセンサパネル及びその製造方法
JP2011233872A (ja) * 2010-04-08 2011-11-17 Asahi Glass Co Ltd 金属パターン付き基板の製造方法及び金属積層体付き基板
KR20120010795A (ko) 2010-07-27 2012-02-06 삼성전기주식회사 터치패널 일체형 전자종이
JP5914036B2 (ja) * 2011-04-20 2016-05-11 日東電工株式会社 導電性積層フィルムの製造方法
JP2013069261A (ja) 2011-09-08 2013-04-18 Dainippon Printing Co Ltd タッチパネル用電極基材、及びタッチパネル、並びに画像表示装置
JP5364186B2 (ja) * 2012-02-27 2013-12-11 積水ナノコートテクノロジー株式会社 金属層付き導電性フィルム、その製造方法及びそれを含有するタッチパネル
JP5918614B2 (ja) * 2012-04-24 2016-05-18 グンゼ株式会社 導電性基板、タッチパネル、および導電性基板の製造方法
US9519366B2 (en) * 2013-05-10 2016-12-13 Samsung Electro-Mechanics Co., Ltd. Touch sensor
JP2015069440A (ja) * 2013-09-30 2015-04-13 大日本印刷株式会社 タッチパネルセンサおよびタッチパネルモジュール
KR20150084670A (ko) * 2014-01-14 2015-07-22 가부시키가이샤 에스에이치 카퍼프로덕츠 스퍼터링 타겟재, 스퍼터링 타겟재의 제조 방법 및 배선 적층체

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013119632A (ja) * 2011-12-06 2013-06-17 Kobe Steel Ltd タッチパネルセンサー用Ｃｕ合金配線膜、及びタッチパネルセンサー、並びにスパッタリングターゲット
JP2015131996A (ja) * 2014-01-14 2015-07-23 株式会社Ｓｈカッパープロダクツ スパッタリングターゲット材及び配線積層体

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Publication number Publication date
KR20180088800A (ko) 2018-08-07
JP2017107524A (ja) 2017-06-15
JP6627551B2 (ja) 2020-01-08
CN108290381A (zh) 2018-07-17

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