CN108257875A - 芯片封装基板、芯片封装结构及二者的制作方法 - Google Patents
芯片封装基板、芯片封装结构及二者的制作方法 Download PDFInfo
- Publication number
- CN108257875A CN108257875A CN201611240676.3A CN201611240676A CN108257875A CN 108257875 A CN108257875 A CN 108257875A CN 201611240676 A CN201611240676 A CN 201611240676A CN 108257875 A CN108257875 A CN 108257875A
- Authority
- CN
- China
- Prior art keywords
- layer
- conductive circuit
- dielectric layer
- circuit layer
- weld pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 title claims description 16
- 238000007747 plating Methods 0.000 claims abstract description 52
- 229910000679 solder Inorganic materials 0.000 claims abstract description 23
- 238000009713 electroplating Methods 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims description 425
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 239000011889 copper foil Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 239000000084 colloidal system Substances 0.000 claims description 11
- 238000012856 packing Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 8
- 238000013007 heat curing Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 238000010792 warming Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000001723 curing Methods 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims description 2
- 229910000906 Bronze Inorganic materials 0.000 claims 1
- 239000010974 bronze Substances 0.000 claims 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000010301 surface-oxidation reaction Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10212—Programmable component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611240676.3A CN108257875B (zh) | 2016-12-28 | 2016-12-28 | 芯片封装基板、芯片封装结构及二者的制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611240676.3A CN108257875B (zh) | 2016-12-28 | 2016-12-28 | 芯片封装基板、芯片封装结构及二者的制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108257875A true CN108257875A (zh) | 2018-07-06 |
CN108257875B CN108257875B (zh) | 2021-11-23 |
Family
ID=62719847
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201611240676.3A Active CN108257875B (zh) | 2016-12-28 | 2016-12-28 | 芯片封装基板、芯片封装结构及二者的制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108257875B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111148373A (zh) * | 2018-11-06 | 2020-05-12 | 欣兴电子股份有限公司 | 电路板制造方法 |
CN113784529A (zh) * | 2020-06-09 | 2021-12-10 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板及其制作方法 |
US11419222B2 (en) | 2018-10-29 | 2022-08-16 | Unimicron Technology Corp. | Method of manufacturing circuit board |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1697163A (zh) * | 2004-05-12 | 2005-11-16 | 日本电气株式会社 | 布线板及使用该板的半导体封装 |
CN101023716A (zh) * | 2004-09-21 | 2007-08-22 | Ibiden株式会社 | 柔性印刷配线板 |
CN101436548A (zh) * | 2007-11-15 | 2009-05-20 | 钰桥半导体股份有限公司 | 无核层多层封装基板的制作方法 |
CN101507373A (zh) * | 2006-06-30 | 2009-08-12 | 日本电气株式会社 | 布线板、使用布线板的半导体器件、及其制造方法 |
US20100163293A1 (en) * | 2008-12-29 | 2010-07-01 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing printed wiring board |
CN101982028A (zh) * | 2008-03-28 | 2011-02-23 | 日立化成工业株式会社 | 配线板的制造方法、光电复合部件的制造方法以及光电复合基板的制造方法 |
CN102056398A (zh) * | 2009-11-06 | 2011-05-11 | 欣兴电子股份有限公司 | 电路板结构及其制法 |
CN102170745A (zh) * | 2010-02-26 | 2011-08-31 | 日本特殊陶业株式会社 | 多层布线板及其制造方法 |
CN103367339A (zh) * | 2012-03-26 | 2013-10-23 | 宏启胜精密电子(秦皇岛)有限公司 | 芯片封装方法及芯片封装结构 |
TWI474450B (zh) * | 2013-09-27 | 2015-02-21 | Subtron Technology Co Ltd | 封裝載板及其製作方法 |
CN105492557A (zh) * | 2013-08-29 | 2016-04-13 | 三井化学东赛璐株式会社 | 粘接膜和半导体装置的制造方法 |
CN105874583A (zh) * | 2013-12-26 | 2016-08-17 | 日东电工株式会社 | 电子部件装置的制造方法和电子部件密封用片 |
CN205595327U (zh) * | 2016-03-07 | 2016-09-21 | 武汉光谷创元电子有限公司 | 无芯封装基板 |
-
2016
- 2016-12-28 CN CN201611240676.3A patent/CN108257875B/zh active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1697163A (zh) * | 2004-05-12 | 2005-11-16 | 日本电气株式会社 | 布线板及使用该板的半导体封装 |
CN101023716A (zh) * | 2004-09-21 | 2007-08-22 | Ibiden株式会社 | 柔性印刷配线板 |
CN101507373A (zh) * | 2006-06-30 | 2009-08-12 | 日本电气株式会社 | 布线板、使用布线板的半导体器件、及其制造方法 |
CN101436548A (zh) * | 2007-11-15 | 2009-05-20 | 钰桥半导体股份有限公司 | 无核层多层封装基板的制作方法 |
CN101982028A (zh) * | 2008-03-28 | 2011-02-23 | 日立化成工业株式会社 | 配线板的制造方法、光电复合部件的制造方法以及光电复合基板的制造方法 |
US20100163293A1 (en) * | 2008-12-29 | 2010-07-01 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing printed wiring board |
CN102056398A (zh) * | 2009-11-06 | 2011-05-11 | 欣兴电子股份有限公司 | 电路板结构及其制法 |
CN102170745A (zh) * | 2010-02-26 | 2011-08-31 | 日本特殊陶业株式会社 | 多层布线板及其制造方法 |
CN103367339A (zh) * | 2012-03-26 | 2013-10-23 | 宏启胜精密电子(秦皇岛)有限公司 | 芯片封装方法及芯片封装结构 |
CN105492557A (zh) * | 2013-08-29 | 2016-04-13 | 三井化学东赛璐株式会社 | 粘接膜和半导体装置的制造方法 |
TWI474450B (zh) * | 2013-09-27 | 2015-02-21 | Subtron Technology Co Ltd | 封裝載板及其製作方法 |
CN105874583A (zh) * | 2013-12-26 | 2016-08-17 | 日东电工株式会社 | 电子部件装置的制造方法和电子部件密封用片 |
CN205595327U (zh) * | 2016-03-07 | 2016-09-21 | 武汉光谷创元电子有限公司 | 无芯封装基板 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11419222B2 (en) | 2018-10-29 | 2022-08-16 | Unimicron Technology Corp. | Method of manufacturing circuit board |
CN111148373A (zh) * | 2018-11-06 | 2020-05-12 | 欣兴电子股份有限公司 | 电路板制造方法 |
CN113784529A (zh) * | 2020-06-09 | 2021-12-10 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板及其制作方法 |
CN113784529B (zh) * | 2020-06-09 | 2023-01-17 | 宏启胜精密电子(秦皇岛)有限公司 | 电路板及其制作方法 |
Also Published As
Publication number | Publication date |
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CN108257875B (zh) | 2021-11-23 |
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Effective date of registration: 20240204 Address after: 066004 No. 18-2, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province Patentee after: Liding semiconductor technology Qinhuangdao Co.,Ltd. Country or region after: China Address before: 066004 No. 18-2, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province Patentee before: Liding semiconductor technology Qinhuangdao Co.,Ltd. Country or region before: China Patentee before: Qi Ding Technology Qinhuangdao Co.,Ltd. |