CN1080935C - 凸起成形方法 - Google Patents
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Abstract
一种凸起成形方法,焊炬接近从毛细管工具伸出的引线底端成形一球,然后第一夹持器夹持该引线使毛细管工具下降,这个球处于毛细管工具中心孔底端,第一夹持器夹持该引线,使其不下降,毛细管工具下降而切割引线。而且,毛细管工具进一步下降,使这个球压靠在一个工件电极上,并把球接合在电极上成形为一个凸起。由压力夹具对尾端加压而压扁从凸起伸出的尾端,使凸起高度一致。因此,球牢固地接合在电极上。球和电极间的连接面不损伤。
Description
本发明涉及一种凸起(bump)成形方法,用于在工件的电极上成形凸起。
已知使用引线接合技术的一种方法作为在工件(如集成电路芯片)的电极上成形凸起(突出的电极)的一种方法。下面叙述一种普通的凸起成形方法。
图19A,19B,19C和19D和图20图解说明一种普通凸起成形方法的示意图。如图19A所示,使焊炬3接近引线2的底端,并在其间产生火花,在由毛细管工具1伸出的引线2底端形成一个球4。标号5表示位于毛细管工具1以上的,用于保持引线2的一个第一夹持器,标号6表示位于第一夹持器5以上的并在引线2上施加一个拉力的一个第二夹持器。
如图19B所示,使毛细管工具1下降,球4压靠在工件7电极上。标号8表示其上安装工件7的一个底板,如图19C所示,稍微提高毛细管工具,引线2(也称为尾端)导入并从毛细管工具底端伸出一个形成下一个球所必需的长度,然后,金属线2由第一个夹持器5夹紧。之后,如图19D所示,第一夹持器5和毛细管工具1连同夹住的引线2一起上升,在刚好超过球4时切割引线2,因而完成了一系列操作,在工件7的电极上形成球4。
图20示出如图19C所示的球4粘合在工件7电极上,第一夹持器夹持引线2并使引线2上升而被切割步骤的放大状态图。标号“a”表示切割线,1a表示引线插入在其中的毛细管工具1的中心孔。夹持引线2上升,引线2在刚好超过球4的切割线“a”处被强行切割。在这种情况,球(凸起)4与工件7的电极7a之间的连接面上产生一个大的拉伸应力。因此,存在球(凸起)4易于从电极7A脱开和球(凸起)4和电极7a间的连接面易于损伤等问题。在图20中,球4底部黑色部分是一个损伤部分。
因此,本发明的一个目的是提供一种凸起成形装置及成形方法,使引线底端可坚固地粘合在工件上,防止球(凸起)和电极连接面的损伤。
为实现本发明的上述目的,本发明提供了一种凸起成形方法,包括:使焊炬接近插入毛细管工具中心孔并向下伸出的引线底端,并在引线底端与焊炬之间产生火花在引线底端成形一个球的步骤,使毛细管工具相对于引线下降而把这个球与引线分开的步骤,进一步下降毛细管工具把这个球压靠在工件电极上从而把这个球接合在电极上的步骤。
优选地,凸起成形方法还包括在把球接合到电极上之后,使上述毛细管工具上升,从上述毛细管工具底端带出上述引线底端。
优选地,凸起成形方法还在把球接合到电极上以后,用一个压力夹具对靠在上述工件电极表面的上述球的上侧面加压。
优选地,凸起成形方法还包括在上述加压步骤中对多个上述接合的球加压。
下面参照附图及实施例详细说明本发明,附图中:
图1是按照本发明的一个实施例的凸起成形装置的一个侧视图。
图2是按照本发明的一个实施例的凸起成形装置的一个局部透视图。
图3-16是本发明的一个凸起成形方法的工艺过程图。
图17是按照本发明的一个实施例的凸起成形方法的工艺过程中切割引线时的毛细管局部放大截面图。
图18是按照本发明另一实施例的凸起成形方法的一个工艺过程图。
图19A-D是一个普通凸起成形方法的工艺过程图。
图20是一个普通凸起成形方法的过程的一个局部放大图。
按照本发明,在引线底端的一个球接合到工件电极上之前,引线就被切割,然后这个球压靠并接合到工件电极上,球的底部不损伤并紧固地接合到电极上,因而可以成形一个凸起。而且,经由一个压力夹具在凸起上侧加压,从凸起突出的一个尾端被压扁,并使凸起上侧高度均匀。
下面参照附图叙述本发明的一个实施例。图1是按照本发明的一个实施例的凸起成形装置的一个侧视图。图2是按照本发明的一个实施例的凸起成形装置的一个局部透视图。图3-16是本发明的一个凸起成形方法的工艺过程图。而图17是按照本发明的一个实施例的凸起成形方法的工艺过程中切割引线时的毛细管局部放大截面图。
首先,参照图1叙述一种凸起成形装置的总体结构,在图11中,标号11表示一个柄臂(连接臂),毛细管工具12固定在这个柄臂的前端。毛细管工具12是一个空心圆柱体,一根引线13插入其中心孔12a内(见图17)。一个超声发生器34安装到柄臂11的根部。经由一个未示出的拉伸机构给引线13施加一个向上的恒定拉力。
柄臂11枢轴连接到一个支架16上与一个摇臂15成为一体。因此。它可以绕销17垂直摇动。标号18表示支架16的一个底座。一个滚柱19枢轴连到摇臂15的后端。滚柱19与一个凸轮20接触。标号21表示一个产生弹性的弹簧,用于使滚柱19与凸轮20保持接触。当驱动电动机22时,凸轮20转动,摇臂15和柄臂11一体绕销17垂直摇动,因此,毛细管工具12垂直移动。这就是说,滚柱19,凸轮20,弹簧21和电动机22构成一种垂直移动机构用于垂直移动柄臂11和毛细管工具12。作为垂直移动机构,也可采用有直线电动机和音圈的一种机构或有滚球丝杠进给型的一种机构。
棒23垂直转动地枢轴连接在摇臂15前端的一个销24上。一个致动器25安装在棒23的前端。在图2中,致动器25卡住一对左、右第二夹持器。夹持部分27分别安装在第二夹持器26的一个内表面。在驱动致动器25时,第二夹持器26打开或闭合。第二夹持器26闭合时,夹持部分27轻微夹住引线13。引线13被夹住时,它可以纵向(垂直方向)滑动。特别使用夹持部分27使得在它被夹住时引线13可垂直滑动,夹持部分可以由弹性材料如毛毡或弹性树脂制造。
在图1中,棒23的后端通过一个压电元件35与摇臂15上端连接。这个压电元件35的特征是:加电压时它伸长或收缩。因此,当压电元件35收缩时,棒23绕销24垂直摇动。就是说,压电元件35作为间距变化装置用以改变毛细管和第二夹持器之间的间距。因此,由第二夹持器夹住引线,并由间距变化装置使毛细管工具12接近这个第二夹持器,则可实现引线13尾端的伸展(从毛细管工具12的底端带出引线13底端到预定长度的操作)。当驱动电动机20时,摇臂15垂直摇动,棒23与柄臂11整体摇动,第二夹持器与毛细管工具12整体垂直移动。
在图2中,第一夹持器28设在第二夹持器26之上。第一夹持器28由一个致动器29卡住,当驱动致动器29时,它打开或闭合以保持或松开引线13。安装在第一夹持器28内表面的夹具部分30由如不锈钢一类硬构件制造以便牢固夹住引线13。致动器29紧固在轴31上。如图19所示,第二夹持器通常设在第一夹持器之上,然而,在本发明的凸起成形装置中,第二夹持器26设在第一夹持器28之下,而且为第二夹持器26设置有前述的夹具部分27。因此,上述这种有特色的结构可以使将要提及的一个球14配合到毛细管工具12中心孔12a的底端并保持住这个球,而且带出引线13的尾端。
标号36表示一个焊炬,使焊炬36的前端接近从毛细管工具12底端伸出的引线13底端,并同时给焊炬36加一个高电压则在焊炬36前端与引线13底端之间产生火花,并在引线13底端成形球14。标号10表示用作工件的一个芯片,安装在基座33上(图1)。如图2所示,芯片10上形成多个电极10a,如后面将要叙述的,在这些电极10a上成形凸起14。
本发明的凸起成形装置的构成已如上所述,下面参照图3-17叙述一种凸起成形方法。首先,如图3和图4所示,使毛细管工具12接近引线13底端,同时使毛细管工具12对准芯片10,然后,在焊炬36与引线13底端之间产生火花,从而在引线14底端成形其外径大于毛细管工具12中心孔12a内径的球14。在图3和图4步骤中,第二夹持器26和第一夹持器28都闭合夹住引线13。
然后,第一夹持器28打开,解除夹持状态(图5),驱动电动机使摇臂5垂直摇动。因此,毛细管工具12和第二夹持器26对着芯片10下降(图6)。这时压电元件36被驱动,第二夹持器26相对于毛细管工具12而上升从而增加第二夹持器26和毛细管工具12之间的间距。第二夹持器26的这种操作是为取消后面要进行的引线13尾端步骤的一种预备操作,因此,第二夹持器26可以在尾端带出步骤中夹持引线13而接近毛细管工具12。
此外,按照第二夹持器的这种操作,引线13也相对于毛细管12上升,因此,球14配置到毛细管工具12的中心孔12a(图7)。
当球14接近工件10时,第一夹持器28闭合防止引线13下降(图8)。当毛细管工具12在上述状态下进一步下降,毛细管工具12使球14与引线13强行分开,因为第一夹持器28使引线13不能下降(图9)。当然,上述强制性操作也可经由第一夹持器28牢固地夹持引线13和使引线13上升而进行。无论如何,重要的是使毛细管工具12相对于引线13的球14下降。
图17示出上述操作时邻近毛细管工具12底端一个区域的放大截面图。在图4所示步骤中,经过火花在引线13底端成形球14。有火花时,由于内流引起的焦耳热,引线13底端附近被加热到高温,由于高温使引线13熔化而形成球14。因为引线13底端附近被加热到高温,故其组织弱化。因此,对引线13施加一个拉力时,如图17所示,引线13正好在超过球14的部分被切割。另外,如图6和图7步骤所述,使球14配合于中心孔12a的底端和夹持而保持它。
如图10所示,毛细管工具12下降,把球14压靠在芯片10的电极10a上而把这个球接合到电极上。然后,第一夹持器28打开,而毛细管工具12和第二夹持器26一起上升(图11和图12)。因此,在芯片10的电极10a上成形了凸起(球)14。这时,引线13也上升,因为它是被第二夹持器26夹持。
当只有第二夹持器26下降,而且与柄臂1无关,第一夹持器28打开时,经带出毛细管工具12底端的引线13的底端,而带出引线13的尾端(图13和图14),然后,因为第一夹持器28闭合,状态返回到如图13所示的初始状态。因此,完成了凸起成形操作。如图2所示,芯片10上有多个电极10a。因此,反复对芯片10进行上述操作,可在电极10a上依次连接成形凸起14。在图13和图14所示步骤中,当驱动超声发生器34使毛细管工具12超声振动时,容易从毛细管工具12底端伸出引线13。
很容易从接合到工件10的凸起14上侧面伸出一个尾端13’(引线13碎片)(见图13)。因此,如图16所示,要压扁尾端13’使凸起14高度均匀。在图16中,标号37表示一个圆柱体作为一个压力夹具,在圆柱体的杆38的底端设有一压板39。因此,伸出杆38使压板39下降,压板39则压扁尾端13’。在这种情况,最好在其上装有工件10的底座40中存放一个加热器41,用加热器41加热工件10和尾端13’则尾端13’更易压扁。在这种情况,当用压力夹具压扁在底座33的尾端13’时,则必须在底座33中设有一个加压热器。
图18是本发明另一实施例的一个凸起成形过程图。在图16的情况中,凸起14的尾端13’是一个接一个地由压板39压扁。然而,在图18中,接合在工件10上的多个凸起14的尾端13’由一个大的压板39’同时压扁。在这种情况,最好由一个加热器加热工件10和尾端13’,图16或图18所示压扁尾端(或多个尾端)13’的步骤可以在完成图15所示步骤以后的任何时间进行。
按照本发明,在引线底端的球粘合到工件电极之间,引线就被切割,然后这个球压靠在电极上以便接合到电极上,因此,球(凸起)和工件之间的连接面不会损伤,球(凸起)可以牢固地接合到工件电极上。
而且,按照本发明,一个凸起可以成形而又不损伤球(凸起)和工件电极之间的连接,因此,可由一个压力夹具在凸起上侧面加压使凸起高度均匀。
Claims (4)
1.一种凸起成形方法,包括下列步骤:
使焊炬接合引线底端并在上述引线和上述焊炬之间产生火花,在插入毛细管工具中心孔并向下伸出的引线底端成形一个球;
使上述毛细管工具相对于上述引线下降,把上述球从上述引线中分离;
进一步下降上述毛细管工具,把上述球压靠在工件电极上,把球接合到电极上。
2.按照权利要求1的凸起成形方法,其特征在于还包括在把球接合到电极上之后,使上述毛细管工具上升,从上述毛细管工具底端带出上述引线底端。
3、按照权利要求1的凸起成形方法,其特征在于还包括在把球接合到电极上以后,用一个压力夹具对靠在上述工件电极表面的上述球的侧面加压。
4.按照权利要求3所述的凸起成形方法,其特征在于在上述加压步骤中,对多个上述接合的球加压。
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JP08022277A JP3082657B2 (ja) | 1996-02-08 | 1996-02-08 | バンプ形成装置およびバンプ形成方法 |
JP022277/96 | 1996-02-08 | ||
JP21702096A JP3223804B2 (ja) | 1996-08-19 | 1996-08-19 | バンプの形成方法 |
JP217020/96 | 1996-08-19 |
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CN1080935C true CN1080935C (zh) | 2002-03-13 |
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KR (1) | KR100303052B1 (zh) |
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JP3718395B2 (ja) * | 1999-11-12 | 2005-11-24 | 超音波工業株式会社 | ボンディング装置のボンディングヘッド |
JP3981817B2 (ja) * | 2001-08-08 | 2007-09-26 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
KR100435899B1 (ko) * | 2001-12-28 | 2004-06-12 | 동부전자 주식회사 | 캐필러리 위치보정장치 |
JP3742359B2 (ja) * | 2002-04-02 | 2006-02-01 | 株式会社新川 | ボンディング装置 |
US8540136B1 (en) * | 2012-09-06 | 2013-09-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods for stud bump formation and apparatus for performing the same |
CN105895543B (zh) * | 2014-12-01 | 2019-09-13 | 恩智浦美国有限公司 | 接合引线进给系统及其方法 |
US20190047038A1 (en) * | 2017-08-11 | 2019-02-14 | The Charles Stark Draper Laboratory, Inc. | Wire handling apparatus |
US11420287B2 (en) * | 2019-09-29 | 2022-08-23 | Ningbo Shangjin Automation Technology Co., Ltd. | Wire clamping system for fully automatic wire bonding machine |
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EP0402756A2 (en) * | 1989-06-07 | 1990-12-19 | Nec Corporation | Process of forming bump on electrode of semiconductor chip and apparatus used therefor |
JPH107930A (ja) * | 1996-04-23 | 1998-01-13 | Mitsubishi Chem Corp | インク用顔料及びこれを用いたインクの製造方法 |
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US3357090A (en) * | 1963-05-23 | 1967-12-12 | Transitron Electronic Corp | Vibratory welding tip and method of welding |
JPS589331A (ja) * | 1981-07-08 | 1983-01-19 | Mitsubishi Electric Corp | 半導体装置のワイヤボンデイング装置 |
JPS6158247A (ja) * | 1984-08-30 | 1986-03-25 | Toshiba Corp | ワイヤボンデイング方法 |
DE3536908A1 (de) * | 1984-10-18 | 1986-04-24 | Sanyo Electric Co., Ltd., Moriguchi, Osaka | Induktivitaetselement und verfahren zur herstellung desselben |
US4955523A (en) * | 1986-12-17 | 1990-09-11 | Raychem Corporation | Interconnection of electronic components |
US5014419A (en) * | 1987-05-21 | 1991-05-14 | Cray Computer Corporation | Twisted wire jumper electrical interconnector and method of making |
US5616520A (en) * | 1992-03-30 | 1997-04-01 | Hitachi, Ltd. | Semiconductor integrated circuit device and fabrication method thereof |
FR2696279B1 (fr) * | 1992-09-25 | 1994-11-18 | Thomson Csf | Procédé pour permettre le montage d'une puce sur un substrat et puce préparée selon le procédé. |
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EP0402756A2 (en) * | 1989-06-07 | 1990-12-19 | Nec Corporation | Process of forming bump on electrode of semiconductor chip and apparatus used therefor |
JPH107930A (ja) * | 1996-04-23 | 1998-01-13 | Mitsubishi Chem Corp | インク用顔料及びこれを用いたインクの製造方法 |
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CN1163803A (zh) | 1997-11-05 |
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