CN108076586B - 电路板及其制造方法 - Google Patents

电路板及其制造方法 Download PDF

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Publication number
CN108076586B
CN108076586B CN201611186918.5A CN201611186918A CN108076586B CN 108076586 B CN108076586 B CN 108076586B CN 201611186918 A CN201611186918 A CN 201611186918A CN 108076586 B CN108076586 B CN 108076586B
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China
Prior art keywords
conductive layer
layer
holes
circuit board
metal layer
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Active
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CN201611186918.5A
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English (en)
Chinese (zh)
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CN108076586A (zh
Inventor
黄振宏
林贤杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanya Circuit Board Co ltd
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Nanya Circuit Board Co ltd
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Publication of CN108076586A publication Critical patent/CN108076586A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
CN201611186918.5A 2016-11-10 2016-12-20 电路板及其制造方法 Active CN108076586B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW105136583A TWI605733B (zh) 2016-11-10 2016-11-10 電路板及其製造方法
TW105136583 2016-11-10

Publications (2)

Publication Number Publication Date
CN108076586A CN108076586A (zh) 2018-05-25
CN108076586B true CN108076586B (zh) 2020-06-05

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ID=61023150

Family Applications (1)

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CN201611186918.5A Active CN108076586B (zh) 2016-11-10 2016-12-20 电路板及其制造方法

Country Status (3)

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JP (1) JP6573332B2 (ja)
CN (1) CN108076586B (ja)
TW (1) TWI605733B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110769617B (zh) * 2018-07-27 2020-12-29 北大方正集团有限公司 Pcb板中的孔径补偿方法及装置
JP7502170B2 (ja) 2020-12-14 2024-06-18 イビデン株式会社 プリント配線板の製造方法
JP7502173B2 (ja) 2020-12-21 2024-06-18 イビデン株式会社 プリント配線板の製造方法
CN114980568A (zh) * 2021-02-20 2022-08-30 嘉联益电子(昆山)有限公司 具导通孔的电路板线路结构的制作方法及所制成的具导通孔的电路板线路结构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311182A (ja) * 2004-04-23 2005-11-04 Shinko Electric Ind Co Ltd 基板及び半導体装置
CN101278392A (zh) * 2005-12-27 2008-10-01 揖斐电株式会社 多层印刷线路板
CN101697666A (zh) * 2009-10-16 2010-04-21 深圳崇达多层线路板有限公司 线路板电镀装置及电镀方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05145221A (ja) * 1991-11-20 1993-06-11 Matsushita Electric Ind Co Ltd 印刷配線板の製造方法
TWI334750B (en) * 2007-06-06 2010-12-11 Unimicron Technology Corp Circuit board and process thereof
TWI455954B (zh) * 2008-05-07 2014-10-11 Taiyo Holdings Co Ltd 填孔用熱硬化性樹脂組成物及該組成物與抗焊層形成用光硬化性熱硬化性樹脂組成物之組合單元、以及印刷電路板
TWI626863B (zh) * 2015-04-30 2018-06-11 Circuit board structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311182A (ja) * 2004-04-23 2005-11-04 Shinko Electric Ind Co Ltd 基板及び半導体装置
JP4291729B2 (ja) * 2004-04-23 2009-07-08 新光電気工業株式会社 基板及び半導体装置
CN101278392A (zh) * 2005-12-27 2008-10-01 揖斐电株式会社 多层印刷线路板
CN101697666A (zh) * 2009-10-16 2010-04-21 深圳崇达多层线路板有限公司 线路板电镀装置及电镀方法

Also Published As

Publication number Publication date
TWI605733B (zh) 2017-11-11
JP2018078273A (ja) 2018-05-17
TW201818790A (zh) 2018-05-16
CN108076586A (zh) 2018-05-25
JP6573332B2 (ja) 2019-09-11

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