TWI605733B - 電路板及其製造方法 - Google Patents

電路板及其製造方法 Download PDF

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Publication number
TWI605733B
TWI605733B TW105136583A TW105136583A TWI605733B TW I605733 B TWI605733 B TW I605733B TW 105136583 A TW105136583 A TW 105136583A TW 105136583 A TW105136583 A TW 105136583A TW I605733 B TWI605733 B TW I605733B
Authority
TW
Taiwan
Prior art keywords
conductive layer
layer
circuit board
holes
forming
Prior art date
Application number
TW105136583A
Other languages
English (en)
Chinese (zh)
Other versions
TW201818790A (zh
Inventor
黃振宏
林賢傑
Original Assignee
南亞電路板股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南亞電路板股份有限公司 filed Critical 南亞電路板股份有限公司
Priority to TW105136583A priority Critical patent/TWI605733B/zh
Priority to CN201611186918.5A priority patent/CN108076586B/zh
Priority to JP2017152029A priority patent/JP6573332B2/ja
Application granted granted Critical
Publication of TWI605733B publication Critical patent/TWI605733B/zh
Publication of TW201818790A publication Critical patent/TW201818790A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
TW105136583A 2016-11-10 2016-11-10 電路板及其製造方法 TWI605733B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW105136583A TWI605733B (zh) 2016-11-10 2016-11-10 電路板及其製造方法
CN201611186918.5A CN108076586B (zh) 2016-11-10 2016-12-20 电路板及其制造方法
JP2017152029A JP6573332B2 (ja) 2016-11-10 2017-08-04 回路板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105136583A TWI605733B (zh) 2016-11-10 2016-11-10 電路板及其製造方法

Publications (2)

Publication Number Publication Date
TWI605733B true TWI605733B (zh) 2017-11-11
TW201818790A TW201818790A (zh) 2018-05-16

Family

ID=61023150

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105136583A TWI605733B (zh) 2016-11-10 2016-11-10 電路板及其製造方法

Country Status (3)

Country Link
JP (1) JP6573332B2 (ja)
CN (1) CN108076586B (ja)
TW (1) TWI605733B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110769617B (zh) * 2018-07-27 2020-12-29 北大方正集团有限公司 Pcb板中的孔径补偿方法及装置
JP7502170B2 (ja) 2020-12-14 2024-06-18 イビデン株式会社 プリント配線板の製造方法
JP7502173B2 (ja) 2020-12-21 2024-06-18 イビデン株式会社 プリント配線板の製造方法
CN114980568A (zh) * 2021-02-20 2022-08-30 嘉联益电子(昆山)有限公司 具导通孔的电路板线路结构的制作方法及所制成的具导通孔的电路板线路结构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200850097A (en) * 2007-06-06 2008-12-16 Unimicron Technology Corp Circuit board and process thereof
TW201004994A (en) * 2008-05-07 2010-02-01 Taiyo Ink Mfg Co Ltd Thermosetting resin composition for padding, combination unit of this composition and photo-curing and thermosetting resin composition for forming solder resist layer, and printed circuit board
TW201639421A (zh) * 2015-04-30 2016-11-01 Kinsus Interconnect Tech Corp 線路板結構

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05145221A (ja) * 1991-11-20 1993-06-11 Matsushita Electric Ind Co Ltd 印刷配線板の製造方法
JP4291729B2 (ja) * 2004-04-23 2009-07-08 新光電気工業株式会社 基板及び半導体装置
JP4824397B2 (ja) * 2005-12-27 2011-11-30 イビデン株式会社 多層プリント配線板
CN101697666B (zh) * 2009-10-16 2011-04-06 深圳崇达多层线路板有限公司 线路板电镀装置及电镀方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200850097A (en) * 2007-06-06 2008-12-16 Unimicron Technology Corp Circuit board and process thereof
TW201004994A (en) * 2008-05-07 2010-02-01 Taiyo Ink Mfg Co Ltd Thermosetting resin composition for padding, combination unit of this composition and photo-curing and thermosetting resin composition for forming solder resist layer, and printed circuit board
TW201639421A (zh) * 2015-04-30 2016-11-01 Kinsus Interconnect Tech Corp 線路板結構

Also Published As

Publication number Publication date
JP2018078273A (ja) 2018-05-17
TW201818790A (zh) 2018-05-16
CN108076586B (zh) 2020-06-05
CN108076586A (zh) 2018-05-25
JP6573332B2 (ja) 2019-09-11

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