CN107964375A - 连接体的制造方法 - Google Patents

连接体的制造方法 Download PDF

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Publication number
CN107964375A
CN107964375A CN201710944932.5A CN201710944932A CN107964375A CN 107964375 A CN107964375 A CN 107964375A CN 201710944932 A CN201710944932 A CN 201710944932A CN 107964375 A CN107964375 A CN 107964375A
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CN
China
Prior art keywords
light
wavelength
manufacture method
electronic unit
absworption peak
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201710944932.5A
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English (en)
Chinese (zh)
Inventor
稻濑圭亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
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Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of CN107964375A publication Critical patent/CN107964375A/zh
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Power Conversion In General (AREA)
CN201710944932.5A 2016-10-19 2017-09-30 连接体的制造方法 Withdrawn CN107964375A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016204912A JP2018065916A (ja) 2016-10-19 2016-10-19 接続体の製造方法
JP2016-204912 2016-10-19

Publications (1)

Publication Number Publication Date
CN107964375A true CN107964375A (zh) 2018-04-27

Family

ID=61997648

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710944932.5A Withdrawn CN107964375A (zh) 2016-10-19 2017-09-30 连接体的制造方法

Country Status (5)

Country Link
JP (1) JP2018065916A (ko)
KR (1) KR20180043169A (ko)
CN (1) CN107964375A (ko)
HK (1) HK1254503A1 (ko)
TW (1) TW201828376A (ko)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001146577A (ja) * 1999-11-22 2001-05-29 Toyo Ink Mfg Co Ltd ウレタン樹脂組成物
AU2003236821A1 (en) * 2002-01-24 2003-09-02 Basf Coatings Ag Hardened materials, method for the production thereof, and use thereof
EP1487933A1 (de) * 2002-03-28 2004-12-22 BASF Coatings AG Mit aktinischer strahlung härtbare, wässrige primaerdispersionen, verfahren zu ihrer herstellung und ihre verwendung
US7091256B2 (en) * 2003-06-25 2006-08-15 Daimlerchrysler Ag Reactive thermally-curing and/or radiation-curing paints and their curing methods
EP1942166A1 (en) * 2007-01-05 2008-07-09 Nitto Denko Corporation Adhesive sheet for processing semiconductor substrates
CN102898959A (zh) * 2011-07-25 2013-01-30 汉高股份有限公司 一种可光固化的粘合剂组合物及其用途
CN103819681A (zh) * 2014-03-11 2014-05-28 中国科学院长春应用化学研究所 一种紫外光固化胶粘剂及其制备方法
WO2015137008A1 (ja) * 2014-03-11 2015-09-17 デクセリアルズ株式会社 異方性導電接着剤、接続体の製造方法及び電子部品の接続方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10340748A (ja) * 1997-06-06 1998-12-22 Hitachi Chem Co Ltd 回路電極の接続方法
JP4151101B2 (ja) * 1998-02-23 2008-09-17 日立化成工業株式会社 電極接続用接着剤及びこれを用いた微細電極の接続構造、並びに、電極の接続方法
US6866899B2 (en) * 2001-12-21 2005-03-15 3M Innovative Properties Company Polymerization method comprising sequential irradiation
JP2004359769A (ja) * 2003-06-03 2004-12-24 Sekisui Chem Co Ltd 液晶パネル用光硬化性接着剤組成物、液晶パネルの接着方法、偏光板の貼付方法および液晶パネル素子
JP2007056111A (ja) * 2005-08-23 2007-03-08 Bridgestone Corp 接着剤組成物

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001146577A (ja) * 1999-11-22 2001-05-29 Toyo Ink Mfg Co Ltd ウレタン樹脂組成物
AU2003236821A1 (en) * 2002-01-24 2003-09-02 Basf Coatings Ag Hardened materials, method for the production thereof, and use thereof
EP1487933A1 (de) * 2002-03-28 2004-12-22 BASF Coatings AG Mit aktinischer strahlung härtbare, wässrige primaerdispersionen, verfahren zu ihrer herstellung und ihre verwendung
US7091256B2 (en) * 2003-06-25 2006-08-15 Daimlerchrysler Ag Reactive thermally-curing and/or radiation-curing paints and their curing methods
EP1942166A1 (en) * 2007-01-05 2008-07-09 Nitto Denko Corporation Adhesive sheet for processing semiconductor substrates
CN102898959A (zh) * 2011-07-25 2013-01-30 汉高股份有限公司 一种可光固化的粘合剂组合物及其用途
CN103797077A (zh) * 2011-07-25 2014-05-14 汉高股份有限公司 可光固化的粘合剂组合物及其用途
CN103819681A (zh) * 2014-03-11 2014-05-28 中国科学院长春应用化学研究所 一种紫外光固化胶粘剂及其制备方法
WO2015137008A1 (ja) * 2014-03-11 2015-09-17 デクセリアルズ株式会社 異方性導電接着剤、接続体の製造方法及び電子部品の接続方法

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
JERZY P˛ACZKOWSKI: "Sulfur-containing initiators and coinitiators of free radical polymerization", 《JOURNAL OF PHOTOCHEMISTRY AND PHOTOBIOLOGY A:CHEMISTRY 》 *
姜学松: "新型光引发剂体系及其应用", 《2009年全国高分子学术论文报告会》 *
张洪: "阳离子光引发剂敏化的研究进展", 《影响科学与光化学》 *
杨宇: "铝基覆铜板的生产过程探讨", 《基板材料》 *

Also Published As

Publication number Publication date
TW201828376A (zh) 2018-08-01
HK1254503A1 (zh) 2019-07-19
KR20180043169A (ko) 2018-04-27
JP2018065916A (ja) 2018-04-26

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