HK1254503A1 - 連接體的製造方法 - Google Patents

連接體的製造方法

Info

Publication number
HK1254503A1
HK1254503A1 HK18113712.0A HK18113712A HK1254503A1 HK 1254503 A1 HK1254503 A1 HK 1254503A1 HK 18113712 A HK18113712 A HK 18113712A HK 1254503 A1 HK1254503 A1 HK 1254503A1
Authority
HK
Hong Kong
Prior art keywords
connection body
producing connection
producing
connection
Prior art date
Application number
HK18113712.0A
Other languages
English (en)
Inventor
稻瀨圭亮
Original Assignee
迪睿合株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 迪睿合株式會社 filed Critical 迪睿合株式會社
Publication of HK1254503A1 publication Critical patent/HK1254503A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Power Conversion In General (AREA)
HK18113712.0A 2016-10-19 2018-10-26 連接體的製造方法 HK1254503A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016204912A JP2018065916A (ja) 2016-10-19 2016-10-19 接続体の製造方法

Publications (1)

Publication Number Publication Date
HK1254503A1 true HK1254503A1 (zh) 2019-07-19

Family

ID=61997648

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18113712.0A HK1254503A1 (zh) 2016-10-19 2018-10-26 連接體的製造方法

Country Status (5)

Country Link
JP (1) JP2018065916A (zh)
KR (1) KR20180043169A (zh)
CN (1) CN107964375A (zh)
HK (1) HK1254503A1 (zh)
TW (1) TW201828376A (zh)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10340748A (ja) * 1997-06-06 1998-12-22 Hitachi Chem Co Ltd 回路電極の接続方法
JP4151101B2 (ja) * 1998-02-23 2008-09-17 日立化成工業株式会社 電極接続用接着剤及びこれを用いた微細電極の接続構造、並びに、電極の接続方法
JP2001146577A (ja) * 1999-11-22 2001-05-29 Toyo Ink Mfg Co Ltd ウレタン樹脂組成物
US6866899B2 (en) * 2001-12-21 2005-03-15 3M Innovative Properties Company Polymerization method comprising sequential irradiation
DE10213970A1 (de) * 2002-03-28 2003-10-23 Basf Coatings Ag Mit aktinischer Strahlung härtbare, wässrige Primärdispersionen, Verfahren zur Herstellung und ihre Verwendung
JP2004359769A (ja) * 2003-06-03 2004-12-24 Sekisui Chem Co Ltd 液晶パネル用光硬化性接着剤組成物、液晶パネルの接着方法、偏光板の貼付方法および液晶パネル素子
DE10345903B4 (de) * 2003-06-25 2012-05-31 Daimler Ag Reaktive thermisch oder kombiniert thermisch und UV-initiiert härtbare Lacke, deren Verwendung sowie Verfahren zu deren Härtung
JP2007056111A (ja) * 2005-08-23 2007-03-08 Bridgestone Corp 接着剤組成物
JP5101111B2 (ja) * 2007-01-05 2012-12-19 日東電工株式会社 半導体基板加工用粘着シート
CN102898959B (zh) * 2011-07-25 2016-07-06 汉高股份有限及两合公司 一种可光固化的粘合剂组合物及其用途
CN103819681B (zh) * 2014-03-11 2016-08-24 中国科学院长春应用化学研究所 一种紫外光固化胶粘剂及其制备方法
JP6425899B2 (ja) * 2014-03-11 2018-11-21 デクセリアルズ株式会社 異方性導電接着剤、接続体の製造方法及び電子部品の接続方法

Also Published As

Publication number Publication date
JP2018065916A (ja) 2018-04-26
TW201828376A (zh) 2018-08-01
KR20180043169A (ko) 2018-04-27
CN107964375A (zh) 2018-04-27

Similar Documents

Publication Publication Date Title
HUE053430T2 (hu) Eljárás fotokróm keményített test elõállítására
PL3140097T3 (pl) Korpus wielowarstwowy i sposób jego wytwarzania
HRP20181718T1 (hr) Višeslojno tijelo i postupak za njegovu proizvodnju
HUE066162T2 (hu) Eljárás jármûkarosszéria elõállítására
PT3140127T (pt) Corpo multicamadas e método para o seu fabrico
SG11201701863VA (en) Method for producing methionine
EP3333266C0 (en) SELENOEIN PRODUCTION PROCESS
SG11201710342TA (en) Method for producing highly functional platelets
IL266044B (en) Method for the production of 3-alkylsulfanyl-2-chloro-n-(1-alkyl-h1-tetrazol-5-yl)-4-trifluoromethyl-benzamides
EP3666729C0 (en) PROCESS FOR THE PRODUCTION OF NANO-SULFUR
IL252173A0 (en) Methods for the production of methyl dichlorophosphane
GB201414737D0 (en) Method for producing 3-hydroxypropanal
SG11201701326YA (en) Method for producing oligosilane
HK1249098A1 (zh) 用於生產氟美他酚的方法
EP3594325C0 (en) PLATELET PRODUCTION PROCESS
PT3523382T (pt) Processo para a produção de dispersões aquosas
EP3466652A4 (en) PROCESS FOR PRODUCING A BONDED BODY
GB201615753D0 (en) Diagnostic method
ZA201903463B (en) Method for preparing hexadecahydropyrene
HK1257184A1 (zh) 膜卷裝體和膜卷裝體的製造方法
IL255093A0 (en) A method for the production of levoglucosenon
PL3511315T3 (pl) Sposób wytwarzania n-metylo-para-anizydyny
SG11201805486QA (en) Method for producing hydroxypivalaldehyde
PL3299394T3 (pl) Sposób wytwarzania zmodyfikowanych ksylopolisacharydów
PL3221753T3 (pl) Korpus wielowarstwowy i sposób jego wytwarzania