CN107768363A - 可堆叠模制封装及其制造方法 - Google Patents
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Abstract
提供一种可堆叠封装组件和制造方法。所述方法包括将多个互连球附接至基板的第一表面,以及用包封剂包封所述基板的所述第一表面和所述多个互连球。在所述包封剂的第一表面中形成暴露所述互连球的一部分的沟槽。提供具有第一互连层的插入件。通过将第一互连层的连接部位附接至所述互连球的所述暴露的部分形成组件,第二基板的第一表面延伸到所述沟槽中。
Description
技术领域
本公开大体上涉及装置封装,并且更具体地说,涉及可堆叠模制封装及制作可堆叠模制封装的方法。
背景技术
封装的半导体装置往往见于大范围的电子产品中--从缝纫机到洗衣机,从汽车到蜂窝电话等等。这些封装的半导体装置通常安装在例如印刷电路板的基板上。为了保持产品成本较低或为了减少产品成本,通常的做法是使产品内所使用的材料量最小化,从而频繁地减少产品自身的大小。由于电子产品大小减少,所以印刷电路板基板面变得更加珍贵,从而对封装的半导体装置的大小、数量和特征赋予额外约束。可堆叠封装可堆叠在层叠封装布置中,从而使功能最大化,同时对印刷电路板基板面具有最小影响。
发明内容
根据本发明的第一方面,提供一种制造封装组件的方法,所述方法包括:
将多个互连球附接至第一基板的第一表面;
用包封剂包封所述第一基板的所述第一表面和所述多个互连球;
在所述包封剂的暴露所述互连球的一部分的第一表面中形成沟槽,所述互连球的暴露的部分为安置在所述第一基板的所述第一表面处的第一导电层提供电连接性;
提供具有安置在第二基板的第一表面处的第一互连层的插入件;以及
通过将所述第一互连层的连接部位附接至所述互连球的暴露的部分形成组件,所述第二基板的所述第一表面延伸到所述沟槽中。
在一个或多个实施例中,所述方法进一步包括将第一多个球连接器附接至所述第一基板的第二表面。
在一个或多个实施例中,包封进一步包括包封附接至所述第一基板的所述第一表面的半导体管芯。
在一个或多个实施例中,在倒装芯片配置中,所述半导体管芯被附接至所述第一基板的所述第一表面。
所述沟槽为至少部分围绕所述半导体管芯的连续沟槽。
形成组件进一步包括所述第二基板的第二表面,与所述包封剂的所述第一表面相比,所述第二基板的第二表面被定位成距第一基板的所述第一表面更远。
在一个或多个实施例中,所述方法进一步包括将封装的装置附接至安置在所述第二基板的所述第二表面处的第二互连层的连接部位。
在一个或多个实施例中,所述封装的装置在所述半导体管芯上方。
在一个或多个实施例中,使用膜辅助模制技术形成所述沟槽。
根据本发明的第二方面,提供一种制造封装组件的方法,所述方法包括:
提供具有第一表面的封装基板;
将管芯附接至所述封装基板的所述第一表面;
将多个互连球附接至所述封装基板的所述第一表面,所述多个互连球至少部分围绕所述管芯且电连接至所述管芯;
用包封剂包封所述封装基板的所述第一表面、管芯和多个互连球;
在所述包封剂的暴露所述互连球的顶部的第一表面中形成空腔,所述互连球的所述暴露的顶部为安置在所述封装基板的所述第一表面处的第一导电层提供电连接性;
提供具有安置在插入件基板的第一表面处的第一互连层的插入件;以及
通过将所述第一互连层的连接部位附接至所述互连球的暴露的顶部形成组件,所述插入件基板的所述第一表面延伸到所述空腔中。
在一个或多个实施例中,所述方法进一步包括将第一多个球连接器附接至所述封装基板的第二表面。
在一个或多个实施例中,在倒装芯片配置中,所述半导体管芯被附接至所述封装基板的所述第一表面。
在一个或多个实施例中,形成空腔为形成暴露至少部分围绕所述管芯的所述互连球的顶部的连续空腔。
在一个或多个实施例中,形成组件进一步包括所述插入件基板的第二表面在所述包封剂的所述第一表面上方延伸。
在一个或多个实施例中,所述方法进一步包括将封装的装置附接至安置在所述插入件基板的所述第二表面处的第二互连层的连接部位。
在一个或多个实施例中,所述多个互连球使用焊料回流工艺附接至所述封装基板的所述第一表面。
根据本发明的第三方面,提供一种封装组件,包括:
第一封装,包括:
具有第一表面的封装基板,
附接至所述封装基板的所述第一表面的管芯,
附接至所述封装基板的所述第一表面的多个互连球,所述多个互连球至少部分围绕所述管芯,
具有顶面的包封剂,所述包封剂包封所述封装基板的所述第一表面、管芯和多个互连球,以及
形成在所述包封剂的暴露所述互连球的顶部的所述顶面中的沟槽,所述互连球的所述暴露的顶部为安置在所述第一基板的所述第一表面处的第一导电层提供电连接性;以及
插入件,包括:
具有顶面和底面的插入件基板,所述底面被放置在所述沟槽中且在所述包封剂的所述顶面下方,
安置在所述插入件基板的所述顶面处的第一互连层,以及
安置在所述插入件基板的所述底面处的第二互连层,所述第二互连层具有耦合至所述互连球的所述暴露的顶部的连接部位。
在一个或多个实施例中,所述封装组件进一步包括附接至所述封装基板的第二表面的第一多个球连接器。
在一个或多个实施例中,所述封装组件进一步包括附接至所述第一互连层的连接部位的第二封装。
在一个或多个实施例中,在倒装芯片配置中,所述管芯被附接至所述封装基板的所述第一表面。
本发明的这些和其它方面将根据下文中所描述的实施例显而易见,且参考这些实施例予以阐明。
附图说明
借助于例子示出本发明,并且本发明不受附图限制,在附图中,类似标记指示类似元件。为简单和清楚起见,示出图中的元件,并且未必按比例绘制图中的元件。
图1至图3以简化的横截面视图示出根据本公开的实施例的示例性可堆叠封装的制造阶段。
图4至图5以简化的平面视图和横截面视图示出根据本公开的实施例的示例性插入件。
图6至图7以简化的横截面视图示出根据本公开的实施例的用图5的插入件和图3的可堆叠封装形成的示例性组件。
图8以简化的横截面视图示出根据本公开的实施例的示例性层叠封装配置。
具体实施方式
大体上,提供可堆叠封装和制造可堆叠封装的方法,可堆叠封装和制造可堆叠封装的方法使用重新配置的插入件并入嵌入式互连球,从而允许柔性层叠封装配置。所形成的沟槽暴露嵌入式互连球的顶部,从而提供各种插入件的附接。通过将插入件附接至可堆叠封装所形成的组件允许封装的装置被安裝在可堆叠封装上方。
图1以简化的横截面视图示出根据本公开的实施例的包括第一基板和第一管芯的示例性可堆叠封装100的制造阶段。例如,基板102包括多个互连或路由层(未示出),多个互连或路由层(未示出)允许从基板102的顶面至基板102的底面的信号传递。在倒装芯片配置中,管芯104借助于导电凸块或键合球106以有源表面面向下附接至基板102。虽然图1将管芯104示为倒装芯片键合到基板102,但是管芯104可使用其它技术,例如通过有源表面向上、具有在管芯104的有源表面和基板102的顶面之间提供电连接性的键合线,附接至基板102。
基板102可包括任何合适的非导电材料,例如陶瓷、FR-4、BT环氧树脂或有机散装材料(例如,标准印刷电路板(PCB)材料)。例如,基板102可形成为具有安置在非导电层之间的导电互连层的层压体。例如,基板102可形成为任何合适的形状,例如矩形和正方形。例如,互连层可通过任何合适的工艺,例如溅镀、沉积、电镀等等附接至基板102或形成在基板102中。基板102的多个互连层允许在基板102的顶侧表面和基板102的底侧表面之间的信号传递。互连层可由各种导电材料形成,各种导电材料包括例如,铜、金、银、铝、镍、钨及其合金,以包括焊料、掺杂材料(例如,磷、硼掺杂的多晶硅)、超导材料和陶瓷(例如,氧化铜材料、铁基材料和其它合适的金属基材料)。也可取决于工艺由多于一种类型的材料形成互连层,以创建导电层、组件和特定封装结构。
管芯104可为由任何半导材料,例如硅、锗、砷化镓、氮化镓等等形成的半导体管芯。管芯104可包括数字电路、模拟电路、存储器、处理器、MEMS、传感器等等中的任一个,或数字电路、模拟电路、存储器、处理器、MEMS、传感器等等的组合。例如,在一些实施例中,管芯104可包括一或多个分立部件,例如电阻器、电感器、电容器、高压场效应晶体管等等。管芯104可形成为任何大小或几何形状。
导电键合球106将管芯104上的键合部位与基板102的互连层电耦合。在此实施例中,键合球106可被称为焊料球或焊料凸块。例如,可由一种或多种导电材料,例如锡、银、铜等等形成键合球106。例如,在可替换的实施例中,键合球106可为任何合适的导电结构,例如金扣柱、铜柱等等,以将管芯104上的键合部位与基板102的互连层电耦合。
图2以简化的横截面视图示出根据本公开的实施例的包括附接至基板102的第一互连球202的可堆叠封装100的后续制造阶段。互连球202被电耦合至基板102的一个或多个互连层。例如,可由一种或多种导电材料,例如锡、银、铜等等形成互连球202。例如,在可替换的实施例中,互连球202可包括任何合适的导电结构,例如金扣柱、铜柱等等。
图3以简化的横截面视图示出根据本公开的实施例的包括包封剂302的可堆叠封装100的后续制造阶段。基板102的顶面、管芯104和互连球202的一部分为包封的模制复合材料。模制复合材料可为任何合适的包封剂,所述包封剂包括例如,填二氧化硅环氧膜塑料、塑料包封树脂和其它聚合材料(例如硅树脂、聚酰亚胺、酚醛树脂和聚氨脂)。可通过用于包封中的各种处理技术施加模制复合材料。例如,可使用膜辅助模制,借此空腔、凹部或沟槽304形成在包封剂中,留下未被模制材料覆盖的互连球202的顶部,因此暴露顶部。
例如,取决于封装布局和配置,沟槽304可被配置成各种形状,例如条带、L形、C形、矩形、正方形、其它正交和非正交形状。沟槽304大体上形成为连续形状或一组形状,并且沟槽304被配置成使得暴露的互连球202的导电表面可与插入件配对。在此实施例中,沟槽304形成为围绕管芯104的连续矩形或正方形形状。在此实施例中,互连球202的暴露的表面凹陷到包封剂302的顶面下方,使得当与插入件配对时,插入件的一部分向下延伸到沟槽304中。在此实施例中,如从基板102的顶面所测量的包封剂302的顶面的高度可为互连球202的高度的至少两倍。在一些实施例中,如从基板102的顶面所测量的包封剂302的顶面的高度可为互连球202的高度的至少1.2倍。
图4以简化的平面视图示出根据本公开的实施例的示例性插入件400。在正方形的内部中具有开口410的正方形配置中,插入件400被示为顶侧向上。插入件400包括基板402,基板402具有由信号管道以及互连或路由层形成的互连。第一互连层404的连接部位在基板402的顶侧周围分布。在剖面线A-A处截取插入件400的横截面视图。应理解,可独立形成或制造插入件400和可堆叠封装100中的每个。
图5以简化的横截面视图示出根据本公开的实施例的图4的示例性插入件。在示例性插入件400的剖面线A-A处截取图5的横截面视图。插入件400包括基板402,基板402具有包括信号管道406以及第一互连和第二互连或路由层404和路由层408的多层互连。插入件400可包括几个互连层。第一互连层404的连接部位分布在基板402的顶面处,并且第二互连层408的连接部位分布在基板402的底面处。连接部位或垫提供至插入件的互连层的电连接性的位置。
基板402可包括任何合适的多层基板,任何合适的多层基板由非导电材料,例如陶瓷或有机散装材料(例如,多层层压体印刷电路板(PCB)材料)形成。例如,取决于可堆叠封装100布局和配置,基板402可被配置成各种形状,例如条带、L形、C形、矩形、正方形、其它正交和非正交形状。可期望如在可堆叠封装100中配置的,基板402的配置补足沟槽304。
一般来说,基板402形成为一种形状且被配置成使得在插入件400的底面处的第二互连层408的连接部位可可堆叠封装100的暴露的互连球202的导电表面配对。在插入件400的顶面处的第一互连层404的连接部位被布置成使得封装的装置的导电表面可电耦合至插入件400。通过重新配置在插入件400的顶面处的第一互连层404的连接部位的布置,大量封装的装置可耦合至插入件400。
例如,信号管道406可通过任何合适的工艺,例如溅镀、沉积和电镀附接至基板402或形成在基板402中。例如,信号管道406允许从在第一互连层404处的基板402的顶面到第二互连层408的基板402的底面的信号传递。可由各种导电材料形成信号管道406,各种导电材料包括例如,铜、金、银、铝、镍、钨及其合金,以包括焊料、掺杂材料(例如,磷、硼掺杂的多晶硅)、超导材料和陶瓷(例如,氧化铜材料、铁基材料和其它合适的金属基材料)。也可取决于工艺由多于一种类型的材料形成信号管道304,以创建管道、组件和特定封装结构。
例如,互连层404和互连层408可由任何合适的导电材料(例如,铜、镍、铝及其合金)形成。互连层408的连接部位允许暴露的互连球202的导电表面与插入件400连接。例如,互连层408的连接部位可提供连接互连球、金扣柱、铜柱等等。
图6以简化的横截面视图示出根据本公开的实施例的与可堆叠封装100一起放置以形成示例性组件的插入件400。插入件被放置成使得在互连层408上的连接部位与暴露的互连球202的对应的导电表面对齐。
图7以简化的横截面视图示出根据本公开的实施例的用插入件400和可堆叠封装100形成的示例性组件700。插入件400被附接至可堆叠封装100,使互连层408的连接部位电耦合至暴露的互连球202的导电表面。当附接时,插入件400延伸到形成在可堆叠封装100的顶侧上的空腔中。例如,互连层408的连接部位和暴露的互连球202的导电表面可使用已知技术,例如焊料回流等等彼此粘在一起。
导电球连接器702形成在基板102的底面上,用于将可堆叠封装100连接至其它封装或其它部件,例如印刷电路板。球连接器702电耦合至基板102的互连层。在一个实施例中,球连接器702为焊料球。球连接器702也可被称作由一种或多种导电材料形成的球导体。球连接器702可由与图2中示出的互连球202类似的材料形成。在一些实施例中,球连接器702可由不同于互连球202的材料形成。在球连接器702的形成、安插和附接中可使用已知技术。在此实施例中,在插入件400附接至可堆叠封装100之后,球连接器702形成在基板102的底面上。在一些实施例中,在附接插入件400之前,球连接器702可形成在基板102的底面上。在可替换的实施例中,球连接器702和插入件400可在相同焊料回流步骤期间,同时附接至可堆叠封装100。
在图7中示出的示例性组件700中,可实现包括信号管道406、互连层404和互连层408连同互连球202和球连接器702的导电通路形成在插入件400的顶面处的第一互连层404的连接部位和在可堆叠封装300的底面处的球连接器702之间。基板102的互连或路由层(未示出)提供在管芯104和球连接器702之间以及在管芯104和第一互连层404的连接部位之间的导电通路。例如,这些导电通路允许从管芯104到在第一互连层404的连接部位处连接的封装的装置的信号传递。
图8以简化的横截面视图示出根据本公开的实施例的示例性层叠封装(POP)配置800。PoP配置800包括安裝至示例性组件700的示例性封装的装置802。
封装的装置802可包括适用于安装在PoP配置中的任何装置和/或分立部件。在此实施例中,示例性封装的装置802包括基板804、管芯806和包封剂812。例如,管芯806可包括数字电路、模拟电路、存储器、处理器、MEMS、传感器、电阻器、电感器、电容器、分立晶体管等等中的任一个,或数字电路、模拟电路、存储器、处理器、MEMS、传感器、电阻器、电感器、电容器、分立晶体管等等的组合。在此实施例中,管芯806借助于管芯附接材料808附接至基板804。键合线810将在管芯806的有源表面上的位置与在基板804的顶面处的位置电耦合。球连接器814形成在基板804的底面处,并且允许借助于基板互连(未示出)将信号电耦合至在基板804的顶侧上的位置。使用已知的技术和材料形成且安插球连接器814。球连接器814被布置在匹配组件700的互连层404的连接部位中的一个或多个连接部位的配置中。球连接器814和互连层404的连接部位可使用已知的技术和方法,例如焊料回流等等彼此粘在一起。本公开的实施例不限于在互连层404的连接部位处耦合封装的装置。例如,分立部件、散热片或护罩可焊接耦合至互连层404的连接部位。
在图8的示例性层叠封装(PoP)配置800中,可实现信号管道406、互连层404和互连层408连同互连球202以及球连接器702和球连接器814在封装的装置802和组件700之间形成导电通路。例如,这些导电通路可被用于使得实现在可堆叠封装300的管芯104和PoP安裝的封装的装置802的管芯806之间的电连接。
大体上,提供一种制造封装组件的方法,包括:将多个互连球附接至第一基板的第一表面;用包封剂包封第一基板的第一表面和多个互连球;在包封剂的第一表面中形成暴露互连球的一部分的沟槽,互连球的暴露的部分提供至安置在第一基板的第一表面处的第一导电层的电连接性;提供具有安置在第二基板的第一表面处的第一互连层的插入件;以及通过将第一互连层的连接部位附接至互连球的暴露的部分形成组件,第二基板的第一表面延伸到沟槽中。方法可另外包括将第一多个球连接器附接至第一基板的第二表面。包封可另外包括包封附接至第一基板的第一表面的半导体管芯。在倒装芯片配置中,半导体管芯可附接至第一基板的第一表面。沟槽可为至少部分围绕半导体管芯的连续沟槽。形成组件可另外包括与包封剂的第一表面相比,第二基板的第二表面被定位成距第一基板的第一表面更远。方法可另外包括将封装的装置附接至安置在第二基板的第二表面处的第二互连层的连接部位。封装的装置可在半导体管芯上方。可使用膜辅助模制技术形成沟槽。
在另一个实施例中,提供一种制造封装组件的方法,包括:提供具有第一表面的封装基板;将管芯附接至封装基板的第一表面;将多个互连球附接至封装基板的第一表面,多个互连球至少部分围绕管芯且电连接至管芯;用包封剂包封封装基板的第一表面、管芯和多个互连球;在包封剂的第一表面中形成暴露互连球的顶部的空腔,互连球的暴露的顶部提供至安置在封装基板的第一表面处的第一导电层的电连接性;提供具有安置在插入件基板的第一表面处的第一互连层的插入件;以及通过将第一互连层的连接部位附接至互连球的暴露的顶部形成组件,插入件基板的第一表面延伸到空腔中。方法可另外包括将第一多个球连接器附接至封装基板的第二表面。在倒装芯片配置中,半导体管芯可附接至封装基板的第一表面。形成空腔可形成暴露至少部分围绕管芯的互连球的顶部的连续空腔。形成组件可另外包括插入件基板的第二表面在包封剂的第一表面上方延伸。方法可另外包括将封装的装置附接至安置在插入件基板的第二表面处的第二互连层的连接部位。多个互连球可使用焊料回流工艺附接至封装基板的第一表面。
在又一个实施例中,提供一种封装组件,包括:第一封装,包括:具有第一表面的封装基板;附接至封装基板的第一表面的管芯;附接至封装基板的第一表面的多个互连球,多个互连球至少部分围绕管芯;具有顶面的包封剂,包封剂包封封装基板的第一表面、管芯和多个互连球;以及形成在包封剂的顶面中暴露互连球的顶部的沟槽,互连球的暴露的顶部;以及插入件,包括:具有顶面和底面的插入件基板,底面被放置在沟槽中且在包封剂的顶面下方;安置在插入件基板的顶面处的第一互连层;以及安置在插入件基板的底面处的第二互连层,第二互连层具有耦合至互连球的暴露的顶部的连接部位。封装组件可另外包括附接至封装基板的第二表面的第一多个球连接器。封装组件可另外包括附接至第一互连层的连接部位的第二封装。在倒装芯片配置中,管芯可附接至封装基板的第一表面。
到目前为止,应了解,已提供可堆叠封装和制造可堆叠封装的方法,可堆叠封装和制造可堆叠封装的方法使用重新配置的插入件并入嵌入式互连球,从而允许柔性层叠封装配置。所形成的沟槽暴露嵌入式互连球的顶部,从而提供各种插入件的附接。通过将插入件附接至可堆叠封装所形成的组件允许封装的装置被安裝在可堆叠封装上方。
在描述和权利要求书中的术语“前面”、“背面”、“顶部”、“底部”、“上方”、“在……下”等等(若有的话)用于描述性目的,且未必用于描述永久性相对位置。应理解,如此使用的术语在适当情况下可互换,使得本文中所描述的本发明的实施例例如能够以除本文中所示出或以其它方式描述的那些取向之外的其它取向操作。
虽然本文中参考具体实施例描述了本发明,但是在不脱离如所附权利要求书中所阐述的本发明的范围的情况下,可作出各种修改和改变。于是,本说明书和图应视为说明性的而不具是限制性意义,并且所有此类修改旨在包括在本发明的范围内。本文中关于具体实施例描述的任何益处、优点或针对问题的解决方案不旨在被解释为任何或所有权利要求的关键、必需或必要的特征或要素。
如本文中所使用的术语“耦合”不旨在限制于直接耦合或机械耦合。
此外,如本文中所使用的术语“一个(a/an)”被限定为一个或多于一个。再者,权利要求书中例如“至少一个”和“一个或多个”的介绍性短语的使用不应解释为暗示由不定冠词“一个(a/an)”所引导的另一权利要求要素将包含此类引导的权利要求要素的任何特定权利要求限于仅包含一个此类要素的发明,甚至当同一权利要求包括介绍性短语“一个或多个”或“至少一个”和例如“一个(a/an)”的不定冠词时。对于定冠词的使用也是如此。
除非另有陈述,否则例如“第一”和“第二”的术语用于任意地区别此类术语所描述的元件。因此,这些术语未必旨在指示此类要素的时间或其它优先次序。
Claims (10)
1.一种制造封装组件的方法,其特征在于,所述方法包括:
将多个互连球附接至第一基板的第一表面;
用包封剂包封所述第一基板的所述第一表面和所述多个互连球;
在所述包封剂的暴露所述互连球的一部分的第一表面中形成沟槽,所述互连球的暴露的部分为安置在所述第一基板的所述第一表面处的第一导电层提供电连接性;
提供具有安置在第二基板的第一表面处的第一互连层的插入件;以及
通过将所述第一互连层的连接部位附接至所述互连球的暴露的部分形成组件,所述第二基板的所述第一表面延伸到所述沟槽中。
2.根据权利要求1所述的方法,其特征在于,进一步包括将第一多个球连接器附接至所述第一基板的第二表面。
3.根据权利要求1所述的方法,其特征在于,包封进一步包括包封附接至所述第一基板的所述第一表面的半导体管芯。
4.根据权利要求3所述的方法,其特征在于,在倒装芯片配置中,所述半导体管芯被附接至所述第一基板的所述第一表面。
5.根据权利要求3所述的方法,其特征在于,所述沟槽为至少部分围绕所述半导体管芯的连续沟槽。
6.根据权利要求3所述的方法,其特征在于,形成组件进一步包括所述第二基板的第二表面,与所述包封剂的所述第一表面相比,所述第二基板的第二表面被定位成距第一基板的所述第一表面更远。
7.根据权利要求6所述的方法,其特征在于,进一步包括将封装的装置附接至安置在所述第二基板的所述第二表面处的第二互连层的连接部位。
8.根据权利要求1所述的方法,其特征在于,使用膜辅助模制技术形成所述沟槽。
9.一种制造封装组件的方法,其特征在于,所述方法包括:
提供具有第一表面的封装基板;
将管芯附接至所述封装基板的所述第一表面;
将多个互连球附接至所述封装基板的所述第一表面,所述多个互连球至少部分围绕所述管芯且电连接至所述管芯;
用包封剂包封所述封装基板的所述第一表面、管芯和多个互连球;
在所述包封剂的暴露所述互连球的顶部的第一表面中形成空腔,所述互连球的所述暴露的顶部为安置在所述封装基板的所述第一表面处的第一导电层提供电连接性;
提供具有安置在插入件基板的第一表面处的第一互连层的插入件;以及
通过将所述第一互连层的连接部位附接至所述互连球的暴露的顶部形成组件,所述插入件基板的所述第一表面延伸到所述空腔中。
10.一种封装组件,其特征在于,包括:
第一封装,包括:
具有第一表面的封装基板,
附接至所述封装基板的所述第一表面的管芯,
附接至所述封装基板的所述第一表面的多个互连球,所述多个互连球至少部分围绕所述管芯,
具有顶面的包封剂,所述包封剂包封所述封装基板的所述第一表面、管芯和多个互连球,以及
形成在所述包封剂的暴露所述互连球的顶部的所述顶面中的沟槽,所述互连球的所述暴露的顶部为安置在所述第一基板的所述第一表面处的第一导电层提供电连接性;以及
插入件,包括:
具有顶面和底面的插入件基板,所述底面被放置在所述沟槽中且在所述包封剂的所述顶面下方,
安置在所述插入件基板的所述顶面处的第一互连层,以及
安置在所述插入件基板的所述底面处的第二互连层,所述第二互连层具有耦合至所述互连球的所述暴露的顶部的连接部位。
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