CN107685412B - 成型模、树脂成型装置及树脂成型品的制造方法 - Google Patents

成型模、树脂成型装置及树脂成型品的制造方法 Download PDF

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Publication number
CN107685412B
CN107685412B CN201710573768.1A CN201710573768A CN107685412B CN 107685412 B CN107685412 B CN 107685412B CN 201710573768 A CN201710573768 A CN 201710573768A CN 107685412 B CN107685412 B CN 107685412B
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mold
frame
resin
attached
inner member
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Chinese (zh)
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CN107685412A (zh
Inventor
田村孝司
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Towa Corp
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Towa Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
    • B29C2043/046—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds travelling between different stations, e.g. feeding, moulding, curing stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
CN201710573768.1A 2016-08-03 2017-07-14 成型模、树脂成型装置及树脂成型品的制造方法 Active CN107685412B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016152524A JP6827283B2 (ja) 2016-08-03 2016-08-03 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP2016-152524 2016-08-03

Publications (2)

Publication Number Publication Date
CN107685412A CN107685412A (zh) 2018-02-13
CN107685412B true CN107685412B (zh) 2020-03-06

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CN201710573768.1A Active CN107685412B (zh) 2016-08-03 2017-07-14 成型模、树脂成型装置及树脂成型品的制造方法

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Country Link
JP (1) JP6827283B2 (ko)
KR (1) KR102037098B1 (ko)
CN (1) CN107685412B (ko)
TW (1) TWI669202B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6854784B2 (ja) * 2018-01-15 2021-04-07 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法
JP6994445B2 (ja) * 2018-08-31 2022-01-14 Ｔｏｗａ株式会社 樹脂成形装置、離型フィルムの剥離方法、樹脂成形品の製造方法
JP7018377B2 (ja) * 2018-11-26 2022-02-10 Ｔｏｗａ株式会社 成形型、樹脂成形装置、樹脂成形品の製造方法
JP2022037315A (ja) 2020-08-25 2022-03-09 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1832839A (zh) * 2004-02-13 2006-09-13 东和株式会社 电子元器件的树脂密封方法以及用于该方法的模具
CN102529002A (zh) * 2010-09-16 2012-07-04 东和株式会社 压缩成形模具及压缩成形方法
CN103240817A (zh) * 2012-02-14 2013-08-14 住友重机械工业株式会社 树脂密封装置及树脂密封方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3282453B2 (ja) * 1995-06-30 2002-05-13 ぺんてる株式会社 カセット式射出成形用金型装置
JP3859457B2 (ja) * 2001-03-27 2006-12-20 沖電気工業株式会社 半導体装置の製造方法
JP3997521B2 (ja) * 2002-12-06 2007-10-24 日本ゼオン株式会社 射出成形用金型及び平板成形品の製造方法
JP4217572B2 (ja) 2003-09-18 2009-02-04 アピックヤマダ株式会社 樹脂モールド方法および樹脂モールド装置
JP2005311082A (ja) * 2004-04-21 2005-11-04 Nec Electronics Corp 半導体デバイス製造装置
JP6039198B2 (ja) * 2012-03-07 2016-12-07 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置
JP5764629B2 (ja) * 2013-09-24 2015-08-19 アピックヤマダ株式会社 シート樹脂の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1832839A (zh) * 2004-02-13 2006-09-13 东和株式会社 电子元器件的树脂密封方法以及用于该方法的模具
CN102529002A (zh) * 2010-09-16 2012-07-04 东和株式会社 压缩成形模具及压缩成形方法
CN103240817A (zh) * 2012-02-14 2013-08-14 住友重机械工业株式会社 树脂密封装置及树脂密封方法

Also Published As

Publication number Publication date
KR102037098B1 (ko) 2019-10-29
TW201805133A (zh) 2018-02-16
CN107685412A (zh) 2018-02-13
TWI669202B (zh) 2019-08-21
JP2018020477A (ja) 2018-02-08
KR20180015568A (ko) 2018-02-13
JP6827283B2 (ja) 2021-02-10

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