CN107565374B - 具有光束形状修改的激光器 - Google Patents
具有光束形状修改的激光器 Download PDFInfo
- Publication number
- CN107565374B CN107565374B CN201710697144.0A CN201710697144A CN107565374B CN 107565374 B CN107565374 B CN 107565374B CN 201710697144 A CN201710697144 A CN 201710697144A CN 107565374 B CN107565374 B CN 107565374B
- Authority
- CN
- China
- Prior art keywords
- laser
- substrate
- facet
- reflective
- etched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012986 modification Methods 0.000 title abstract description 9
- 230000004048 modification Effects 0.000 title abstract description 9
- 239000004065 semiconductor Substances 0.000 claims abstract description 86
- 239000000758 substrate Substances 0.000 claims description 79
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 13
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 abstract description 12
- 238000010168 coupling process Methods 0.000 abstract description 12
- 238000005859 coupling reaction Methods 0.000 abstract description 12
- 239000013307 optical fiber Substances 0.000 abstract description 11
- 238000004088 simulation Methods 0.000 description 30
- 238000005530 etching Methods 0.000 description 28
- 229910052710 silicon Inorganic materials 0.000 description 20
- 239000010703 silicon Substances 0.000 description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 18
- 238000000034 method Methods 0.000 description 14
- 238000005253 cladding Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000000835 fiber Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 241000899717 Itaya Species 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- -1 for example Chemical compound 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/3013—AIIIBV compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0207—Substrates having a special shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0217—Removal of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0267—Integrated focusing lens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0287—Facet reflectivity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1082—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region with a special facet structure, e.g. structured, non planar, oblique
- H01S5/1085—Oblique facets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34326—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on InGa(Al)P, e.g. red laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/18—Semiconductor lasers with special structural design for influencing the near- or far-field
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Biophysics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261644270P | 2012-05-08 | 2012-05-08 | |
| US61/644,270 | 2012-05-08 | ||
| CN201380024259.3A CN104380545B (zh) | 2012-05-08 | 2013-05-07 | 具有光束形状修改的激光器 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380024259.3A Division CN104380545B (zh) | 2012-05-08 | 2013-05-07 | 具有光束形状修改的激光器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107565374A CN107565374A (zh) | 2018-01-09 |
| CN107565374B true CN107565374B (zh) | 2020-08-07 |
Family
ID=49548575
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710697144.0A Active CN107565374B (zh) | 2012-05-08 | 2013-05-07 | 具有光束形状修改的激光器 |
| CN201380024259.3A Active CN104380545B (zh) | 2012-05-08 | 2013-05-07 | 具有光束形状修改的激光器 |
| CN201710697145.5A Active CN107579428B (zh) | 2012-05-08 | 2013-05-07 | 具有光束形状修改的激光器 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380024259.3A Active CN104380545B (zh) | 2012-05-08 | 2013-05-07 | 具有光束形状修改的激光器 |
| CN201710697145.5A Active CN107579428B (zh) | 2012-05-08 | 2013-05-07 | 具有光束形状修改的激光器 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US9401582B2 (https=) |
| EP (2) | EP4228109A3 (https=) |
| JP (1) | JP6220864B2 (https=) |
| CN (3) | CN107565374B (https=) |
| WO (1) | WO2013169796A1 (https=) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107565374B (zh) | 2012-05-08 | 2020-08-07 | 镁可微波技术有限公司 | 具有光束形状修改的激光器 |
| EP3066727A4 (en) | 2013-11-07 | 2017-05-17 | MACOM Technology Solutions Holdings, Inc. | Lasers with beam shape and beam direction modification |
| JP6790364B2 (ja) * | 2016-01-25 | 2020-11-25 | 三菱電機株式会社 | 光半導体装置 |
| US10027087B2 (en) * | 2016-02-19 | 2018-07-17 | Macom Technology Solutions Holdings, Inc. | Techniques for laser alignment in photonic integrated circuits |
| KR101929465B1 (ko) * | 2016-10-18 | 2019-03-14 | 주식회사 옵텔라 | 광학모듈 |
| WO2018193551A1 (ja) * | 2017-04-19 | 2018-10-25 | 三菱電機株式会社 | 光半導体装置及びその製造方法 |
| JP6911567B2 (ja) | 2017-06-22 | 2021-07-28 | 住友電気工業株式会社 | 量子カスケード半導体レーザ |
| US10608412B2 (en) * | 2017-06-19 | 2020-03-31 | Sumitomo Electric Industries, Ltd. | Quantum cascade laser, light emitting apparatus |
| JP6939119B2 (ja) * | 2017-06-19 | 2021-09-22 | 住友電気工業株式会社 | 量子カスケード半導体レーザ、発光装置、半導体レーザを作製する方法 |
| JP6939120B2 (ja) | 2017-06-19 | 2021-09-22 | 住友電気工業株式会社 | 量子カスケード半導体レーザ、発光装置、半導体レーザを作製する方法 |
| US10476237B2 (en) * | 2017-06-22 | 2019-11-12 | Sumitomo Electric Industries, Ltd. | Quantum cascade laser |
| US10476235B2 (en) * | 2017-06-22 | 2019-11-12 | Sumitomo Electric Industries, Ltd. | Quantum cascade laser |
| US10404038B2 (en) * | 2017-06-22 | 2019-09-03 | Sumitomo Electric Industries, Ltd. | Quantum cascade laser |
| CN111344915B (zh) * | 2017-11-17 | 2022-09-30 | 三菱电机株式会社 | 半导体激光装置 |
| DE102018111319A1 (de) * | 2018-05-11 | 2019-11-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
| US10649138B2 (en) | 2018-09-21 | 2020-05-12 | Nokia Solutions And Networks Oy | Optical device having a photonic chip with one or more suspended functional portions |
| EP4300730A4 (en) * | 2021-02-26 | 2025-01-22 | Kyocera Corporation | SEMICONDUCTOR COMPONENT MANUFACTURING METHOD, SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR COMPONENT |
| CN114336279A (zh) * | 2021-12-20 | 2022-04-12 | 华侨大学 | 实现表面等离激元激光输出到远场的装置 |
| CN114006261B (zh) * | 2022-01-04 | 2022-03-11 | 福建慧芯激光科技有限公司 | 一种具有圆形光斑的垂直腔面发射激光器 |
| DE102024103984A1 (de) * | 2024-02-13 | 2025-08-14 | Ams-Osram International Gmbh | Laservorrichtung und verfahren |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004059808A3 (en) * | 2002-12-20 | 2004-12-09 | Cree Inc | Methods of forming semiconductor devices including mesa structures and multiple passivation layers and related devices |
| CN101867154A (zh) * | 2009-02-06 | 2010-10-20 | 索尼公司 | 半导体装置 |
| CN101919076A (zh) * | 2009-03-11 | 2010-12-15 | 住友电气工业株式会社 | Ⅲ族氮化物半导体器件、外延衬底及ⅲ族氮化物半导体器件的制作方法 |
Family Cites Families (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4293826A (en) * | 1979-04-30 | 1981-10-06 | Xerox Corporation | Hybrid semiconductor laser/detectors |
| JPS61290787A (ja) * | 1985-06-18 | 1986-12-20 | Sharp Corp | 半導体レ−ザ装置 |
| US4851368A (en) | 1987-12-04 | 1989-07-25 | Cornell Research Foundation, Inc. | Method of making travelling wave semi-conductor laser |
| JPH0236585A (ja) * | 1988-07-27 | 1990-02-06 | Kokusai Denshin Denwa Co Ltd <Kdd> | 量子井戸構造及び量子井戸構造を用いた半導体素子 |
| EP0410067B1 (en) * | 1989-07-27 | 1993-09-22 | International Business Machines Corporation | Integrated semiconductor diode laser and photodiode structure |
| DE69009448T2 (de) * | 1990-03-08 | 1994-12-01 | Ibm | Halbleiterlaseranordnung. |
| US5294815A (en) * | 1991-07-29 | 1994-03-15 | Ricoh Company, Ltd. | Semiconductor light emitting device with terraced structure |
| JPH05136459A (ja) * | 1991-07-29 | 1993-06-01 | Ricoh Co Ltd | 半導体発光装置 |
| JP3232152B2 (ja) * | 1992-05-14 | 2001-11-26 | 株式会社リコー | 発光ダイオードアレイ |
| US5259925A (en) * | 1992-06-05 | 1993-11-09 | Mcdonnell Douglas Corporation | Method of cleaning a plurality of semiconductor devices |
| JP2869279B2 (ja) * | 1992-09-16 | 1999-03-10 | 三菱電機株式会社 | 半導体レーザダイオード及びその製造方法並びに半導体レーザダイオードアレイ |
| US5581523A (en) * | 1992-11-17 | 1996-12-03 | Seiko Epson Corporation | Laser emission unit, optical head and optical memory device |
| US5392308A (en) * | 1993-01-07 | 1995-02-21 | Sdl, Inc. | Semiconductor laser with integral spatial mode filter |
| US5615052A (en) * | 1993-04-16 | 1997-03-25 | Bruce W. McCaul | Laser diode/lens assembly |
| US5627851A (en) * | 1995-02-10 | 1997-05-06 | Ricoh Company, Ltd. | Semiconductor light emitting device |
| DE19514625C2 (de) * | 1995-04-26 | 1997-03-06 | Fraunhofer Ges Forschung | Anordnung zur Formung des geometrischen Querschnitts eines Strahlungsfelds eines oder mehrerer Festkörper- und/oder Halbleiterlaser(s) |
| JP3101997B2 (ja) * | 1996-02-05 | 2000-10-23 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子 |
| JP2000114639A (ja) * | 1998-10-01 | 2000-04-21 | Sony Corp | 半導体レーザ |
| JP2000277850A (ja) * | 1999-03-29 | 2000-10-06 | Sony Corp | 半導体レーザ素子、半導体レーザ装置、及びその作製方法 |
| JP3934828B2 (ja) * | 1999-06-30 | 2007-06-20 | 株式会社東芝 | 半導体レーザ装置 |
| JP3956647B2 (ja) * | 2001-05-25 | 2007-08-08 | セイコーエプソン株式会社 | 面発光レ−ザの製造方法 |
| WO2002103866A1 (en) * | 2001-06-15 | 2002-12-27 | Nichia Corporation | Semiconductor laser element, and its manufacturing method |
| US6750478B2 (en) * | 2001-09-28 | 2004-06-15 | The Furukawa Electric Co., Ltd. | Semiconductor laser device and method for suppressing fabry perot oscillations |
| US8442084B2 (en) * | 2002-10-03 | 2013-05-14 | Laser Operations Llc | High performance vertically emitting lasers |
| JP2004327654A (ja) * | 2003-04-24 | 2004-11-18 | Ricoh Co Ltd | 半導体レーザモジュールおよびホログラムレーザユニットおよび光ピックアップ |
| JP2004325826A (ja) * | 2003-04-25 | 2004-11-18 | Fuji Photo Film Co Ltd | 光学部材の固定方法および固定構造 |
| JP3838218B2 (ja) * | 2003-05-19 | 2006-10-25 | ソニー株式会社 | 面発光型半導体レーザ素子及びその製造方法 |
| US7835415B2 (en) | 2003-09-03 | 2010-11-16 | Binoptics Corporation | Single longitudinal mode laser diode |
| EP1517166B1 (en) * | 2003-09-15 | 2015-10-21 | Nuvotronics, LLC | Device package and methods for the fabrication and testing thereof |
| US20050083982A1 (en) * | 2003-10-20 | 2005-04-21 | Binoptics Corporation | Surface emitting and receiving photonic device |
| JP4800974B2 (ja) * | 2004-01-20 | 2011-10-26 | ビノプティクス・コーポレイション | 光装置および単一チップ上に双方向光動作用の統合されたレーザおよび検出器を製造する方法 |
| US7598527B2 (en) | 2004-01-20 | 2009-10-06 | Binoptics Corporation | Monitoring photodetector for integrated photonic devices |
| JP4634047B2 (ja) | 2004-01-23 | 2011-02-16 | パイオニア株式会社 | 集積型半導体発光素子及びその製造方法 |
| US7116690B2 (en) * | 2004-05-17 | 2006-10-03 | Textron Systems Corporation | Staggered array coupler |
| JP2005353923A (ja) * | 2004-06-11 | 2005-12-22 | Eudyna Devices Inc | 光モジュールおよび光モジュールの製造方法 |
| JP4578164B2 (ja) | 2004-07-12 | 2010-11-10 | 日本オプネクスト株式会社 | 光モジュール |
| JP4537796B2 (ja) * | 2004-08-04 | 2010-09-08 | 株式会社リコー | ビーム整形用光学系及びレーザ光源及びビーム整形用光学系の作成方法 |
| TWI385764B (zh) * | 2004-09-13 | 2013-02-11 | Taiwan Semiconductor Mfg | 於微機械結構中密封包裝之光學組件 |
| KR20080006634A (ko) * | 2005-04-28 | 2008-01-16 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 리세스 내에 배치된 led를 포함하는 광원 |
| US8130806B2 (en) | 2005-06-22 | 2012-03-06 | Binoptics Corporation | AlGaInN-based lasers produced using etched facet technology |
| CN102035135B (zh) * | 2005-08-25 | 2013-02-27 | 宾奥普迪克斯股份有限公司 | 形成在单个薄片上的半导体激光器谐振腔 |
| US20070047609A1 (en) * | 2005-08-30 | 2007-03-01 | Francis Daniel A | Wafer testing of edge emitting lasers |
| US7359416B2 (en) | 2006-03-15 | 2008-04-15 | Matsushita Electric Industrial Co., Ltd. | Optical semiconductor device |
| JP5227525B2 (ja) * | 2007-03-23 | 2013-07-03 | 株式会社日立製作所 | 生体光計測装置 |
| JP5223552B2 (ja) * | 2008-05-02 | 2013-06-26 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子の製造方法 |
| KR101833379B1 (ko) * | 2009-11-05 | 2018-02-28 | 더 리전츠 오브 더 유니버시티 오브 캘리포니아 | 에칭된 미러들을 구비하는 반극성 {20-21} ⅲ-족 질화물 레이저 다이오드들 |
| JP5368957B2 (ja) * | 2009-12-04 | 2013-12-18 | シャープ株式会社 | 半導体レーザチップの製造方法 |
| US8315287B1 (en) * | 2011-05-03 | 2012-11-20 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd | Surface-emitting semiconductor laser device in which an edge-emitting laser is integrated with a diffractive lens, and a method for making the device |
| US8787418B2 (en) | 2011-08-11 | 2014-07-22 | Sensor Electronic Technology, Inc. | Emitting device with compositional and doping inhomogeneities in semiconductor layers |
| US9065237B2 (en) * | 2011-12-07 | 2015-06-23 | Jds Uniphase Corporation | High-brightness spatial-multiplexed multi-emitter pump with tilted collimated beam |
| CN107565374B (zh) * | 2012-05-08 | 2020-08-07 | 镁可微波技术有限公司 | 具有光束形状修改的激光器 |
-
2013
- 2013-05-07 CN CN201710697144.0A patent/CN107565374B/zh active Active
- 2013-05-07 CN CN201380024259.3A patent/CN104380545B/zh active Active
- 2013-05-07 CN CN201710697145.5A patent/CN107579428B/zh active Active
- 2013-05-07 EP EP23166378.2A patent/EP4228109A3/en active Pending
- 2013-05-07 WO PCT/US2013/039971 patent/WO2013169796A1/en not_active Ceased
- 2013-05-07 US US13/889,207 patent/US9401582B2/en active Active
- 2013-05-07 JP JP2015511630A patent/JP6220864B2/ja active Active
- 2013-05-07 EP EP13787334.5A patent/EP2847834B1/en active Active
-
2016
- 2016-05-20 US US15/160,895 patent/US9865993B2/en active Active
- 2016-05-20 US US15/160,888 patent/US9859687B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004059808A3 (en) * | 2002-12-20 | 2004-12-09 | Cree Inc | Methods of forming semiconductor devices including mesa structures and multiple passivation layers and related devices |
| CN101867154A (zh) * | 2009-02-06 | 2010-10-20 | 索尼公司 | 半导体装置 |
| CN101919076A (zh) * | 2009-03-11 | 2010-12-15 | 住友电气工业株式会社 | Ⅲ族氮化物半导体器件、外延衬底及ⅲ族氮化物半导体器件的制作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US9865993B2 (en) | 2018-01-09 |
| EP4228109A2 (en) | 2023-08-16 |
| JP6220864B2 (ja) | 2017-10-25 |
| JP2015519008A (ja) | 2015-07-06 |
| US20160268769A1 (en) | 2016-09-15 |
| EP2847834A1 (en) | 2015-03-18 |
| CN107579428B (zh) | 2020-03-03 |
| US9401582B2 (en) | 2016-07-26 |
| CN104380545A (zh) | 2015-02-25 |
| US9859687B2 (en) | 2018-01-02 |
| WO2013169796A1 (en) | 2013-11-14 |
| CN104380545B (zh) | 2017-09-15 |
| US20160285239A1 (en) | 2016-09-29 |
| EP2847834A4 (en) | 2016-08-31 |
| CN107579428A (zh) | 2018-01-12 |
| CN107565374A (zh) | 2018-01-09 |
| EP2847834B1 (en) | 2023-04-05 |
| US20130301666A1 (en) | 2013-11-14 |
| EP4228109A3 (en) | 2023-10-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107565374B (zh) | 具有光束形状修改的激光器 | |
| US10038298B2 (en) | Edge-emitting etched-facet lasers | |
| US7972879B2 (en) | Multi-level integrated photonic devices | |
| US9300115B2 (en) | Quantum cascade laser | |
| US20090129421A1 (en) | Semiconductor laser diode | |
| US8558245B2 (en) | Optical semiconductor device having ridge structure formed on active layer containing p-type region and its manufacture method | |
| US20110281382A1 (en) | Nitride-based semiconductor device and method of fabricating the same | |
| US12051885B2 (en) | Or relating to a distributed feedback laser device for photonics integrated cirtuit and a method of manufacture | |
| CN111129945B (zh) | 整片制作省隔离器边发射激光器芯片的方法 | |
| EP1225670A1 (en) | Semiconductor device with current confinement structure | |
| JP2613975B2 (ja) | 周期利得型半導体レーザ素子 | |
| US20230369829A1 (en) | Quantum well structure, chip processing method, chip, and laser | |
| Remiens et al. | Buried ridge stripe 1.5 μm GaInAsP/InP laser-waveguide integration by a simplified process | |
| 米俊萍 et al. | Distributed Bragg reflector laser (1.8 μm) with 10 nm wavelength tuning range |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |