CN107507784A - 剥离装置 - Google Patents
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Abstract
提供剥离装置,对被剥离了保护部件的晶片上是否残留有保护部件的树脂进行确认。剥离装置(1)用于将由在膜(S2)从晶片(W)的外周缘(Wd)探出而形成了探出部(S2a)的状态下借助树脂(S1)将膜粘固在晶片的一个面(Wa)上的情况下的树脂和膜构成的保护部件(S)从晶片剥离,该剥离装置具有使保护部件朝下而对晶片的另一个面(Wb)进行保持的单元(2)、对保护部件的探出部进行夹持的单元(3)、使夹持单元与保持单元相对地从晶片的外周缘朝向中心移动而将保护部件从晶片剥离的单元(4)、在利用剥离单元将保护部件剥离之后对晶片的一个面进行拍摄的单元、以及根据拍摄单元所拍摄的拍摄图像对残存的树脂的有无进行判断的判断单元(19)。
Description
技术领域
本发明涉及将保护部件从晶片剥离的剥离装置。
背景技术
当在半导体晶片的制造工艺中对具有平坦面的晶片进行制作的情况下,例如,利用线切割机等将由硅等原材料构成的圆柱状的锭切断得较薄而得到圆板状的晶片。由于在该圆板状的晶片的两个面上存在起伏的情况较多,所以对切出的晶片实施磨削加工,即,实施使旋转的磨削磨具与晶片的由线切割机切断的切断面抵接从而将切断面的起伏去除而使其成为平坦的面的加工。
在进行磨削加工时,例如,如图6所示,在圆板状的晶片W的一个面Wa上利用液状树脂S1来形成保护部件。要想在晶片W上形成保护部件,则例如将直径比晶片W的直径大的圆形膜S2载置在保护部件形成装置的保持工作台90的平坦的保持面90a上,从树脂提供装置91按照规定的量将液状的树脂S1提供到该膜S2上。该树脂S1例如具有因光(代表性的是紫外线)而硬化的性质。然后,利用保持单元92对晶片W的另一个面Wb进行吸引保持,将晶片W从上侧相对于液状树脂S1按压在配设成与晶片W的一个面Wa对置的膜S2上,由此,将液状树脂S1推展开而成为晶片W的一个面Wa整面被液状树脂S1覆盖的状态。接着,例如,从配设在保持工作台90的内部的紫外线照射机构93对液状树脂S1进行紫外线的照射而使液状树脂S1硬化,从而形成图7所示的保护部件S。并且,会形成膜S2从晶片W的外周缘Wd探出了的探出部S2a。
然后,如图7所示,按照使没有形成保护部件S的另一个面Wb为上侧的方式将晶片W载置在磨削装置94的卡盘工作台940的保持面上,使旋转的磨削磨轮941从晶片W的上方下降而一边使磨削磨具941a与晶片W的另一个面Wb抵接一边进行磨削。之后,在通过剥离装置(例如,参照专利文献1)将保护部件S从晶片W剥离之后,再对受保护部件S保护的晶片W的一个面Wa进行磨削,由此,能够制作出两个面均为平坦面的晶片W。
专利文献1:日本特开2013-168488号公报
在将保护部件S从晶片W剥离时,通过保持单元对晶片W的最先进行了磨削的面Wb(另一个面Wb)进行吸引保持而将晶片W抬起,通过例如由夹具等构成的夹持单元对膜S2进行夹持,使夹持单元移动而将保护部件S从晶片W剥离。然而,有时来自保护部件S的树脂S1会残留在被剥离了保护部件S的晶片W的一个面Wa上。认为该树脂S1残留的原因例如是在利用液状树脂S1形成保护部件S时气泡混入到液状树脂S1中,或液状树脂S1没有因紫外线的照射而完全硬化等。
因此,在将保护部件S从晶片W剥离时,存在对被剥离了保护部件S的晶片W上是否残留有保护部件S的树脂S1进行确认的课题。
发明内容
本发明的目的在于提供一种剥离装置,对被剥离了保护部件的晶片上是否残留有保护部件的树脂进行确认。
根据本发明,提供剥离装置,其将保护部件从晶片剥离,该保护部件是由在膜从晶片的外周缘探出而形成了探出部的状态下借助树脂将该膜粘固在晶片的一个面上的情况下的该树脂和该膜构成的,其中,该剥离装置具有:保持单元,其具有使该保护部件朝下而对晶片的另一个面进行保持的保持面;夹持单元,其对该保持单元所保持的晶片的该保护部件的该探出部进行夹持;剥离单元,其使该夹持单元与该保持单元相对地从晶片的外周缘朝向中心沿径向移动而将该保护部件从晶片剥离;拍摄单元,在利用该剥离单元将该保护部件剥离之后,该拍摄单元对此前形成有该保护部件的晶片的一个面进行拍摄;以及判断单元,其根据该拍摄单元所拍摄的拍摄图像对残存的该树脂的有无进行判断。
根据本发明的剥离装置,在通过剥离单元使夹持单元与保持单元相对地从晶片的外周缘朝向中心沿径向移动而将保护部件从晶片剥离之后,能够通过拍摄单元对此前形成有保护部件的晶片的一个面进行拍摄,通过判断单元来根据拍摄单元所拍摄的拍摄图像对残存的树脂的有无进行判断。
附图说明
图1是示出剥离装置的一例的立体图。
图2是示出通过夹持单元对保持单元所保持的晶片的保护部件的探出部进行夹持的状态的剖视图。
图3是示出通过剥离单元使夹持着保护部件的探出部的夹持单元移动并使保持单元在与剥离单元相反的方向上移动而开始了保护部件的剥离的状态的剖视图。
图4是示出通过剥离单元使夹持着保护部件的探出部的夹持单元移动并使保持单元在与剥离单元相反的方向上移动而将保护部件的大部分从晶片剥离了的状态的剖视图。
图5是示出通过拍摄单元对此前形成有保护部件的晶片的一个面进行拍摄的状态的剖视图。
图6是说明利用液状树脂在晶片的一个面上形成保护部件的状态的示意性的局部剖视侧视图。
图7是示出对保护部件进行保持而对晶片的另一个面进行磨削的状态的侧视图。
标号说明
1:剥离装置;10:基座;11:柱;19:判断单元;12:Y轴方向移动单元;120:滚珠丝杠;121:可动板;122:电动机;13:Z轴方向移动单元;130:滚珠丝杠;131:可动板;132:电动机;140:保持工作台;141:交接工作台;141a:交接工作台的保持面;18:旋转辊;18c:旋转辊的侧面;2:保持单元;20:臂部;21:保持垫;210:吸附部;210a:保持面;211:壳体;212:吸引管;213:吸引源;3:夹持单元;30:主轴;31:外壳;32:夹持夹具;320:一对夹持板;4:剥离单元;40:滚珠丝杠;41:一对导轨;42:电动机;43:可动块;5:载置工作台;5a:载置工作台的载置面;50:直线材料;6:下落单元;60:滚珠丝杠;61:一对导轨;62:电动机;63:可动部件;631:销台部;64:突出销;7:箱;79:光传感器;790:发光部;791:受光部;80:拍摄单元;800:拍摄部;81:拍摄单元移动单元;810:滚珠丝杠;812:电动机;813:可动块;90:保持工作台;90a:保持面;91:树脂提供装置;92:保持单元;93:紫外线照射机构;94:磨削装置;940:卡盘工作台;941:磨削磨轮;941a:磨削磨具;W:晶片;Wa:晶片的一个面;Wb:晶片的另一个面;Wd:晶片的外周缘;S:保护部件;S1:树脂;S2:膜;S2a:探出部。
具体实施方式
图1所示的剥离装置1是将保护部件S从晶片W剥离的装置。保护部件S形成为直径比晶片W大,其粘固在图2所示的晶片W的一个面Wa上,具有探出于比晶片W的外周缘Wd靠外周侧的探出部S2a。在剥离装置1的基座10上的后方侧(-X方向侧)竖立设置有柱11,在柱11的+X方向侧的侧面的上部配设有Y轴方向移动单元12,该Y轴方向移动单元12通过电动机122使滚珠丝杠120转动而使配设在可动板121上的保持单元2在Y轴方向上往复移动。
在可动板121上配设有使保持单元2沿Z轴方向往复移动的Z轴方向移动单元13。Z轴方向移动单元13通过电动机132来使滚珠丝杠130转动,从而使配设在可动板131上的保持单元2在Z轴方向上往复移动。
保持单元2具有:臂部20,其-X方向侧的一端固定在可动板131上;以及保持垫21,其配设在臂部20的+X方向侧的另一端的下表面并对晶片W进行吸引保持。图2所示的保持垫21具有:吸附部210,其由多孔部件构成,对晶片W进行吸附;以及壳体211,其对吸附部210进行支承。吸附部210经由吸引管212而与吸引源213连通。并且,通过使吸引源213进行吸引而产生吸引力,该吸引力被传递到吸附部210的探出面即与壳体211的下表面形成为同一面的保持面210a,由此,保持单元2利用保持面210a对晶片W进行吸引保持。
在图1所示的柱11的+X方向侧侧面的中间部即保持单元2的移动路径的下方,从+Z方向侧依次排列配设有:旋转辊18,其具有X轴方向的轴心;剥离单元4,其将保护部件S从晶片W剥离;拍摄单元移动单元81,其使对晶片W的一个面Wa进行拍摄的拍摄单元80移动;载置工作台5,其对从晶片W剥离了的保护部件S进行载置;以及下落单元6,其使载置工作台5上的保护部件S下落。并且,在剥离单元4的+Y方向侧的附近,保持工作台140固定配设在柱11的+X方向侧侧面上,在保持工作台140上配设有供磨削加工后的晶片W载置的交接工作台141。交接工作台141能够对载置在该保持面141a上的晶片W进行吸引保持。
剥离单元4包含:滚珠丝杠40,其具有Y轴方向的轴心;一对导轨41,它们与滚珠丝杠40平行配设;电动机42,其使滚珠丝杠40转动;以及可动块43,其内部的螺母与滚珠丝杠40螺合且侧部与导轨41滑动连接。并且,当电动机42使滚珠丝杠40转动时,与此相伴地可动块43被导轨41引导而在Y轴方向上移动,配设在可动块43上的夹持单元3随着可动块43的移动而在Y轴方向上移动。
夹持单元3具有:主轴30,其轴向为X轴方向;外壳31,其将主轴30支承为能够旋转;以及夹持夹具32,其配设在主轴30的+X方向侧的前端。夹持夹具32能够将夹持对象夹入到可以互相接近和分开的一对夹持板320之间,通过使主轴30旋转而能够改变相对于夹持对象的角度。另外,也可以是,例如,夹持单元3能够在可动块43上沿上下方向移动。
旋转辊18例如其外形形成为圆柱状,通过未图示的电动机以X轴方向的轴心为轴进行旋转。旋转辊18通过与保护部件S抵接而起到例如防止在保护部件S的剥离时可能产生的图2所示的树脂S1的折叠的作用。另外,也可以是,旋转辊18能够在Y轴方向上移动。
拍摄单元移动单元81包含:滚珠丝杠810,其具有Y轴方向的轴心;一对导轨41,它们与滚珠丝杠810平行配设;电动机812,其使滚珠丝杠810转动;以及可动块813,其内部的螺母与滚珠丝杠810螺合且侧部与导轨41滑动连接。并且,当电动机812使滚珠丝杠810转动时,与此相伴地可动块813被导轨41引导而在Y轴方向上移动,配设在可动块813上的拍摄单元80随着可动块813的移动而在Y轴方向上移动。
配设在可动块813上的拍摄单元80例如是由CCD传感器等构成的线传感器,由于其长度方向(X轴方向)的长度为构成保持单元2的保持垫21的直径以上,所以具有长度为晶片W的外径以上的测定视野。拍摄单元80以使拍摄部800朝向上方的方式配设在可动块813上,能够对保持单元2所保持的位于拍摄单元80的上方的状态的晶片W的一个面Wa进行拍摄,其中,该拍摄部800通过使受像元件等在X轴方向上排列成横向一列而构成。拍摄单元80与由CPU和存储元件等构成的判断单元19连接。
载置工作台5例如其外形为大致长方形,具有竹帘状的载置面5a。即,载置工作台5构成为:将直线材料50的长度方向设为Y轴方向而使各直线材料50在X轴方向上保持等间隔而形成间隙地整齐排列,并利用未图示的棒状的连结工具将各直线材料50的+Y轴方向侧的一端连结固定。例如,利用将各直线材料50连结的未图示的棒状的连结工具将载置工作台5固定在柱11的+X方向侧侧面上,或者将载置工作台5的下表面5b的一部分固定在后述的下落单元6的一对导轨61的侧面61c上,从而使载置工作台5配设在夹持单元3和保持单元2的移动路径下方。
下落单元6包含:滚珠丝杠60,其具有Y轴方向的轴心;一对导轨61,它们与滚珠丝杠60平行地配设;电动机62,其使滚珠丝杠60转动;可动部件63,其内部的螺母与滚珠丝杠60螺合且侧部630与导轨61滑动连接;以及突出销64,其配设在可动部件63上。
可动部件63例如具有:侧部630,其与滚珠丝杠60螺合;以及销台部631,其形成为从侧部630的上端朝向+X方向侧突出。在销台部631的上表面配设有朝向+Z方向突出的两根突出销64。各突出销64在X轴方向上按照规定的距离分开配置,当电动机62使滚珠丝杠60转动时,与此相伴地可动部件63被导轨61引导而在Y轴方向上移动,配设在可动部件63上的突出销64通过载置工作台5的各直线材料50之间的间隙而在Y轴方向上移动。
在基座10上配设有对剥离了的保护部件S进行收纳的箱7。箱7例如其外形形成为大致长方体状,在载置工作台5的+Y方向侧端的下方开口。在箱7的上部例如配设有具有发光部790(-Y方向侧)和受光部791(+Y方向侧)的透过型的光传感器79。从晶片W剥离并载置在载置工作台5上的保护部件S借助下落单元6而落到箱7内,保护部件S在箱7内堆积直到规定的高度为止,由于发光部790与受光部791之间的检查光被保护部件S遮挡,所以光传感器79检测出箱7内被保护部件S堆满。
以下,使用图1~5对通过剥离装置1将保护部件S从晶片W剥离的情况下的剥离装置1的动作进行说明。另外,在图2~5中,简略地示出了剥离装置1的结构。
首先,如图1所示,磨削后的晶片W以被磨削的面即另一个面Wb为上侧的方式载置在交接工作台141上。保持单元2在+Y方向上移动而被定位在晶片W的上方,以使得保持垫21的保持面210a的中心与晶片W的另一个面Wb的中心大致一致。进而,保持单元2沿-Z方向下降而使保持垫21的保持面210a与晶片W的另一个面Wb接触。进而,通过将因吸引源213吸引而产生的吸引力传递到保持面210a,保持单元2使保护部件S朝下而对晶片W的另一个面Wb进行吸引保持。
如图2所示,吸引保持着晶片W的保持单元2在-Y方向上移动到位于旋转辊18的上方之后在-Z方向上下降,使旋转辊18的侧面18c与保护部件S的下表面Sb的+Y方向侧的外周部附近抵接。剥离单元4使夹持单元3在-Y方向上移动,进行夹持夹具32与保护部件S的探出部S2a的对位,夹持夹具32对探出部S2a进行夹持。这里,保护部件S由树脂S1和膜S2构成,膜S2借助树脂S1被粘固在晶片W的一个面Wa上。
例如,如图3所示,在夹持夹具32对探出部S2a进行了夹持之后,使主轴30在从+X方向侧看绕顺时针旋转的方向上旋转90度,由此,在旋转辊18对保护部件S的下表面Sb侧进行支承的状态下,一边使保护部件S的树脂S1沿着旋转辊18的侧面18c缓慢地弯曲,一边通过夹持夹具32朝向-Z方向拉拽保护部件S,由此,保护部件S的一部分从晶片W的一个面Wa剥离。
接着,通过剥离单元4使夹持单元3与保持单元2相对地从晶片W的外周缘Wd朝向中心沿径向移动,将保护部件S从晶片W剥离。即,通过剥离单元4使夹持单元3向-Y方向侧移动,并且例如通过Y轴方向移动单元12使保持单元2向+Y方向侧移动,旋转辊18以X轴方向的轴心为轴进行旋转,一边维持着保护部件S的树脂S1沿着旋转辊18的侧面18c缓慢地弯曲的状态,一边将保护部件S从晶片W的+Y方向侧的外周缘Wd朝向-Y方向侧剥离。当在保护部件S的剥离中产生树脂S1的折叠时,有时在剥离后树脂S1也会局部地残留在晶片W上,或者因树脂折叠所产生的反作用而从树脂S1对晶片W的一个面Wa瞬间施加冲击力而使晶片的一个面Wa损伤,但由于旋转辊18的侧面18c与膜S2抵接,所以能够防止产生那样的问题。
如图4所示,当夹持单元3移动到晶片W的-Y方向侧的外周缘Wd附近时,使主轴30在从+X方向侧看绕顺时针旋转的方向上进一步旋转90度,由此,保护部件S的树脂S1侧成为朝向下方的状态。进而,Y轴方向移动单元12使保持单元2向+Y方向侧移动,通过剥离单元4来使夹持单元3向-Y方向侧移动,从而使保护部件S完全从晶片W剥离。当保护部件S完全从晶片W剥离时,打开夹持夹具32而使夹持单元3对探出部S2a的夹持解除,使保护部件S的树脂S1侧朝下而使保护部件S朝向载置工作台5下落。
接着,例如,使由剥离单元4实现的夹持单元3的移动和由Y轴方向移动单元12实现的保持单元2的移动停止。如图5所示,拍摄单元移动单元81使拍摄单元80向-Y方向侧移动,由此,拍摄单元80在保持单元2所保持的晶片W的下方通过。在这一通过时,利用拍摄单元80的拍摄部800对晶片W的一个面Wa从晶片W的+Y方向侧的外周缘Wd连续拍摄到-Y方向侧的外周缘Wd,从而获取对晶片W的一个面Wa整面进行了拍摄的拍摄图像。
拍摄单元80将与拍摄得到的拍摄图像有关的数据发送给图1所示的判断单元19。判断单元19例如当在拍摄图像中作为具有固有的颜色信息的像素显示出树脂S1的情况下,判断为保护部件S的树脂S1残留在保护部件S被剥离后的晶片W的一个面Wa上。
这样,本发明的剥离装置1中,在通过剥离单元4来使夹持单元3与保持单元2相对地从晶片W的外周缘Wd朝向中心沿径向移动而将保护部件S从晶片W剥离之后,能够通过拍摄单元80对此前形成有保护部件S的晶片W的一个面Wa进行拍摄,通过判断单元19来根据拍摄单元80所拍摄的拍摄图像对残存的树脂S1的有无进行判断。
例如,在通过判断单元19判断为在被剥离了保护部件S的晶片W的一个面Wa上残留有保护部件S的树脂S1的情况下,残留有该树脂S1的晶片W不会直接被收纳到晶片收纳盒中,而是与其他的晶片W分开。然后,作业者将残留在晶片W的一个面Wa上的保护部件S的树脂S1擦掉,或者将残留有树脂S1的晶片W再次搬送到保护部件形成装置等而使保护部件S再一次形成在晶片W的一个面Wa上,并通过剥离装置1将保护部件S再次进行剥离,由此,将残存的树脂S1剥离。然后,仅将晶片的一个面上没有残留树脂的晶片搬送到磨削装置上而进行磨削,从而能够防止制造出局部的厚度与其他的厚度不同的不平坦的晶片。
另外,本发明的剥离装置1并不仅限于上述实施方式,并且,在附图中图示的剥离装置1的各结构的大小或形状等也并不仅限于此,能够在可以发挥本发明的效果的范围内进行适当变更。例如,剥离单元4是使保持单元2与夹持单元3相对地从晶片W的外周缘Wd朝向中心沿径向移动而将保护部件S从晶片W剥离的剥离单元即可,因此也可以构成为不使夹持单元3在Y轴方向上移动而仅使保持单元2在Y轴方向上移动,从而将保护部件S剥离。并且,也可以构成为不使拍摄单元80在Y轴方向上移动而仅使保持单元2在Y轴方向上移动,由此,通过拍摄单元80对被剥离了保护部件S的晶片W的一个面Wa进行拍摄。并且,拍摄单元80并不仅限于线传感器,也可以由区域传感器等构成。
Claims (1)
1.一种剥离装置,其将保护部件从晶片剥离,该保护部件是由在膜从晶片的外周缘探出而形成了探出部的状态下借助树脂将该膜粘固在晶片的一个面上的情况下的该树脂和该膜构成的,其中,该剥离装置具有:
保持单元,其具有使该保护部件朝下而对晶片的另一个面进行保持的保持面;
夹持单元,其对该保持单元所保持的晶片的该保护部件的该探出部进行夹持;
剥离单元,其使该夹持单元与该保持单元相对地从晶片的外周缘朝向中心沿径向移动而将该保护部件从晶片剥离;
拍摄单元,在利用该剥离单元将该保护部件剥离之后,该拍摄单元对此前形成有该保护部件的晶片的一个面进行拍摄;以及
判断单元,其根据该拍摄单元所拍摄的拍摄图像对残存的该树脂的有无进行判断。
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KR20170141114A (ko) | 2017-12-22 |
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