CN107275257B - 基板处理装置以及基板处理方法 - Google Patents

基板处理装置以及基板处理方法 Download PDF

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Publication number
CN107275257B
CN107275257B CN201710200801.6A CN201710200801A CN107275257B CN 107275257 B CN107275257 B CN 107275257B CN 201710200801 A CN201710200801 A CN 201710200801A CN 107275257 B CN107275257 B CN 107275257B
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liquid
liquid level
pipe
liquid surface
tank
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Chinese (zh)
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CN107275257A (zh
Inventor
小林信雄
古川长树
山崎克弘
齐藤裕树
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring

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CN201710200801.6A 2016-03-30 2017-03-30 基板处理装置以及基板处理方法 Active CN107275257B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016-069323 2016-03-30
JP2016069323 2016-03-30
JP2017-012627 2017-01-27
JP2017012627A JP6861039B2 (ja) 2016-03-30 2017-01-27 基板処理装置及び基板処理方法

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CN107275257A CN107275257A (zh) 2017-10-20
CN107275257B true CN107275257B (zh) 2020-08-14

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CN201710200801.6A Active CN107275257B (zh) 2016-03-30 2017-03-30 基板处理装置以及基板处理方法

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JP (2) JP6861039B2 (enExample)
KR (1) KR101937017B1 (enExample)
CN (1) CN107275257B (enExample)
TW (1) TWI622113B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI831656B (zh) * 2018-01-04 2024-02-01 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法
JP7142535B2 (ja) * 2018-01-04 2022-09-27 東京エレクトロン株式会社 基板処理装置および基板処理方法
CN112178461A (zh) * 2019-07-01 2021-01-05 夏普株式会社 贮液装置
CN111774249A (zh) * 2020-07-17 2020-10-16 常州铭赛机器人科技股份有限公司 点胶机
US12272573B2 (en) * 2021-03-11 2025-04-08 Taiwan Semiconductor Manufacturing Company, Ltd. Load port and methods of operation
CN114446841B (zh) * 2022-04-12 2022-07-29 广州粤芯半导体技术有限公司 供酸装置及湿刻系统
CN116936421B (zh) * 2023-09-15 2023-12-01 上海陛通半导体能源科技股份有限公司 晶圆生产设备和晶圆生产工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6119709A (en) * 1998-09-28 2000-09-19 Tokyo Electron Ltd. Feeding apparatus and replenishing method of processing solution
US7082348B1 (en) * 1999-10-05 2006-07-25 Abb Ab Computer based method and system for controlling an industrial process
KR20100046836A (ko) * 2008-10-28 2010-05-07 세메스 주식회사 약액 공급장치 및 방법

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1034057A (ja) * 1996-07-25 1998-02-10 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH1090038A (ja) * 1996-09-12 1998-04-10 Sony Corp 液面検出装置
JP2002206957A (ja) * 2001-01-11 2002-07-26 Dainippon Screen Mfg Co Ltd 処理液貯留装置
JP2002289571A (ja) * 2001-03-23 2002-10-04 Dainippon Screen Mfg Co Ltd 基板処理装置
CN101208256B (zh) * 2005-04-25 2013-09-18 高级技术材料公司 具有空检测能力的基于衬里的液体储存和分配系统
JP4863260B2 (ja) * 2005-11-30 2012-01-25 東京エレクトロン株式会社 液面検出装置及びそれを備えた液処理装置
TWI439571B (zh) * 2007-01-15 2014-06-01 芝浦機械電子裝置股份有限公司 Sulfuric acid electrolysis device, electrolysis method and substrate processing device
TWI459489B (zh) * 2008-03-17 2014-11-01 盛美半導體設備（上海）有限公司 用於處理單片半導體工件的溶液製備設備和方法
JP5323661B2 (ja) * 2009-12-07 2013-10-23 東京エレクトロン株式会社 枚葉式の基板液処理装置における循環ラインの液交換方法
JP6502633B2 (ja) * 2013-09-30 2019-04-17 芝浦メカトロニクス株式会社 基板処理方法及び基板処理装置
CN104979236B (zh) * 2014-04-11 2017-09-26 沈阳芯源微电子设备有限公司 一种化学液供给装置及其供给方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6119709A (en) * 1998-09-28 2000-09-19 Tokyo Electron Ltd. Feeding apparatus and replenishing method of processing solution
US7082348B1 (en) * 1999-10-05 2006-07-25 Abb Ab Computer based method and system for controlling an industrial process
KR20100046836A (ko) * 2008-10-28 2010-05-07 세메스 주식회사 약액 공급장치 및 방법

Also Published As

Publication number Publication date
JP2017188658A (ja) 2017-10-12
KR101937017B1 (ko) 2019-01-09
JP2021101488A (ja) 2021-07-08
JP7042946B2 (ja) 2022-03-28
KR20170113205A (ko) 2017-10-12
CN107275257A (zh) 2017-10-20
TWI622113B (zh) 2018-04-21
TW201802988A (zh) 2018-01-16
JP6861039B2 (ja) 2021-04-21

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