TWI622113B - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

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Publication number
TWI622113B
TWI622113B TW106108366A TW106108366A TWI622113B TW I622113 B TWI622113 B TW I622113B TW 106108366 A TW106108366 A TW 106108366A TW 106108366 A TW106108366 A TW 106108366A TW I622113 B TWI622113 B TW I622113B
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TW
Taiwan
Prior art keywords
liquid level
liquid
tank
piping
pipe
Prior art date
Application number
TW106108366A
Other languages
English (en)
Chinese (zh)
Other versions
TW201802988A (zh
Inventor
Nobuo Kobayashi
小林信雄
Takeki Kogawa
古川長樹
Katsuhiro Yamazaki
山崎克弘
Yuki Saito
齊藤裕樹
Original Assignee
Shibaura Mechatronics Corporation
芝浦機械電子裝置股份有限公司
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Application filed by Shibaura Mechatronics Corporation, 芝浦機械電子裝置股份有限公司 filed Critical Shibaura Mechatronics Corporation
Publication of TW201802988A publication Critical patent/TW201802988A/zh
Application granted granted Critical
Publication of TWI622113B publication Critical patent/TWI622113B/zh

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    • H10P72/0402—
    • H10P72/0431—
    • H10P72/0448—
    • H10P72/06—
    • H10P72/0602—

Landscapes

  • Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
TW106108366A 2016-03-30 2017-03-14 基板處理裝置及基板處理方法 TWI622113B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016-069323 2016-03-30
JP2016069323 2016-03-30
JP2017-012627 2017-01-27
JP2017012627A JP6861039B2 (ja) 2016-03-30 2017-01-27 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
TW201802988A TW201802988A (zh) 2018-01-16
TWI622113B true TWI622113B (zh) 2018-04-21

Family

ID=60044253

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106108366A TWI622113B (zh) 2016-03-30 2017-03-14 基板處理裝置及基板處理方法

Country Status (4)

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JP (2) JP6861039B2 (enExample)
KR (1) KR101937017B1 (enExample)
CN (1) CN107275257B (enExample)
TW (1) TWI622113B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI831656B (zh) * 2018-01-04 2024-02-01 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法
JP7142535B2 (ja) * 2018-01-04 2022-09-27 東京エレクトロン株式会社 基板処理装置および基板処理方法
CN112178461A (zh) * 2019-07-01 2021-01-05 夏普株式会社 贮液装置
CN111774249A (zh) * 2020-07-17 2020-10-16 常州铭赛机器人科技股份有限公司 点胶机
US12272573B2 (en) * 2021-03-11 2025-04-08 Taiwan Semiconductor Manufacturing Company, Ltd. Load port and methods of operation
CN114446841B (zh) * 2022-04-12 2022-07-29 广州粤芯半导体技术有限公司 供酸装置及湿刻系统
CN116936421B (zh) * 2023-09-15 2023-12-01 上海陛通半导体能源科技股份有限公司 晶圆生产设备和晶圆生产工艺

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200704581A (en) * 2005-04-25 2007-02-01 Advanced Tech Materials Liner-based liquid storage and dispensing systems with empty detection capability
TW200739042A (en) * 2005-11-30 2007-10-16 Tokyo Electron Ltd Apparatus for detecting liquid level and liquid processing apparatus including the same
TW200844263A (en) * 2007-01-15 2008-11-16 Shibaura Mechatronics Corp Electrolysis apparatus and electrolysis method for sulfuric acid, and apparatus for processing substrate
TW200941612A (en) * 2008-03-17 2009-10-01 Acm Research Shanghai Inc Solution preparation apparatus and method for treating individual semiconductor workpiece processing
TW201137958A (en) * 2009-12-07 2011-11-01 Tokyo Electron Ltd Liquid replacement method of circulation line in single wafer type liquid processing apparatus
TW201530646A (zh) * 2013-09-30 2015-08-01 芝浦機械電子裝置股份有限公司 基板處理方法及基板處理裝置
TW201538883A (zh) * 2014-04-11 2015-10-16 Shenyang Solidtool Co Ltd 化學液供給裝置及其供給方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1034057A (ja) * 1996-07-25 1998-02-10 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH1090038A (ja) * 1996-09-12 1998-04-10 Sony Corp 液面検出装置
JP3557354B2 (ja) * 1998-09-28 2004-08-25 東京エレクトロン株式会社 供給装置及び補充方法
SE515570C2 (sv) * 1999-10-05 2001-09-03 Abb Ab Ett datorbaserat förfarande och system för reglering av en industriell process
JP2002206957A (ja) 2001-01-11 2002-07-26 Dainippon Screen Mfg Co Ltd 処理液貯留装置
JP2002289571A (ja) * 2001-03-23 2002-10-04 Dainippon Screen Mfg Co Ltd 基板処理装置
KR101100274B1 (ko) * 2008-10-28 2011-12-30 세메스 주식회사 약액 공급장치 및 방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200704581A (en) * 2005-04-25 2007-02-01 Advanced Tech Materials Liner-based liquid storage and dispensing systems with empty detection capability
TW200739042A (en) * 2005-11-30 2007-10-16 Tokyo Electron Ltd Apparatus for detecting liquid level and liquid processing apparatus including the same
TW200844263A (en) * 2007-01-15 2008-11-16 Shibaura Mechatronics Corp Electrolysis apparatus and electrolysis method for sulfuric acid, and apparatus for processing substrate
TW200941612A (en) * 2008-03-17 2009-10-01 Acm Research Shanghai Inc Solution preparation apparatus and method for treating individual semiconductor workpiece processing
TW201137958A (en) * 2009-12-07 2011-11-01 Tokyo Electron Ltd Liquid replacement method of circulation line in single wafer type liquid processing apparatus
TW201530646A (zh) * 2013-09-30 2015-08-01 芝浦機械電子裝置股份有限公司 基板處理方法及基板處理裝置
TW201538883A (zh) * 2014-04-11 2015-10-16 Shenyang Solidtool Co Ltd 化學液供給裝置及其供給方法

Also Published As

Publication number Publication date
TW201802988A (zh) 2018-01-16
JP2017188658A (ja) 2017-10-12
KR20170113205A (ko) 2017-10-12
KR101937017B1 (ko) 2019-01-09
CN107275257B (zh) 2020-08-14
JP2021101488A (ja) 2021-07-08
JP6861039B2 (ja) 2021-04-21
JP7042946B2 (ja) 2022-03-28
CN107275257A (zh) 2017-10-20

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