CN107231744B - 布线基板 - Google Patents
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Abstract
本发明提供一种布线基板,其具备:芯体基板;绝缘层;信号用、接地用以及电源用的各布线导体;第1搭载部,搭载第1半导体元件;第2搭载部,搭载第2半导体元件;多个第1半导体元件连接焊盘,与第1半导体元件的信号用电极连接;多个第2半导体元件连接焊盘,与第2半导体元件的信号用电极连接;以及多个信号用连接导体,连接第1半导体元件连接焊盘和第2半导体元件连接焊盘,信号用连接导体具有仅经过芯体基板的上表面侧的第1布线组以及经过芯体基板的下表面侧的第2布线组。
Description
技术领域
本公开涉及搭载多个半导体元件的布线基板。
背景技术
近几年,在便携式游戏机、通信设备所代表的电子设备的高功能化、小型化的推进过程中,对于这些电子设备所使用的布线基板也逐渐要求高功能化、小型化。因此,在布线基板上,相接近地搭载具备很多运算系统的多个半导体元件,且通过高密度形成的布线导体来互相连接多个半导体元件。搭载这种多个半导体元件的现有技术中的布线基板例如记载于特开2008-4579号公报中。
发明内容
本公开的布线基板具备:芯体基板,具有多个通孔(through hole);绝缘层,在该芯体基板的上下表面分别层叠多层,在各层具有多个过孔(via hole);信号用、接地用以及电源用的各布线导体,形成在所述芯体基板表面及通孔内,且还形成在所述绝缘层表面及过孔内;第1搭载部,形成于最上层的所述绝缘层表面,搭载第1半导体元件;第2搭载部,与所述第1搭载部相邻地形成该第2搭载部,且该第2搭载部搭载第2半导体元件;多个信号用的第1半导体元件连接焊盘,形成于所述第1搭载部,与所述第1半导体元件的信号用电极连接;多个信号用的第2半导体元件连接焊盘,形成于所述第2搭载部,与所述第2半导体元件的信号用电极连接;以及多个信号用连接导体,由所述信号用的布线导体的一部分构成,电连接彼此对应的所述信号用的第1半导体元件连接焊盘和信号用的第2半导体元件连接焊盘。所述信号用连接导体具有:第1布线组,经由过孔后仅经过所述芯体基板的上表面侧的所述绝缘层表面;以及第2布线组,经由所述通孔以及过孔后经过所述芯体基板的下表面侧的所述绝缘层表面。
附图说明
图1是表示本公开涉及的布线基板的一实施方式的主要部分示意剖视图。
具体实施方式
基于图1说明本公开涉及的布线基板A的一实施方式。图1是表示相接近地搭载的半导体元件附近的状态的布线基板A的主要部分示意剖视图。本公开的布线基板A具备绝缘基板1和布线导体2。
绝缘基板1在芯体基板1a的上下表面层叠增层(bid up)用的绝缘层1b而形成。在芯体基板1a形成有多个通孔(through hole)3。通孔3包括信号用的通孔3S、电源用的通孔3P和接地用的通孔3G。通孔3的直径是50~300μm程度,例如通过喷砂加工、钻孔加工来形成。
在增层用的绝缘层1b中形成多个过孔(via hole)4。过孔4包括信号用的过孔4S、电源用的过孔4P和接地用的过孔4G。过孔4的直径是50~100μm程度,例如通过激光加工来形成。
芯体基板1a以及绝缘层1b例如由环氧树脂、双马来酰亚胺三嗪(BT)树脂等热固化性树脂形成。在绝缘基板1的上表面彼此相邻地形成搭载第1半导体元件S1的第1搭载部X1以及搭载第2半导体元件S2的第2搭载部X2。
布线导体2形成在芯体基板1a的表面及通孔3的内侧、以及绝缘层1b的表面及过孔4的内侧。布线导体2具有信号用布线导体2S、电源用布线导体2P以及接地用布线导体2G。信号用布线导体2S具有设置在绝缘层1b的表面的很多细的带状图案。电源用布线导体2P以及接地用布线导体2G具有与信号用布线导体2S隔开给定间隔且形成在同一绝缘层1b表面、其上层或下层的绝缘层1b表面的平面状图案。布线导体2例如通过公知的半添加法(semiadditive method)、削减法(subtractive method),经镀铜等良导电性金属形成。
布线导体2的一部分在第1搭载部X1形成有很多第1半导体元件连接焊盘5。第1半导体元件连接焊盘5具有信号用的第1半导体元件连接焊盘5S、电源用的第1半导体元件连接焊盘5P以及接地用的第1半导体元件连接焊盘5G。信号用的第1半导体元件连接焊盘5S与第1半导体元件S1的信号用电极连接。电源用的第1半导体元件连接焊盘5P与第1半导体元件S1的电源用电极连接。接地用的第1半导体元件连接焊盘5G与第1半导体元件S1的接地用电极连接。
布线导体2的一部分在第2搭载部X2形成很多第2半导体元件连接焊盘6。第2半导体元件连接焊盘6具有信号用的第2半导体元件连接焊盘6S、电源用的第2半导体元件连接焊盘6P以及接地用的第2半导体元件连接焊盘6G。信号用的第2半导体元件连接焊盘6S与第2半导体元件S2的信号用电极连接。电源用的第2半导体元件连接焊盘6P与第2半导体元件S2的电源用电极连接。接地用的第2半导体元件连接焊盘6G与第2半导体元件S2的接地用电极连接。
第1半导体元件连接焊盘5和第2半导体元件连接焊盘6中,分别对应的焊盘彼此通过布线导体2的一部分被连接。即,信号用的第1半导体元件连接焊盘5S与信号用的第2半导体元件连接焊盘6S,通过由包含带状图案的信号用布线导体2S构成的多个信号用连接导体7S连接。电源用的第1半导体元件连接焊盘5P与电源用的第2半导体元件连接焊盘6P,通过由包含平面状图案的电源用布线导体2P构成的电源用连接导体7P连接。接地用的第1半导体元件连接焊盘5G与接地用的第2半导体元件连接焊盘6G,通过由包含平面状图案的接地用布线导体2G构成的接地用连接导体7G连接。
信号用的第1及第2半导体元件连接焊盘5S、6S与第1及第2半导体元件S1、S2的运算系统对应,例如被分类为40系统。每一系统的焊盘数是约50个。属于同一系统的信号用的第1及第2半导体元件连接焊盘5S、6S彼此通过约50根信号用连接导体7S连接。
与所有运算系统内的半数系统对应的信号用连接导体7S形成经由信号用的过孔4S后仅经过芯体基板1a的上表面侧的绝缘层1b的表面的第1布线组。与所有运算系统之内的剩余半数系统对应的信号用连接导体7S形成经由信号用的通孔3S以及信号用的过孔4S后经过芯体基板1a的下表面侧的第2布线组。
在彼此相邻地配置信号用的通孔3S的情况下,优选在信号用的通孔3S彼此之间配置接地用的通孔3G。由此,能够减轻在信号用的通孔3S彼此之间产生的噪声干扰。
外部连接焊盘8由形成在绝缘基板1的下表面的布线导体2的一部分构成,在绝缘基板1的下表面侧配置多个外部连接焊盘8。外部连接焊盘8包含信号用的外部连接焊盘8S、电源用的外部连接焊盘8P和接地用的外部连接焊盘8G。外部电路基板的布线导体经由焊料与外部连接焊盘8连接。由此,第1及第2半导体元件S1、S2与外部电路基板电连接。
但是,在电连接信号用的第1及第2半导体元件连接焊盘5S、6S的信号用连接导体7S全部形成在芯体基板1a的上表面侧的绝缘层1b表面的情况下,信号用的第1及第2半导体元件连接焊盘5S、6S分别大概是2000个左右,连接两者的信号用连接导体7S的布线数也达到2000根左右,所以为了形成信号用连接导体7S,在芯体基板1a上表面侧需要很多绝缘层1b。
此外,为了减轻布线基板的翘曲,需要以芯体基板1a为中心使上表面侧和下表面侧的绝缘层数对称,取得上下的平衡,为此需要在芯体基板1a下表面侧也形成很多绝缘层1b。
其结果,布线基板的层数增多,无法实现布线基板的薄型化。
相对于此,根据本公开的布线基板A,连接信号用的第1半导体元件连接焊盘5S和信号用的第2半导体元件连接焊盘6S的信号用连接导体7S被分成了第1布线组和第2布线组,该第1布线组经由过孔4S后仅经过芯体基板1a的上表面侧的绝缘层1b的表面,该第2布线组经由通孔3S以及过孔4S后经过芯体基板1a的下表面侧的绝缘层1b的表面。因此,能够使上表面侧的绝缘层1b的数目减少与第2布线组所经过的下表面侧的绝缘层1b相对应的量。同时,能够减少为了取得与上表面侧的绝缘层1b的平衡而设置的下表面侧的绝缘层1b的层数。因此,能够提供一种抑制绝缘层1b的层数增加来实现薄型化的布线基板。
本公开不限于上述的一实施方式,只要在权利要求书记载的范围内,就能够进行各种变更、改良。例如,在上述的一实施方式中,示出了形成有搭载第1及第2半导体元件S1、S2的第1及第2搭载部X1、X2这两个搭载部的情况,但是也可以具有三个以上的搭载部。
Claims (5)
1.一种布线基板,其特征在于,具备:
芯体基板,具有多个通孔;
绝缘层,在该芯体基板的上下表面分别层叠多层,在各层具有多个过孔;
信号用布线导体、接地用布线导体及电源用布线导体,形成在所述芯体基板表面及通孔内、以及所述绝缘层表面及过孔内;
第1搭载部,形成在最上层的所述绝缘层表面,搭载具有多个运算系统的信号用电极的第1半导体元件;
第2搭载部,形成为与所述第1搭载部相邻,搭载具有与所述第1半导体元件的所述多个运算系统对应的多个运算系统的信号用电极的第2半导体元件;
多个信号用的第1半导体元件连接焊盘,形成于所述第1搭载部,与所述第1半导体元件的信号用电极连接;
多个信号用的第2半导体元件连接焊盅,形成于所述第2搭载部,与所述第2半导体元件的信号用电极连接;以及
多个信号用连接导体,由所述信号用布线导体的一部分构成,电连接彼此对应的所述信号用的第1半导体元件连接焊盘和所述信号用的第2半导体元件连接焊盘,
所述信号用连接导体具有:第1布线组,经由过孔后仅经过所述芯体基板的上表面侧的所述绝缘层表面,对所述第1搭载部的一部分运算系统的所述信号用的第1半导体元件连接焊盘和与所述第1搭载部的该一部分运算系统对应的所述第2搭载部的运算系统的所述信号用的第2半导体元件连接焊盘进行连接;以及第2布线组,经由所述通孔以及过孔后经过所述芯体基板的下表面侧的所述绝缘层表面,对所述第1搭载部的剩余运算系统的所述信号用的第1半导体元件连接焊盘和与所述第1搭载部的该剩余运算系统对应的所述第2搭载部的运算系统的所述信号用的第2半导体元件连接焊盘进行连接。
2.根据权利要求1所述的布线基板,其特征在于,
在所述信号用连接导体所经过的所述通孔彼此之间,配置形成有所述接地用导体的所述通孔。
3.根据权利要求1或2所述的布线基板,其特征在于,
所述信号用连接导体的半数是所述第1布线组,剩余的半数是所述第2布线组。
4.根据权利要求1所述的布线基板,其特征在于,
所述通孔的直径是50~300μm。
5.根据权利要求1所述的布线基板,其特征在于,
所述过孔的直径是50~100μm。
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