CN107112253B - 凸点形成用膜、半导体装置及其制造方法以及连接构造体 - Google Patents

凸点形成用膜、半导体装置及其制造方法以及连接构造体 Download PDF

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CN107112253B
CN107112253B CN201680004710.9A CN201680004710A CN107112253B CN 107112253 B CN107112253 B CN 107112253B CN 201680004710 A CN201680004710 A CN 201680004710A CN 107112253 B CN107112253 B CN 107112253B
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bump
film
forming
base electrode
conductive filler
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CN107112253A (zh
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阿久津恭志
石松朋之
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Dexerials Corp
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Dexerials Corp
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    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
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    • H10W72/222—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core
    • H10W72/223—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core characterised by the structure of the outermost layers, e.g. multilayered coatings
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  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Laminated Bodies (AREA)
CN201680004710.9A 2015-01-13 2016-01-13 凸点形成用膜、半导体装置及其制造方法以及连接构造体 Active CN107112253B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-004591 2015-01-13
JP2015004591 2015-01-13
PCT/JP2016/050805 WO2016114293A1 (ja) 2015-01-13 2016-01-13 バンプ形成用フィルム、半導体装置及びその製造方法、並びに接続構造体

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CN107112253A CN107112253A (zh) 2017-08-29
CN107112253B true CN107112253B (zh) 2021-04-20

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US (1) US10943879B2 (https=)
JP (1) JP6750228B2 (https=)
KR (2) KR102182945B1 (https=)
CN (1) CN107112253B (https=)
TW (2) TWI774640B (https=)
WO (1) WO2016114293A1 (https=)

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JP7000685B2 (ja) * 2017-02-07 2022-01-20 昭和電工マテリアルズ株式会社 接続構造体の製造方法、及び、端子付き電極の製造方法並びにこれに用いられる導電粒子
CN112166529A (zh) * 2018-06-06 2021-01-01 迪睿合株式会社 连接体、连接体的制造方法、连接方法
WO2019235596A1 (ja) * 2018-06-06 2019-12-12 デクセリアルズ株式会社 接続体、接続体の製造方法、接続方法
KR20250046348A (ko) * 2018-06-26 2025-04-02 가부시끼가이샤 레조낙 땜납 입자 및 땜납 입자의 제조 방법
CN112313032A (zh) * 2018-06-26 2021-02-02 昭和电工材料株式会社 各向异性导电膜及其制造方法以及连接结构体的制造方法
US12172240B2 (en) 2018-06-26 2024-12-24 Resonac Corporation Solder particles
JP7661892B2 (ja) * 2019-12-27 2025-04-15 株式会社レゾナック はんだバンプ形成用部材、及びはんだバンプ付き電極基板の製造方法
KR20260033631A (ko) * 2019-12-27 2026-03-10 가부시끼가이샤 레조낙 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법
CN115868015A (zh) * 2020-07-27 2023-03-28 索尼半导体解决方案公司 电子设备
KR20220155139A (ko) 2021-05-14 2022-11-22 삼성전자주식회사 반도체 패키지
JP7697292B2 (ja) * 2021-06-30 2025-06-24 株式会社レゾナック はんだバンプ形成装置

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CN1477703A (zh) * 2002-08-02 2004-02-25 ǧס������ҵ��ʽ���� 焊球组件及其生产方法，形成焊块的方法
JP2008031483A (ja) * 2007-09-03 2008-02-14 Hitachi Chem Co Ltd 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
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JP2012190871A (ja) * 2011-03-09 2012-10-04 Teramikros Inc 半導体装置およびその製造方法
WO2014030744A1 (ja) * 2012-08-24 2014-02-27 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法

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