KR102182945B1 - 범프 형성용 필름, 반도체 장치 및 그의 제조 방법 및 접속 구조체 - Google Patents

범프 형성용 필름, 반도체 장치 및 그의 제조 방법 및 접속 구조체 Download PDF

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KR102182945B1
KR102182945B1 KR1020177017937A KR20177017937A KR102182945B1 KR 102182945 B1 KR102182945 B1 KR 102182945B1 KR 1020177017937 A KR1020177017937 A KR 1020177017937A KR 20177017937 A KR20177017937 A KR 20177017937A KR 102182945 B1 KR102182945 B1 KR 102182945B1
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bump
bumps
film
base electrode
conductive filler
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KR20170093170A (ko
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야스시 아쿠츠
도모유키 이시마츠
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데쿠세리아루즈 가부시키가이샤
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    • H01L24/12—
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    • H10W72/01212—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps at a different location than on the final device, e.g. forming as prepeg
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    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
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    • H10W72/221—Structures or relative sizes
    • H10W72/222—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core
    • H10W72/223—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core characterised by the structure of the outermost layers, e.g. multilayered coatings
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    • H10W72/231—Shapes
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    • H10W72/234—Cross-sectional shape, i.e. in side view
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    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
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  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Laminated Bodies (AREA)
KR1020177017937A 2015-01-13 2016-01-13 범프 형성용 필름, 반도체 장치 및 그의 제조 방법 및 접속 구조체 Active KR102182945B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020197024093A KR102398451B1 (ko) 2015-01-13 2016-01-13 범프 형성용 필름, 반도체 장치 및 그의 제조 방법 및 접속 구조체

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2015-004591 2015-01-13
JP2015004591 2015-01-13
PCT/JP2016/050805 WO2016114293A1 (ja) 2015-01-13 2016-01-13 バンプ形成用フィルム、半導体装置及びその製造方法、並びに接続構造体

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KR1020197024093A Division KR102398451B1 (ko) 2015-01-13 2016-01-13 범프 형성용 필름, 반도체 장치 및 그의 제조 방법 및 접속 구조체

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KR20170093170A KR20170093170A (ko) 2017-08-14
KR102182945B1 true KR102182945B1 (ko) 2020-11-25

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KR1020197024093A Active KR102398451B1 (ko) 2015-01-13 2016-01-13 범프 형성용 필름, 반도체 장치 및 그의 제조 방법 및 접속 구조체

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US (1) US10943879B2 (https=)
JP (1) JP6750228B2 (https=)
KR (2) KR102182945B1 (https=)
CN (1) CN107112253B (https=)
TW (2) TWI774640B (https=)
WO (1) WO2016114293A1 (https=)

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Publication number Priority date Publication date Assignee Title
JP7000685B2 (ja) * 2017-02-07 2022-01-20 昭和電工マテリアルズ株式会社 接続構造体の製造方法、及び、端子付き電極の製造方法並びにこれに用いられる導電粒子
CN112166529A (zh) * 2018-06-06 2021-01-01 迪睿合株式会社 连接体、连接体的制造方法、连接方法
WO2019235596A1 (ja) * 2018-06-06 2019-12-12 デクセリアルズ株式会社 接続体、接続体の製造方法、接続方法
KR20250046348A (ko) * 2018-06-26 2025-04-02 가부시끼가이샤 레조낙 땜납 입자 및 땜납 입자의 제조 방법
CN112313032A (zh) * 2018-06-26 2021-02-02 昭和电工材料株式会社 各向异性导电膜及其制造方法以及连接结构体的制造方法
US12172240B2 (en) 2018-06-26 2024-12-24 Resonac Corporation Solder particles
JP7661892B2 (ja) * 2019-12-27 2025-04-15 株式会社レゾナック はんだバンプ形成用部材、及びはんだバンプ付き電極基板の製造方法
KR20260033631A (ko) * 2019-12-27 2026-03-10 가부시끼가이샤 레조낙 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법
CN115868015A (zh) * 2020-07-27 2023-03-28 索尼半导体解决方案公司 电子设备
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