CN107046410B - 振动片及其制造方法、振荡器、电子设备、移动体及基站 - Google Patents
振动片及其制造方法、振荡器、电子设备、移动体及基站 Download PDFInfo
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- CN107046410B CN107046410B CN201611226911.1A CN201611226911A CN107046410B CN 107046410 B CN107046410 B CN 107046410B CN 201611226911 A CN201611226911 A CN 201611226911A CN 107046410 B CN107046410 B CN 107046410B
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- China
- Prior art keywords
- oscillator
- vibrating reed
- main surface
- quartz substrate
- temperature
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- Expired - Fee Related
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- 238000004519 manufacturing process Methods 0.000 title abstract description 10
- 239000010453 quartz Substances 0.000 claims abstract description 80
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 80
- 239000000758 substrate Substances 0.000 claims abstract description 76
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Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02157—Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
- H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
- H03L1/028—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only of generators comprising piezoelectric resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B2200/00—Indexing scheme relating to details of oscillators covered by H03B
- H03B2200/0014—Structural aspects of oscillators
- H03B2200/0018—Structural aspects of oscillators relating to the cutting angle of a crystal, e.g. AT cut quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B2200/00—Indexing scheme relating to details of oscillators covered by H03B
- H03B2200/0014—Structural aspects of oscillators
- H03B2200/0022—Structural aspects of oscillators characterised by the substrate, e.g. material
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016020522A JP2017139682A (ja) | 2016-02-05 | 2016-02-05 | 振動片、振動片の製造方法、発振器、電子機器、移動体、および基地局 |
| JP2016-020522 | 2016-02-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107046410A CN107046410A (zh) | 2017-08-15 |
| CN107046410B true CN107046410B (zh) | 2022-03-29 |
Family
ID=59497923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611226911.1A Expired - Fee Related CN107046410B (zh) | 2016-02-05 | 2016-12-27 | 振动片及其制造方法、振荡器、电子设备、移动体及基站 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10530299B2 (enExample) |
| JP (1) | JP2017139682A (enExample) |
| CN (1) | CN107046410B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201807849A (zh) * | 2016-08-17 | 2018-03-01 | 達帕有限公司 | 適用於高真實度之高整合度晶振封裝結構(二) |
| JP6942983B2 (ja) * | 2017-03-17 | 2021-09-29 | セイコーエプソン株式会社 | 発振器、電子機器および移動体 |
| MY206762A (en) * | 2017-06-29 | 2025-01-06 | Intel Corp | Package with embedded capacitors |
| JP7259393B2 (ja) * | 2019-02-22 | 2023-04-18 | セイコーエプソン株式会社 | 発振器、電子機器および移動体 |
| JP7434724B2 (ja) * | 2019-05-23 | 2024-02-21 | セイコーエプソン株式会社 | 振動デバイス、電子機器および移動体 |
| JP7516959B2 (ja) * | 2020-07-30 | 2024-07-17 | セイコーエプソン株式会社 | 発振器 |
| FR3113793B1 (fr) * | 2020-09-01 | 2023-10-20 | Syrlinks | Oscillateur de type OCXO ou OCMO et procédé de fabrication correspondant |
| CN112117980B (zh) * | 2020-09-23 | 2024-06-04 | 河北博威集成电路有限公司 | 石英晶体谐振器的电极制备方法、谐振器及振荡器 |
| CN116248068B (zh) * | 2022-09-28 | 2024-03-08 | 泰晶科技股份有限公司 | 一种超高频at切石英晶片及制造方法 |
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| JPS56122516A (en) * | 1980-03-04 | 1981-09-26 | Nec Corp | Quartz oscillator |
| JPH0349307A (ja) * | 1989-07-17 | 1991-03-04 | Daishinku Co | オーバートーン用矩形水晶振動子 |
| CN1238245A (zh) * | 1998-06-09 | 1999-12-15 | 松下电器产业株式会社 | 压电振子 |
| CN1795609A (zh) * | 2004-01-27 | 2006-06-28 | 株式会社村田制作所 | 压电谐振部件的频率调整方法及压电谐振部件 |
| JP2009065270A (ja) * | 2007-09-04 | 2009-03-26 | Epson Toyocom Corp | メサ型振動片およびメサ型振動デバイス |
| JP2013162266A (ja) * | 2012-02-03 | 2013-08-19 | Seiko Epson Corp | 水晶基板、振動素子、振動子、電子デバイス、発振器、及び電子機器 |
| CN103368518A (zh) * | 2012-03-27 | 2013-10-23 | 精工爱普生株式会社 | 振动元件、振子、电子器件、电子设备以及移动体 |
| CN104734635A (zh) * | 2013-12-24 | 2015-06-24 | 精工爱普生株式会社 | 发热体、振动器件、电子设备以及移动体 |
| WO2015194474A1 (ja) * | 2014-06-16 | 2015-12-23 | 日本電波工業株式会社 | 圧電振動片及び圧電デバイス |
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| JPS5012673U (enExample) * | 1973-05-31 | 1975-02-08 | ||
| JPS5012673A (enExample) | 1973-06-05 | 1975-02-08 | ||
| JPS6336748Y2 (enExample) | 1980-03-06 | 1988-09-29 | ||
| JPS5967354A (ja) * | 1982-10-07 | 1984-04-17 | Tanaka Kikinzoku Kogyo Kk | 刷子用摺動接点材料 |
| US4461563A (en) * | 1982-10-22 | 1984-07-24 | Xerox Corporation | Copy sheet contamination prevention |
| JPH04123605A (ja) | 1990-09-14 | 1992-04-23 | Nippon Dempa Kogyo Co Ltd | 水晶振動子 |
| JPH05243897A (ja) * | 1992-02-27 | 1993-09-21 | Nec Eng Ltd | 帯域可変型フィルタ |
| JP3194442B2 (ja) | 1992-05-30 | 2001-07-30 | 日本電波工業株式会社 | Scカットの水晶振動子 |
| CN1031739C (zh) * | 1992-10-15 | 1996-05-01 | 松下电器产业株式会社 | 振荡器 |
| US5686779A (en) * | 1995-03-01 | 1997-11-11 | The United States Of America As Represented By The Secretary Of The Army | High sensitivity temperature sensor and sensor array |
| JP4069773B2 (ja) | 2003-03-19 | 2008-04-02 | セイコーエプソン株式会社 | 圧電振動片、圧電振動子および圧電デバイス |
| JP4572807B2 (ja) * | 2005-10-31 | 2010-11-04 | エプソントヨコム株式会社 | メサ型圧電振動片 |
| US20090065731A1 (en) * | 2007-09-06 | 2009-03-12 | Tdk Corporation | Method for producing piezoelectric ceramic |
| JP5515921B2 (ja) * | 2010-03-24 | 2014-06-11 | セイコーエプソン株式会社 | 恒温型圧電発振器の製造方法 |
| JP5678486B2 (ja) * | 2010-06-17 | 2015-03-04 | セイコーエプソン株式会社 | 弾性表面波共振子、弾性表面波発振器および電子機器 |
| JP5708089B2 (ja) * | 2011-03-18 | 2015-04-30 | セイコーエプソン株式会社 | 圧電振動素子、圧電振動子、圧電発振器及び電子デバイス |
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| JP5991464B2 (ja) * | 2012-03-19 | 2016-09-14 | セイコーエプソン株式会社 | 振動片およびその製造方法、振動素子、振動子、電子デバイス、並びに電子機器 |
| JP5967354B2 (ja) * | 2012-03-19 | 2016-08-10 | セイコーエプソン株式会社 | 振動片およびその製造方法、振動素子、振動子、電子デバイス、並びに電子機器 |
| JP5943187B2 (ja) * | 2012-03-21 | 2016-06-29 | セイコーエプソン株式会社 | 振動素子、振動子、電子デバイス、および電子機器 |
| JP2015122607A (ja) | 2013-12-24 | 2015-07-02 | セイコーエプソン株式会社 | 発振器、電子機器および移動体 |
| JP6390836B2 (ja) * | 2014-07-31 | 2018-09-19 | セイコーエプソン株式会社 | 振動片、振動子、振動デバイス、発振器、電子機器、および移動体 |
| JP6592906B2 (ja) * | 2015-01-29 | 2019-10-23 | セイコーエプソン株式会社 | 振動片、振動子、振動デバイス、発振器、電子機器、および移動体 |
| JP2016174265A (ja) * | 2015-03-17 | 2016-09-29 | セイコーエプソン株式会社 | 振動子、発振器、電子機器、および移動体 |
| JP6641859B2 (ja) * | 2015-10-06 | 2020-02-05 | セイコーエプソン株式会社 | 振動デバイス、発振器、電子機器、および移動体 |
| JP6791766B2 (ja) * | 2017-01-17 | 2020-11-25 | 日本電波工業株式会社 | 圧電振動片及び圧電デバイス |
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-
2016
- 2016-02-05 JP JP2016020522A patent/JP2017139682A/ja not_active Withdrawn
- 2016-12-27 CN CN201611226911.1A patent/CN107046410B/zh not_active Expired - Fee Related
-
2017
- 2017-01-23 US US15/412,913 patent/US10530299B2/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122516A (en) * | 1980-03-04 | 1981-09-26 | Nec Corp | Quartz oscillator |
| JPH0349307A (ja) * | 1989-07-17 | 1991-03-04 | Daishinku Co | オーバートーン用矩形水晶振動子 |
| CN1238245A (zh) * | 1998-06-09 | 1999-12-15 | 松下电器产业株式会社 | 压电振子 |
| CN1795609A (zh) * | 2004-01-27 | 2006-06-28 | 株式会社村田制作所 | 压电谐振部件的频率调整方法及压电谐振部件 |
| JP2009065270A (ja) * | 2007-09-04 | 2009-03-26 | Epson Toyocom Corp | メサ型振動片およびメサ型振動デバイス |
| JP2013162266A (ja) * | 2012-02-03 | 2013-08-19 | Seiko Epson Corp | 水晶基板、振動素子、振動子、電子デバイス、発振器、及び電子機器 |
| CN103368518A (zh) * | 2012-03-27 | 2013-10-23 | 精工爱普生株式会社 | 振动元件、振子、电子器件、电子设备以及移动体 |
| CN104734635A (zh) * | 2013-12-24 | 2015-06-24 | 精工爱普生株式会社 | 发热体、振动器件、电子设备以及移动体 |
| WO2015194474A1 (ja) * | 2014-06-16 | 2015-12-23 | 日本電波工業株式会社 | 圧電振動片及び圧電デバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| US10530299B2 (en) | 2020-01-07 |
| US20170230003A1 (en) | 2017-08-10 |
| CN107046410A (zh) | 2017-08-15 |
| JP2017139682A (ja) | 2017-08-10 |
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