CN107039368A - 树脂密封型半导体装置 - Google Patents

树脂密封型半导体装置 Download PDF

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CN107039368A
CN107039368A CN201710057325.7A CN201710057325A CN107039368A CN 107039368 A CN107039368 A CN 107039368A CN 201710057325 A CN201710057325 A CN 201710057325A CN 107039368 A CN107039368 A CN 107039368A
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pin
heat transmission
semiconductor device
resin molded
external pin
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CN107039368B (zh
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田口康祐
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Seiko Instruments Inc
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Seiko Instruments Inc
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Abstract

本发明提供一种树脂密封型半导体装置，其散热特性优异，且提高了相对于基板的安装强度。使散热用外部引脚从密封树脂露出到外部以提高散热特性，其中，所述散热用外部引脚和连接于芯片安装盘的四角的内部引脚连接，散热用外部引脚末端在引线框的冲裁加工时被切断，在本发明的树脂密封型半导体装置的外装镀层加工时，使外装镀层附着于散热用外部引脚的包含末端在内的整个面上，从而在基板安装时容易形成焊脚，能够提高相对于基板的安装强度。

Description

树脂密封型半导体装置
技术领域
本发明涉及提高了散热特性和相对于基板的安装强度的树脂密封型半导体装置及其制造方法。
背景技术
关于以功率半导体为代表的要求散热特性的树脂密封型半导体装置，为了将半导体芯片所发出的热高效地放出到安装基板上，一般的结构是使芯片安装盘背面从密封树脂露出。例如被称作HSOP的树脂密封型半导体装置已经被登记在国际标准规格(JEDEC：MS-O12)中。在这样的类型的树脂密封型半导体装置中，从半导体芯片发出的热从散热板向安装基板热传导而排出到外部，其中，所述散热板从密封树脂露出。由此，能够得到作为目的的散热特性。而且，作为提高散热特性的方法，还提出了这样的技术：使芯片安装盘和内部引脚连结，使热从与内部引脚连接的外部引脚向安装基板放出(例如，参照专利文献1)。
图5是现有的树脂密封型半导体装置的图。图5的(a)是正面立体图，图5的(b)是背面立体图，图5的(c)是沿着图5的(b)所示的切断线A-A的剖视图。在图5所示的树脂密封型半导体装置中，半导体芯片7经由芯片黏着膏体6载置于芯片安装盘1上，从芯片安装盘1延伸的散热引脚19设置在芯片安装盘的两侧。另外，在芯片安装盘1的角部，由内部引脚3和外部引脚2构成的端子被设置成夹着散热引脚19，并且该端子经由导线5与半导体芯片7电连接。
半导体芯片7、内部引脚3、导线5被密封树脂8包覆，芯片安装盘1的散热面10、外部引脚2以及散热引脚19从密封树脂8露出。
专利文献1：日本特开平11-297916号公报
在专利文献1所记载的树脂密封型半导体装置中，半导体芯片7被载置在芯片安装盘1的中央，散热引脚19被配置在半导体芯片7的附近，因此能够获得良好的散热特性，但是，由于内部引脚3被设置在半导体装置的角部，因此距半导体芯片的距离较远，用于电连接的导线具有变长的趋势。在导线中使用了金线等昂贵的线材，其对封装件成本的影响较大。另外，还存在这样的课题：电阻上升从而导致能耗升高，热量容易蓄积在封装件内部。
发明内容
本发明是鉴于上述课题而完成的，目的在于提供一种能够维持良好的散热特性且廉价的半导体装置及其制造方法。
为了解决上述课题，在本发明中采用了以下的手段。
首先，使芯片安装盘从密封树脂露出来作为散热板。而且，形成了这样的树脂密封型半导体装置：将散热用外部引脚配置在芯片安装盘的四角，其中，所述散热用外部引脚和连接于芯片安装盘的内部引脚连接，散热用外部引脚的末端在引线框加工阶段被切断，在半导体装置的外装镀层工序后，外装镀层可靠地附着于散热用外部引脚末端的整个面上。
如上所述，根据本发明，和连接于芯片安装盘的四角的内部引脚连接的散热用外部引脚使得散热面积增大，从而能够提高树脂密封型半导体装置的散热特性。无需增大半导体装置就能够实现散热特性的提高。
另外，能够使外装镀层附着于散热用外部引脚末端的整个面上。由此，能够可靠地提高在将半导体装置安装于基板时重要的安装强度。
而且，通过将散热用外部引脚设置在芯片安装盘的四角，其中，所述将散热用外部引脚与连接于芯片安装盘的内部引脚连接，由此，未与芯片安装盘连接的用于与半导体芯片电连接的内部引脚被配置在芯片安装盘中央部。由于通常半导体芯片被搭载在芯片安装盘的中央，因此，能够缩短为了与内部引脚电连接而使用的导线的长度。
附图说明
图1是示出作为本发明的实施例的树脂密封型半导体装置的透视图。
图2是示出作为本发明的实施例的树脂密封型半导体装置的立体图。
图3是在作为本发明的实施例的树脂密封型半导体装置中使用的引线框的俯视图。
图4是示出作为本发明的实施例的树脂密封型半导体装置的制造方法的图。
图5是示出现有的树脂密封型半导体装置的图。
标号说明
1：芯片安装盘；
2：外部引脚；
3：内部引脚；
3a：散热用内部引脚；
4：芯片安装盘延伸部分；
5：导线；
6：芯片黏着膏体；
7：半导体芯片；
8：密封树脂；
9：散热用外部引脚；
10：散热面；
11：引线框；
12：系杆。
具体实施方式
下面，根据附图对用于实施本发明的方式进行说明。
图1是示出本发明的实施例的树脂密封型半导体装置的透视图。本图是内部结构的概要图，透过密封树脂图示了内部的半导体芯片和内部引脚等。
半导体芯片7通过芯片黏着膏体6固定在矩形的芯片安装盘1上，芯片安装盘1通过对置的延伸部分4被固定。在与设有延伸部分4的1对边不同的1对边的两侧，设置有多个内部引脚3和与内部引脚连接的外部引脚2。与芯片安装盘的排列有内部引脚的边平行地在半导体芯片上设有焊盘，焊盘和内部引脚3经由导线5电连接。并且，在芯片安装盘1的四角，经由与芯片安装盘连接的散热用内部引脚3a设置有散热用外部引脚9。
散热用外部引脚9从散热用内部引脚3a延伸，并且与散热用内部引脚3a连接。散热用外部引脚9形成为与外部引脚2相同地弯折，从而使树脂密封型半导体装置的背面、散热用外部引脚9的背面以及外部引脚2的背面处于同一高度。并且，如后面所说明的那样，芯片安装盘的背面在树脂密封型半导体装置的背面露出。设置于四角的散热用外部引脚9形成得比外部引脚2宽，并且起到了对来自半导体芯片的热进行传热而使其向半导体装置外放出的作用。
在图5所示的半导体装置中，仅在半导体芯片的两侧设有散热引脚，因此，在未设置散热引脚的部位容易积蓄热量，从而可能对半导体芯片的动作产生影响，但在本发明的半导体装置的情况下，由于在4个角都设置有由散热用内部引脚3a和散热用外部引脚9构成的散热引脚，因此该影响较小。一般来说，半导体芯片的发热根据所形成的半导体元件而不同，因此半导体芯片上的发热不均匀。通过使接近发热较多的部位的散热引脚比其它散热引脚宽，能够得到更加良好的散热特性。
图2是示出本发明的实施例的树脂密封型半导体装置的立体图。图2的(a)是正面立体图，(b)是背面立体图。对置的多个外部引脚2在密封树脂8的两侧露出，以夹着该外部引脚2的方式设置有一对散热用外部引脚9。在半导体装置的背面，设置有从密封树脂露出的、作为所述芯片安装盘1的一部分的散热面10，在外部引脚2的外周侧设有散热用外部引脚9。
形成了下述这样的散热特性高的树脂密封型半导体装置：其能够利用从芯片安装盘背面露出的散热面10、和经由内部引脚3a与芯片安装盘1连接的散热用外部引脚9，来对半导体芯片7所产生的热进行散热。
图3是在本发明的实施例的树脂密封型半导体装置中使用的引线框11的俯视图。图3仅示出了在1个树脂密封型半导体装置中使用的引线框的一部分，在实际的制造工序中，使用将图3所示的部分在纵向上和横向上二维地排列多个而成的引线框。
在图3所示的引线框11中，散热用内部引脚3a被配置在芯片安装盘1的四角，散热用外部引脚9从散热用内部引脚3a延伸而伸出，散热用外部引脚9和其它外部引脚2通过系杆12连结。在图3中，散热用内部引脚3a被配置在成为芯片安装盘的四角的端部的角部处，芯片安装盘1的短边和散热用外部引脚9的外侧的边成为一条直线。以使芯片安装盘1比散热用外部引脚9和其它外部引脚2低的方式对散热用外部引脚9和其它外部引脚2实施弯曲加工。而且，散热用外部引脚9的末端由于未与引线框连接而露出。这是为了如后述那样在外装镀层加工中使外装镀层附着至散热用外部引脚9的末端。
接下来，根据附图对本发明的实施例的制造方法进行说明。
图4是示出本发明的实施例的制造方法的概要结构图。
图4的(a)是示出本发明的实施例的树脂密封型半导体装置的制造方法的树脂密封前的状态的正面概要立体图。
在作为本发明的实施例的树脂密封型半导体装置所使用的引线框11中，将半导体芯片7通过芯片黏着膏体6固定于芯片安装盘1，并将半导体芯片7的电极和内部引脚3通过金属导线5电连接，其中，该芯片安装盘1以从密封树脂露出的方式被进行了弯曲加工。散热用外部引脚9经由散热用内部引脚3a与芯片安装盘1连接。散热用外部引脚9的末端露出，与任何地方都没有连接。
图4的(b)是示出在本发明的实施例的树脂密封型半导体装置的树脂密封后将不需要的密封树脂除去后的状态的正面概要立体图。
密封树脂以规定的尺寸从正面和背面对引线框11进行密封。引线框11、外部引脚2以及散热用外部引脚9被系杆12连结，密封树脂没有向外部引脚侧流入。
图4的(c)是示出在树脂密封后对本发明的实施例的树脂密封型半导体装置的系杆12进行了切断加工后的状态的正面概要立体图。保留外部引脚2和散热用外部引脚9的规定的宽度并将与引线框11连结的系杆12全部切断。即使在切断后，引线框11和芯片安装盘1也通过延伸部分4连接。并且，与芯片安装盘1连接的散热用外部引脚也在密封树脂内部经由散热用内部引脚3a与引线框11连接。接下来，进行基于电解加工实现的外装镀层的加工。由于散热用外部引脚与引线框11电连接，因此，使外装镀层附着于散热用外部引脚的包含末端9a在内的整个面上。
图4的(d)是示出将镀层后的本发明的实施例的树脂密封型半导体装置的外部引脚2的末端以规定的尺寸切断后的状态的正面概要立体图。
图4的(e)是示出将本发明的实施例的树脂密封型半导体装置的外部引脚2和散热用外部引脚9弯折加工至能够安装于基板的位置的状态的正面概要立体图。即使对外部引脚2和散热用外部引脚9进行弯折加工，本发明的树脂密封型半导体装置也被延伸部分4相对于引线框11保持。在该状态下使测试用触头接触外部引脚2和散热用外部引脚9，由此能够测试本发明的树脂密封型半导体装置是否能够无故障地工作。
图4的(f)是示出将与引线框11连接的延伸部分4在规定的位置切断从而使本发明的实施例的树脂密封型半导体装置单片化的成品状态的正面概要立体图。
图4的(g)是沿着图4的(f)的标号B观察的图。在从密封树脂8露出的散热用外部引脚的末端9a的整个面上附着有外装镀层。

Claims (4)

1.一种树脂密封型半导体装置，其特征在于，
所述树脂密封型半导体装置具备：
半导体芯片；
接合有所述半导体芯片的芯片安装盘；
与所述芯片安装盘的四角连接的散热用内部引脚；
与所述散热用内部引脚连接的散热用外部引脚；
分别通过金属导线与所述半导体芯片电连接的内部引脚；
分别与所述内部引脚连接的外部引脚；以及
密封树脂，其对所述芯片安装盘、所述半导体芯片、所述内部引脚以及所述散热用内部引脚进行密封，
所述芯片安装盘的背面、所述外部引脚以及所述散热用外部引脚从所述密封树脂露出，
所述芯片安装盘的所述背面、所述外部引脚的背面以及所述散热用外部引脚的背面处于同一高度。
2.根据权利要求1所述的树脂密封型半导体装置，其特征在于，
所述散热用内部引脚与所述芯片安装盘的角部连接。
3.根据权利要求1所述的树脂密封型半导体装置，其特征在于，
在所述散热用外部引脚的包含末端在内的整个面上附着有外装镀层。
4.根据权利要求1至3中的任意一项所述的树脂密封型半导体装置，其特征在于，
所述树脂密封型半导体装置的所述散热用外部引脚的宽度比所述外部引脚的宽度大。
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