CN107749408B - 一种弹性导热件露出封装结构 - Google Patents

一种弹性导热件露出封装结构 Download PDF

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CN107749408B
CN107749408B CN201710937383.9A CN201710937383A CN107749408B CN 107749408 B CN107749408 B CN 107749408B CN 201710937383 A CN201710937383 A CN 201710937383A CN 107749408 B CN107749408 B CN 107749408B
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heat
heat dissipation
chip
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CN107749408A (zh
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刘恺
梁志忠
王亚琴
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Changjiang Elec Tech Suqian Co ltd
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    • H—ELECTRICITY
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
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    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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Abstract

本发明涉及一种弹性导热件露出封装结构，它包括引线框架（1），所述引线框架（1）包括复数个引脚（1.1），所述引脚（1.1）上倒装有芯片（3），所述芯片（3）上设置有散热框架（4），所述散热框架（4）包括散热板（4.1）、弹性接脚（4.2）和导热件（4.3），所述引线框架（1）、芯片（2）和散热框架（4）包封于塑封料（5）内，所述散热板（4.1）上表面和导热件（4.3）上表面均暴露于塑封料（5）之外。本发明一种弹性导热件露出封装结构，它能使弹性接脚的下表面到散热框架上表面的高度与模具型腔的高度相同，从而保证弹性接脚下表面暴露在塑封料之外，从而使封装结构的散热框架能够较可靠的实现接地功能。

Description

一种弹性导热件露出封装结构
技术领域
本发明涉及一种弹性导热件露出封装结构，属于半导体封装技术领域。
背景技术
电子元件例如微处理器和集成电路必须在一定的规定温度范围内工作以有效地操作。过多的热量降低了电子元件性能、可靠性和平均寿命，甚至能引发故障。因此，散热片被广泛用于控制过多的热量。传统的具有散热片的芯片封装结构内，散热片和芯片表面之间会隔着塑封料，然而因为塑封料的散热性能不佳，所以工作时芯片所散出的热仍无法有效的通过塑封料散出，进而影响到电子产品的电热性能以及可靠性。
除了产生热量之外，电子元件还产生电磁辐射,电子元件发射的电磁辐射能在相邻的电子元件和系统中引起电磁干扰(EMI)或噪声。散热片作为天线会进一步辐射出由电子元件产生的电磁辐射，所以通常会将散热片接地用于用于EMI抑制。
参见图1，为现有的一种可以提高散热性能的封装结构，其芯片上设置有散热框架，所述散热框架四侧向下设置有卡爪，芯片和散热片贴合在一起，这样可以有更好的散热效果。另外通过散热框架四侧卡爪可以实现散热片的接地电性功能。
然而，此种封装结构在包封时也存在诸多缺陷：
1、由于卡爪高度会存在公差， 如果此高度太高的话，再合模时上模具会将散热框架向下压，而卡爪外侧边缘会受力向上翘起，导致卡爪下表面溢料，此外，会导致散热框架与芯片没有贴合在一起，从而影响散热效果。如果此高度太低的话，卡爪底部离下模具会存在一定距离，在包封时会导致卡爪下表面完全包覆在塑封料之内，卡爪下表面会有溢料或完全包覆在塑封料之内，都将导致封装结构的接地功能失效；
2、引脚下表面到芯片上表面高度也会存在公差，如果此该高度太高的话，引脚下表面到散热框架上表面的高度会超出模具型腔的高度，在合模时会导致散热框架把芯片压伤；如果此高度太低的话，会导致散热框架与芯片上表面之间还存在一定的空隙，包封后塑封料或气泡会存在于散热框架与芯片上表面之间，影响到芯片与散热框架之间的热传导,从而影响整个封装的散热能力。
发明内容
本发明所要解决的技术问题是针对上述现有技术提供一种弹性导热件露出封装结构，它能使弹性接脚的下表面到散热框架上表面的高度与模具型腔的高度相同，从而保证弹性接脚下表面暴露在塑封料之外，从而使封装结构的散热框架能够较可靠的实现接地功能；
另一方面，它能使引脚下表面到散热框架上表面的高度与模具型腔的高度相同，从而保证芯片和散热框架直接完全接触，使封装结构有更好的散热效果，又能避免包封模具压伤芯片。
本发明解决上述问题所采用的技术方案为：一种弹性导热件露出封装结构，它包括引线框架，所述引线框架包括复数个引脚，所述引脚上通过锡球倒装有芯片，所述芯片上设置有散热框架，所述散热框架包括散热板、弹性接脚和导热件，所述弹性接脚连接设置于散热板四周，所述导热件设置于芯片上表面，所述芯片与散热板之间通过导热件相连接，所述引线框架、芯片和散热框架包封于塑封料内，所述引脚下表面和弹性接脚下表面位于同一平面且暴露于塑封料之外，所述散热板上表面和导热件上表面均暴露于塑封料之外。
一种弹性导热件露出封装结构，它包括引线框架，所述引线框架包括引脚和基岛，所述引脚以单组或多组方式环绕排列于基岛周围，所述基岛上通过粘结物质或焊料设置有芯片，所述芯片通过金属焊线与引脚电性连接，所述芯片上设置有散热框架，所述散热框架包括散热板、弹性接脚和导热件，所述弹性接脚连接设置于散热板四周，所述导热件设置于芯片上，所述芯片与散热板之间通过导热件相连接，所述引线框架、芯片和散热框架包覆于塑封料内，所述引脚下表面和弹性接脚下表面位于同一平面且暴露于塑封料之外，所述散热板上表面暴露于塑封料之外。
所述导热件为弹性导热件。
所述导热件与散热板为一体结构或分体结构。
与现有技术相比，本发明的优点在于：
1、本发明能使弹性接脚的下表面到散热框架上表面的高度与模具型腔的高度相同，从而保证弹性接脚下表面暴露在塑封料之外，从而使封装结构的散热框架能够较可靠的实现接地功能；
2、本发明的弹性导热件下表面到散热板上表面的高度可随着引脚下表面到芯片上表面高度变化而变化，所以能使引脚下表面到散热框架上表面的高度与模具型腔的高度相同，从而保证芯片和散热框架直接完全接触，使封装结构有更好的散热效果和电性能；
3、本发明的散热框架通过弹性接脚与塑封料的咬合，实现散热框架与芯片直接结合，省掉了粘结剂，大大降低了封装的成本；
4、本发明的弹性导热件上表面也露出于塑封料表面，可以更进一步提高散热性能。
附图说明
图1为现有的可以提高散热性能的封装结构的示意图。
图2为本发明一种弹性导热件露出封装结构实施例1的示意图。
图3~图8为本发明一种弹性导热件露出封装结构实施例1中导热件的其他实施例示意图。
图9为本发明一种弹性导热件露出封装结构实施例2的示意图。
图10~图16为本发明一种弹性导热件露出封装结构实施例2中导热件的其他实施例示意图。
其中：
引线框架1
引脚1.1
基岛1.2
锡球2
芯片3
散热框架4
散热板4.1
弹性接脚4.2
导热件4.3
塑封料5
金属焊线6
粘结物质或焊料7。
具体实施方式
以下结合附图实施例对本发明作进一步详细描述。
实施例1：
如图2所示，本实施例中的一种弹性导热件露出封装结构，它包括引线框架1，所述引线框架1包括复数个引脚1.1，所述引脚1.1上通过锡球2倒装有芯片3，所述芯片3上设置有散热框架4，所述散热框架4包括散热板4.1、弹性接脚4.2和导热件4.3，所述弹性接脚4.2连接设置于散热板4.1四周，所述导热件4.3设置于芯片2上表面，所述芯片2与散热板4.1之间通过导热件4.3相连接，所述引线框架1、芯片2和散热框架4包覆于塑封料5内，所述引脚1.1下表面和弹性接脚4.2下表面位于同一平面且暴露于塑封料5之外，所述散热板4.1上表面和导热件4.3上表面均暴露于塑封料5之外；
所述导热件4.3为弹性导热件；
所述导热件4.3与散热板4.1为一体结构或分体结构；
如图3~图8所示，所述弹性导热件4.3形状结构不受限制，只要具有一定的弹性且能够起到导热作用均满足要求。
实施例2：
如图9所示，本实施例中的一种弹性导热件露出封装结构，它包括引线框架1，所述引线框架1包括引脚1.1和基岛1.2，所述引脚1.1以单组或多组方式环绕排列于基岛1.2周围，所述基岛1.2上通过粘结物质或焊料7设置有芯片3，所述芯片3通过金属焊线6与引脚1.1电性连接，所述芯片3上设置有散热框架4，所述散热框架4包括散热板4.1、弹性接脚4.2和导热件4.3，所述弹性接脚4.2连接设置于散热板4.1四周，所述导热件4.3设置于芯片2上，所述芯片2与散热板4.1之间通过导热件4.3相连接，所述引线框架1、芯片2和散热框架4包覆于塑封料5内，所述引脚1.1下表面和弹性接脚4.2下表面位于同一平面且暴露于塑封料5之外，所述散热板4.1上表面暴露于塑封料5之外；
所述导热件4.3为弹性导热件；
所述导热件4.3与散热板4.1为一体结构或分体结构；
如图10~图16所示，所述弹性导热件4.3形状结构不受限制，只要具有一定的弹性且能够起到导热作用均满足要求。
除上述实施例外，本发明还包括有其他实施方式，凡采用等同变换或者等效替换方式形成的技术方案，均应落入本发明权利要求的保护范围之内。

Claims (3)

1.一种弹性导热件露出封装结构，其特征在于：它包括引线框架（1），所述引线框架（1）包括复数个引脚（1.1），所述引脚（1.1）上通过锡球（2）倒装有芯片（3），所述芯片（3）上设置有散热框架（4），所述散热框架（4）包括散热板（4.1）、弹性接脚（4.2）和导热件（4.3），所述导热件（4.3）为弹性导热件，所述弹性接脚（4.2）连接设置于散热板（4.1）四周，所述导热件（4.3）设置于芯片（2）上表面，所述芯片（2）与散热板（4.1）之间通过导热件（4.3）相连接，所述引线框架（1）、芯片（2）和散热框架（4）包封于塑封料（5）内，所述引脚（1.1）下表面和弹性接脚（4.2）下表面位于同一平面且暴露于塑封料（5）之外，所述散热板（4.1）上表面和导热件（4.3）上表面均暴露于塑封料（5）之外。
2.一种弹性导热件露出封装结构，其特征在于：它包括引线框架（1），所述引线框架（1）包括引脚（1.1）和基岛（1.2），所述引脚（1.1）以单组或多组方式环绕排列于基岛（1.2）周围，所述基岛（1.2）上通过粘结物质或焊料（7）设置有芯片（3），所述芯片（3）通过金属焊线（6）与引脚（1.1）电性连接，所述芯片（3）上设置有散热框架（4），所述散热框架（4）包括散热板（4.1）、弹性接脚（4.2）和导热件（4.3），所述导热件（4.3）为弹性导热件，所述弹性接脚（4.2）连接设置于散热板（4.1）四周，所述导热件（4.3）设置于芯片（2）上，所述芯片（2）与散热板（4.1）之间通过导热件（4.3）相连接，所述引线框架（1）、芯片（2）和散热框架（4）包覆于塑封料（5）内，所述引脚（1.1）下表面和弹性接脚（4.2）下表面位于同一平面且暴露于塑封料（5）之外，所述散热板（4.1）上表面暴露于塑封料（5）之外。
3.根据权利要求1或2所述的一种弹性导热件露出封装结构，其特征在于：所述导热件（4.3）与散热板（4.1）为一体结构或分体结构。
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1622319A (zh) * 2003-11-27 2005-06-01 矽统科技股份有限公司 晶片散热元件
CN104465551A (zh) * 2014-12-26 2015-03-25 江苏长电科技股份有限公司 机械压合方式实现电性和散热的封装结构及工艺方法
CN106328612A (zh) * 2015-06-25 2017-01-11 浙江盾安人工环境股份有限公司 一种芯片散热装置及其电子组件

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TWI504852B (zh) * 2012-09-07 2015-10-21 Compal Electronics Inc 散熱模組
CN106206493B (zh) * 2016-08-30 2019-03-22 深圳天珑无线科技有限公司 一种封装芯片的散热结构

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1622319A (zh) * 2003-11-27 2005-06-01 矽统科技股份有限公司 晶片散热元件
CN104465551A (zh) * 2014-12-26 2015-03-25 江苏长电科技股份有限公司 机械压合方式实现电性和散热的封装结构及工艺方法
CN106328612A (zh) * 2015-06-25 2017-01-11 浙江盾安人工环境股份有限公司 一种芯片散热装置及其电子组件

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