CN106971984A - 指纹感测辨识封装结构 - Google Patents

指纹感测辨识封装结构 Download PDF

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Publication number
CN106971984A
CN106971984A CN201611192412.5A CN201611192412A CN106971984A CN 106971984 A CN106971984 A CN 106971984A CN 201611192412 A CN201611192412 A CN 201611192412A CN 106971984 A CN106971984 A CN 106971984A
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CN
China
Prior art keywords
light
groove
fingerprint sensing
encapsulating structure
substrate
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CN201611192412.5A
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English (en)
Inventor
谢明哲
林瑞建
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CHUANGZHINENG TECHNOLOGY Co Ltd
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CHUANGZHINENG TECHNOLOGY Co Ltd
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Publication of CN106971984A publication Critical patent/CN106971984A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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Abstract

本发明公开了一种指纹感测辨识封装结构，于基板表面一体成形有多个凹槽，以供感测芯片和发光元件分别容置于每一凹槽内，无须额外增设遮光结构，从而可利用凹槽间所形成的隔墙来阻挡发光元件的光源直接或间接的照射在感测芯片上，且本发明能将基板与导电线路通过烧结方式形成为一体成形的结构，并将感测芯片、发光元件与导电线路结合在一起，再通过封装胶层进行填充，即可完成封装；藉此，可有效降低封装尺寸及厚度，并能有效阻挡余光或杂光的干扰，使指纹影像更均匀及清晰。

Description

指纹感测辨识封装结构
技术领域
本发明涉及一种指纹辨识装置，特别是一种可有效达到封装尺寸精简化且获得足够清晰的指纹影像的指纹感测辨识封装结构。
背景技术
指纹感测辨识为生物特征识别技术的一种，其利用人体手指上独有的指纹信息进行辨识，以其安全性和方便性方面的优点受到广泛的应用。如图1所示为一种指纹感测辨识封装结构10，其中红外线发光二极管20提供光源，以反射指纹影像于感测芯片30，现有的封装方法是将红外线发光二极管20与感测芯片30一起封装，由于红外线发光二极管20的发光角度(view angle)约为120度，因而会有直接侧向光源或其他反射的光源照射在感测芯片30上，容易造成质量不均匀的指纹影像。为解决此类问题，遂于红外线发光二极管20与感测芯片30间增设有遮光结构(Blocking)40，以阻挡余光/杂光对感测芯片30取像的干扰，但是，此方法也难以完全解决上述问题，感测芯片30仍会受到余光/杂光的干扰，从而影响后续辨识判读的准确性。
又，传统具有凹槽(cavity)结构的塑料引线芯片载体封装(Plastic Leaded ChipCarrier，PLCC)基板，为一种结合铜材与高功能热固性塑料的支架，但因受限于电子线路线宽及模具厚度，所以在降低封装尺寸及厚度方面存在一定的限制，难以顺应现今产品轻薄短小的趋势。
有鉴于此，本发明提供了一种指纹感测辨识封装结构，除了能够有效避免余光/杂光的干扰而降低取像质量，同时可减少封装结构的体积，不但有别于现有结构，更能有效克服其存在的各种问题；其具体架构及实施方式将详述于下。
发明内容
本发明的主要目的在于提供一种指纹感测辨识封装结构，其是在基板本体设置多个凹槽，以分别容置感测芯片和发光元件，使感测芯片和发光元件间无须增设遮光结构，而是直接通过凹槽间所形成的隔墙，即可有效阻挡发光元件的光源直接或间接照射于感测芯片，从而提高影像撷取的可靠性并增加辨识能力。
本发明的另一目的在于提供一种指纹感测辨识封装结构，不仅无须增设遮光结构，且基板和导电线路可通过加压烧结而成为一体成型的结构，并将此结构与感测芯片及发光元件结合在一起，再以封装胶层进行填充，来完成封装，其制作过程简易，也同时将元件体积减小至最精简程度。
为了达到上述目的，本发明公开了一种指纹感测辨识封装结构，主要特征是基板具有第一表面及第二表面，其第一表面一体成形有一第一凹槽及至少一第二凹槽，分别用以容置一感测芯片及至少一发光元件。
进一步，第一凹槽与第二凹槽为相邻且于其相邻处形成有至少一隔墙，通过此隔墙可将感测芯片和发光元件予以隔离，从而可达到遮光效果。
具体而言，基板为绝缘基板；较佳的，绝缘基板可为陶瓷基板。
具体而言，指纹感测辨识封装结构还包括有导电线路，导电线路设置于第一凹槽及第二凹槽，以分别电性连接至感测芯片与发光元件。
具体而言，指纹感测辨识封装结构还包括封装胶层，封装胶层填充于第一凹槽与第二凹槽，以分别覆盖感测芯片与发光元件。
具体而言，发光元件为发光二极管；较佳的，发光二极管可为红外线发光二极管。
具体而言，封装胶层为环氧树脂或硅胶。
下面通过具体实施例配合所附的图式详加说明，当更容易了解本发明的目的、技术内容、特点及其所达成的功效。
附图说明
图1为现有的指纹感测辨识封装结构的剖面图；
图2为本发明的实施例所提供的指纹感测辨识封装结构的基板的立体图；
图3A和图3B分别为本发明的实施例所提供的指纹感测辨识封装结构的基板的第一表面和第二表面的平面图；
图4为本发明的实施例所提供的指纹感测辨识封装结构的剖面图；
图5为本发明的实施例所提供的指纹感测辨识封装结构的制造方法的流程图；
图6A-图6C为本发明的实施例所提供的指纹感测辨识封装结构的制造方法中对应各步骤的结构剖面图。
附图标记说明：10-指纹感测辨识封装结构；20-发光二极管；30-感测芯片；40-遮光结构；50-基板；51-第一凹槽；52-第二凹槽；53-导电线路；54-导电线路；55-导电线路；56-隔墙；60-感测芯片；70-发光元件；80-封装胶层；90-指纹感测辨识封装结构。
具体实施方式
如图2所示为本发明的实施例所提供的指纹感测辨识封装结构的基板50的立体图。此指纹感测辨识封装结构包括有一体成形的基板50，基板50的上表面在此定义为第一表面，下表面在此定义为第二表面，且其第一表面设置有第一凹槽51与第二凹槽52，第二凹槽52的数量可为一个或多个。此基板50用于指纹感测辨识封装中，可作为感测芯片和发光元件所配置的载板，并分别通过第一凹槽51容置感测芯片、通过第二凹槽52容置发光元件(此部分容后详述)。特别的是，由于第一凹槽51和第二凹槽52为一体成形于基板50的结构，第一凹槽51与第二凹槽52彼此相邻，且于相邻的第一凹槽51与第二凹槽52间会形成隔墙56，隔墙56的数量亦可为一个或多个；此隔墙56具有如同现有技术中的遮光结构的作用，但会在成型过程中自然形成，不需额外安装。
另外，如图3A和图3B所示，分别为本发明的实施例所提供的指纹感测辨识封装结构的基板50的第一表面和第二表面的平面图。本实施例中，导电线路53-55制作(例如利用加压烧结方式)于基板50内，如图3A所示，其一端在此定义为第一表面的导电线路53、54分别露出于基板50的第一凹槽51底部及第二凹槽52底部，来作为内部电性接点，以分别电性连接于感测芯片与发光元件，如图3B所示，另一端在此定义为第二表面的导电线路55则露出于基板50的第二表面，以连接到外部元件。
如图4所示为本发明的实施例所提供的指纹感测辨识封装结构90的剖面图。此指纹感测辨识封装结构90主要由基板50、感测芯片60、发光元件70及封装胶层80构成。如前所述，基板50的第一表面一体成形有第一凹槽51及第二凹槽52，且第一凹槽51及第二凹槽52间的相邻处形成有一隔墙56；基板50可为绝缘基板，较佳则使用陶瓷基板，例如为高温共烧陶瓷(High-Temperature Co-fired Ceramics，HTCC)或低温共烧陶瓷(Low-TemperatureCo-fired Ceramics，LTCC)的氧化铝陶瓷基板。详细而言，如图3A和图3B所示，基板50的内部包含有导电线路53-55，且导电线路53-55分别露出于基板50第一表面的第一凹槽51、第二凹槽52及基板50第二表面。感测芯片60安装于第一凹槽51内，用以撷取指纹影像。发光元件70安装于第二凹槽52内，用以作为光源；其中发光元件70可为发光二极管，较佳则为红外线发光二极管，且发光元件70的数量可为一个或多个，每个发光元件70对应设置于每个第二凹槽52。封装胶层80填充于第一凹槽51与第二凹槽52内，并将感测芯片60及发光元件70予以完整覆盖，以保护感测芯片60和发光元件70；封装胶层80的材料可为环氧树脂或硅胶。
上述实施例中，基板50本体若选用陶瓷基板，会有利于通过加压烧结方式将基板50和导电线路53-55一体成形，来进行后续的指纹感测辨识封装；进一步而言，此基板50和导电线路53-55为一体成形的结构，可用来与感测芯片60及发光元件70结合在一起，使得指纹感测辨识封装的制造过程可更为精简化，以下即对于此封装制程的详细内容进行说明。
接着，如图5所示为本发明的实施例所提供的指纹感测辨识封装结构的制造方法的流程图；同时，如图6A-图6C所示为本发明的实施例所提供的指纹感测辨识封装结构的制造方法中对应各步骤的结构剖面图。该制造造流程包括如下步骤：
首先，见步骤S10，如图6A所示，提供一基板50；本实施例采用陶瓷基板50，可通过加压烧结方式，将基板50及导电线路53-55经加压成形而烧结成为一体，且于基板50的第一表面形成有第一凹槽51和第二凹槽52，第一凹槽51和第二凹槽52间的相邻处形成有隔墙56，并且，让导电线路53、54分别露出于基板50的第一凹槽51底部及第二凹槽52底部，让导电线路55露出于基板50的第二表面；如图3A和图3B所示。
然后，见步骤S20，如图6B所示，将感测芯片60安装于基板50第一表面的第一凹槽51内，使感测芯片60与第一凹槽51底部的导电线路53达成电性连接，同时，将发光元件70安装于基板50第一表面的第二凹槽52内，使发光元件70与第二凹槽52底部的导电线路54电性连接。
最后，见步骤S30，如图6C所示，再以环氧树脂或硅胶材料的光学胶(optical gel)填充于第一凹槽51与第二凹槽52内，并将基板50的第一表面、感测芯片60及发光元件70予以覆盖，从而完成封装，并制得本实施例的指纹感测辨识封装结构90。
上述实施例中，感测芯片60与第一凹槽51、第二凹槽52、发光元件60的形状、数量、相对位置等关仅为一示例，并不以此为限，任何与本案精神均等者皆不脱离本发明的范畴。
本发明提供的指纹感测辨识封装结构于基板本体设有相邻接的多个凹槽，除了可作为感测芯片和发光元件的容置空间，同时可通过凹槽间所具有的隔墙达到感测芯片和发光元件间的遮光效果，有效阻挡余光/杂光的干扰，可提升感测芯片的影像撷取效果，提高指纹辨识的真实度和准确性。另外，本发明也无须额外设置遮光结构，且相较于传统具有凹槽结构的PLCC基板，本发明约能减少70％以上的封装尺寸和厚度。进一步地，本发明可采用一体成形的陶瓷基板，将基板与导电线路一同压合并烧结为一体，后续再与感测芯片和发光元件结合，并进行封胶，藉此，可同时薄化封装结构并简化封装制程。
以上所述的实施例仅是为说明本发明的技术思想及特点，其目的在使熟习此项技艺的人士能够了解本发明的内容并据以实施，当不能以的限定本发明的专利范围，即大凡依本发明所揭示的精神所作的均等变化或修饰，仍应涵盖在本发明的保护范围内。

Claims (9)

1.一种指纹感测辨识封装结构，其特征在于，包括：
一基板，该基板具有一第一表面及一第二表面，该第一表面一体成形有一第一凹槽及至少一第二凹槽，分别用以容置一感测芯片及至少一发光元件。
2.根据权利要求1所述的指纹感测辨识封装结构，其特征在于，该基板为绝缘基板。
3.根据权利要求2所述的指纹感测辨识封装结构，其特征在于，该绝缘基板为陶瓷基板。
4.根据权利要求1所述的指纹感测辨识封装结构，其特征在于，该第一凹槽及该第二凹槽为相邻且于该相邻处形成至少一隔墙，以隔离该感测芯片和该发光元件。
5.根据权利要求1所述的指纹感测辨识封装结构，其特征在于，还包括一导电线路，该导电线路设置于该第一凹槽及该第二凹槽，以分别电性连接至该感测芯片与该发光元件。
6.根据权利要求1所述的指纹感测辨识封装结构，其特征在于，还包括一封装胶层，该封装胶层填充于该第一凹槽与该第二凹槽，以分别覆盖该感测芯片与该发光元件。
7.根据权利要求1所述的指纹感测辨识封装结构，其特征在于，该发光元件为发光二极管。
8.根据权利要求7所述的指纹感测辨识封装结构，其特征在于，该发光二极管为红外线发光二极管。
9.根据权利要求1所述的指纹感测辨识封装结构，其特征在于，该封装胶层为环氧树脂或硅胶。
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