TW201824510A - 遠距離感測器的封裝結構及其封裝方法 - Google Patents

遠距離感測器的封裝結構及其封裝方法 Download PDF

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TW201824510A
TW201824510A TW105144095A TW105144095A TW201824510A TW 201824510 A TW201824510 A TW 201824510A TW 105144095 A TW105144095 A TW 105144095A TW 105144095 A TW105144095 A TW 105144095A TW 201824510 A TW201824510 A TW 201824510A
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林靜邑
杜明德
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菱生精密工業股份有限公司
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Abstract

一種遠距離感測器的封裝結構，包含一基板、一發光晶片、一感測晶片、二封裝膠體、一封蓋以及二遮蔽手段，基板具有一承載面，發光晶片設置於承載面，感測晶片設置於承載面且與發光晶片相互分離，二封裝膠體分別包覆發光晶片及感測晶片，各封裝膠體之頂面形成一透鏡部以及一肩部，封蓋形成於承載面以及各封裝膠體之上，封蓋設有一光發射孔以及一光接收孔分別用以容置各封裝膠體頂面之透鏡部及肩部，二遮蔽手段分別設置於各肩部並用以阻擋光線自各肩部通過。

Description

遠距離感測器的封裝結構及其封裝方法
本發明係與封裝結構有關，特別是指一種遠距離感測器的封裝結構及其封裝方法。
習知的遠距離感測器封裝結構係在一基板上設置一發光晶片及一感測晶片，接著經由模壓製程(Molding)將二封裝膠體分別包覆該發光晶片及該感測晶片，同時在各該封裝膠體頂面形成一半球狀透鏡部以對應該發光晶片及該感測晶片，最後同樣經由模壓製程將一封蓋設置於該基板及各該封裝膠體上方以完成整個封裝流程，值得一提的是，該封蓋通常會開設一光發射孔以及一光接收孔分別用以容納各該透鏡部。
惟，此種利用模壓製程形成該封蓋的方式，因為模壓模具無法接近各該透鏡部，因此該光發射孔以及該光接收孔之內壁面通常會與各該透鏡部間隔一距離，使得遠距離感測器的感測距離較短，並且較會有外部之光線雜訊進入導致晶片感測精準度降低，因此，習用的遠距離感測器封裝結構以及其封裝方法仍有其缺點，而有待改進。
綜合上述說明，本發明之主要目的係在於提供一種遠距離感測器之封裝結構，其具有感測距離較遠並且感測精準度較高之優點。
該遠距離感測器的封裝結構包含一基板、一發光晶片、一感測晶片、二封裝膠體、一封蓋以及二遮蔽手段，其中，該基板具有一承載面，該發光晶片設置於該承載面，該感測晶片設置於該承載面且與該發光晶片相互分離，該二封裝膠體分別包覆該發光晶片及該感測晶片，各該封裝膠體之頂面形成一透鏡部以及一肩部，該封蓋形成於該承載面以及各該封裝膠體之上，該封蓋設有一光發射孔以及一光接收孔分別用以容置各該封裝膠體頂面之透鏡部及肩部，該二遮蔽手段分別設置於各該肩部並用以阻擋光線自各該肩部通過。
本發明另一目的係在於提供一種遠距離感測器的封裝方法，包含下列步驟： (a)提供一基板，並將一發光晶片以及一感測晶片相互分離地設置於該基板之承載面； (b)將二封裝膠體相互分離地分別包覆該發光晶片以及該感測晶片，同時在各該封裝膠體之頂面形成一透鏡部以及一肩部； (c)形成一具有一光發射孔及一光接收孔之封蓋於各該封裝膠體及該基板之承載面之上，使該光發射孔及該光接收孔分別容置各該封裝膠體頂面之透鏡部及肩部；以及 (d)將二遮蔽手段分別形成於各該肩部並用以阻擋光線自各該肩部通過。
藉此，各該遮蔽手段可阻擋光線從各該封裝膠體頂面之肩部通過，並降低外部的光線雜訊干擾，進而提升該遠距離感測器的感測距離以及感測精準度。
有關本發明所提供之詳細構造、特點，將於後續的實施方式詳細說明中予以描述。然而，在本領域中具有通常知識者應能瞭解，該等詳細說明以及實施本發明所列舉的特定實施例，僅係用於說明本發明，並非用以限制本發明之專利申請範圍。
請參閱圖式第1~2圖，本發明第一較佳實施例所提供之遠距離感測器的封裝結構10包含一基板20、一發光晶片30、一感測晶片40、二封裝膠體50、一封蓋60以及二遮蔽手段70。
基板20具有一承載面22，基板20係可為印刷電路板(通稱PCB)、雙馬來醯亞胺三嗪基板(通稱BT)、玻璃纖維基板(通稱FR4)或是直接覆銅基板(通稱DBC)但並不以此為限，藉此，基板20之生產成本較低。
發光晶片30設置於承載面22並藉由打線製程(Wire Bonding)電性連接於基板20，於本較佳實施例中發光晶片30係為LED晶片並可用以發射光源。
感測晶片40設置於承載面22並與發光晶片30相互分離，其中，感測晶片40係藉由打線製程電性連接於基板20，感測晶片40係用以感測發光晶片30所發出的光源。
二封裝膠體50分別包覆發光晶片30及感測晶片40，各封裝膠體50之頂面形成一透鏡部52以及一肩部54，於本較佳實施例中，各封裝膠體50頂面之肩部54係圍繞透鏡部52，各透鏡部52係呈半球狀。
封蓋60形成於承載面22以及各封裝膠體50之上，封蓋60設有一光發射孔62以及一光接收孔64，光發射孔62及光接收孔64分別用以容置各封裝膠體50頂面之透鏡部52及肩部54，於本較佳實施例中，各封裝膠體50頂面之透鏡部52係凸伸出光發射孔62及光接收孔64。
二遮蔽手段70分別設置於各封裝膠體50頂面之肩部54並用以阻擋光線自各肩部54通過，並且各遮蔽手段70之高度係低於各透鏡部52之高度，於本較佳實施例中，各遮蔽手段70係為在各封裝膠體50頂面之肩部54以點膠製程(Dispensing)塗佈不透光之黏性膠體72，如不透光的環氧樹脂(Epoxy Resin)，使不透光黏性膠體72可黏接肩部54、光發射孔62(光接收孔64)之內壁面(622、642)以及透鏡部52之側面522，於實際實施上，不透光之黏性膠體72可涵蓋任何不透光之材料，於本較佳實施例中，各遮蔽手段70(不透光黏性膠體72)之頂面係齊平封蓋60之頂面。
請參閱第3圖，於第二較佳實施例中，各遮蔽手段70’係將一透鏡環74藉由不透光之黏性膠體72固接於各封裝膠體50頂面之肩部54。其中，透鏡環74係可由透光或不透光之材質製成，例如透光之環氧樹脂(Epoxy Resin)或是不透光之環氧樹脂(Epoxy Resin)但並不以此為限，其中，各遮蔽手段70’(透鏡環74)之頂面係齊平封蓋60之頂面。
請參閱第4A~4E圖，係為本發明第一較佳實施例所提供遠距離感測器的封裝結構10之封裝方法，包含下列步驟：
步驟(a)：提供一基板20，並將一發光晶片30以及一感測晶片40相互分離地設置於基板20之承載面22。
步驟(b)：將二封裝膠體50相互分離地分別包覆發光晶片30及感測晶片40，同時在各封裝膠體50之頂面形成一透鏡部52以及一肩部54，各封裝膠體50頂面之肩部54係圍繞透鏡部52，值得一提的是，於本較佳實施例中係利用模壓(Molding)的方式將單一封裝膠體50’包覆發光晶片30及感測晶片40，再利用切割(cutting)的方式將上述單一封裝膠體50’切割成二相互分離之封裝膠體50，並且二封裝膠體50分別包覆發光晶片30及感測晶片40。
步驟(c)：形成一具有一光發射孔62以及一光接收孔64之封蓋60於各封裝膠體50以及基板20之承載面22之上，使光發射孔62及光接收孔64分別容置各封裝膠體50頂面之透鏡部52及肩部54，值得一提的是，於本較佳實施例中係利用模壓(Molding)的方式形成封蓋60。
步驟(d)：將二遮蔽手段70分別形成於各肩部54並用以阻擋光線自各肩部54通過，更進一步來說，於本較佳實施例中，各遮蔽手段70係為在各肩部54以點膠製程(Dispensing)塗佈不透光之黏性膠體72，使不透光黏性膠體72可黏接肩部54、光發射孔62(光接收孔64)之內壁面(622、642)以及透鏡部52之側面522，於本較佳實施例中，各遮蔽手段70(不透光黏性膠體72)之頂面齊平封蓋60之頂面。
請參閱第5A~5F圖，係為本發明第二較佳實施例所提供遠距離感測器的封裝結構10’之封裝方法，其中，本較佳實施的步驟(a)~步驟(c)皆與第一較佳實施例相同，於此不再贅述，其差異之處係在於第二較佳實施例之步驟(d)中所述之二遮蔽手段70’，更進一步來說，第二較佳實施例所提供封裝方法的步驟(d)中，各遮蔽手段70’係將不透光之黏性膠體72以點膠製程(Dispensing)塗佈於各封裝膠體50頂面之肩部54，再將一透鏡環74設置於各封裝膠體50頂面之肩部54，經由烘烤製程(Baking)過後使各透鏡環74藉由不透光黏性膠體72固接於各封裝膠體50頂面之肩部54。
藉此，各遮蔽手段(70、70’)可阻擋光線從各封裝膠體50頂面之肩部54通過，並同時降低外部的光線雜訊干擾，進而提升該遠距離感測器的感測距離以及感測精準度。
最後必須再次說明，本發明於前揭實施例中所揭露的構成元件，僅為舉例說明，並非用來限制本案之範圍，其他等效元件的替代或變化，亦應為本案之申請專利範圍所涵蓋。
10、10’‧‧‧遠距離感測器的封裝結構
20‧‧‧基板
30‧‧‧發光晶片
40‧‧‧感測晶片
50、50’‧‧‧封裝膠體
60‧‧‧封蓋
70、70’‧‧‧遮蔽手段
22‧‧‧承載面
52‧‧‧透鏡部
54‧‧‧肩部
62‧‧‧光發射孔
64‧‧‧光接收孔
72‧‧‧黏性膠體
622、642‧‧‧內壁面
74‧‧‧透鏡環
522‧‧‧側面
第1圖為本發明第一較佳實施例之俯視圖。 第2圖為第1圖之2-2剖線圖，係顯示封裝結構內部元件之位置關係。 第3圖為本發明第二較佳實施例之剖面圖。 第4A~4E圖為本發明第一較佳實施例之封裝流程圖。 第5A~5F圖為本發明第二較佳實施例之封裝流程圖。

Claims (10)

  1. 一種遠距離感測器的封裝結構，包含： 一基板，具有一承載面； 一發光晶片，設置於該承載面； 一感測晶片，設置於該承載面且與該發光晶片相互分離； 二封裝膠體，分別包覆該發光晶片及該感測晶片，各該封裝膠體之頂面形成一透鏡部以及一肩部； 一封蓋，形成於該承載面以及各該封裝膠體之上，該封蓋設有一光發射孔以及一光接收孔分別用以容置各該封裝膠體頂面之透鏡部及肩部；以及 二遮蔽手段，分別設置於各該肩部並用以阻擋光線自各該肩部通過。
  2. 如申請專利範圍第1項所述遠距離感測器的封裝結構，各該封裝膠體頂面之肩部係圍繞該透鏡部。
  3. 如申請專利範圍第2項所述遠距離感測器的封裝結構，各該遮蔽手段係為不透光黏性膠體。
  4. 如申請專利範圍第2項所述遠距離感測器的封裝結構，各該遮蔽手段係將一透鏡環藉由不透光黏性膠體固接於各該封裝膠體頂面之肩部。
  5. 如申請專利範圍第1項所述遠距離感測器的封裝結構，各該透鏡部係呈半球狀。
  6. 如申請專利範圍第1項所述遠距離感測器的封裝結構，各該遮蔽手段之高度係低於各該透鏡部之高度。
  7. 一種遠距離感測器的封裝方法，包含下列步驟： (a)提供一基板，並將一發光晶片以及一感測晶片相互分離地設置於該基板之承載面； (b)將二封裝膠體相互分離地分別包覆該發光晶片以及該感測晶片，同時在各該封裝膠體之頂面形成一透鏡部以及一肩部； (c)形成一具有一光發射孔及一光接收孔之封蓋於各該封裝膠體及該基板之承載面之上，使該光發射孔及該光接收孔分別容置各該封裝膠體頂面之透鏡部及肩部；以及 (d)將二遮蔽手段分別形成於各該肩部並用以阻擋光線自各該肩部通過。
  8. 如申請專利範圍第7項所述遠距離感測器之封裝方法，於步驟(b)中，係利用切割的方式將各該封裝膠體相互分離。
  9. 如申請專利範圍第7項所述遠距離感測器之封裝方法，於步驟(b)中，各該封裝膠體頂面之肩部係圍繞透鏡部。
  10. 如申請專利範圍第9項所述遠距離感測器之封裝方法，於步驟(d)中，各該遮蔽手段係將一透鏡環藉由不透光黏性膠體固接於各該封裝膠體頂面之肩部。
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