TWM612841U - 指紋辨識智慧卡 - Google Patents

指紋辨識智慧卡 Download PDF

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TWM612841U
TWM612841U TW110201862U TW110201862U TWM612841U TW M612841 U TWM612841 U TW M612841U TW 110201862 U TW110201862 U TW 110201862U TW 110201862 U TW110201862 U TW 110201862U TW M612841 U TWM612841 U TW M612841U
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fingerprint
signal
smart card
layer
card reader
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TW110201862U
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蘇祐松
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安帝司股份有限公司
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Priority to TW110201862U priority Critical patent/TWM612841U/zh
Publication of TWM612841U publication Critical patent/TWM612841U/zh
Priority to CN202122821421.9U priority patent/CN216352374U/zh
Priority to US17/672,804 priority patent/US20220269918A1/en
Priority to EP22157190.4A priority patent/EP4047567A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor
    • G06V40/1329Protecting the fingerprint sensor against damage caused by the finger
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0718Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
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    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07728Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743External electrical contacts
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor
    • G06V40/1306Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • H01L23/3171Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components

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  • Computer Networks & Wireless Communication (AREA)
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  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

一種指紋辨識智慧卡,適用於感測一使用者的一指紋及訊號連接於一讀卡機模組,並包含一承載層體,及設置於該承載層體的一電訊號傳輸單元、一指紋感測器、一訊號處理器及一填充層。該承載層體,具有一第一表面及一自該第一表面凹陷的凹槽。該電訊號傳輸單元適用於訊號連接於該讀卡機模組並轉換輸出一電能。該指紋感測器用於在接收到來自該電能並感測到該指紋時產生一指紋感測訊號,並位於該凹槽中且底於該第一表面。該訊號處理器用於對該指紋感測訊號進行處理。該填充層覆蓋該指紋感測器。利用該填充層的設計,提升該指紋感訊號的精確度。

Description

指紋辨識智慧卡
本新型是有關於一種智慧卡,特別是指一種指紋辨識智慧卡。
隨著生物辨識技術的進步,已能將指紋辨識功能整合於諸如信用卡、金融卡等智慧型卡片,供使用者在智慧型卡片上按壓指紋就能進行身份確認,既而進行例如金融等交易。
目前智慧型卡片9,適用於與一晶片讀卡機搭配使用,並包括一具有一凹槽911的承載片體91、一設置於該承載片體91並用於與該讀卡機訊號連接的電訊號傳輸單元92、一設置於該承載片體中並訊號連接該電訊號傳輸單元92的處理晶片93、一設置於該承載片體91的凹槽911且訊號連接於該處理晶片93與該電訊號傳輸單元92的指紋感測器94,及一貼合於該承載片體91並供該指紋感測器94與該電訊號傳輸單元92外露的保護層95。
該電訊號傳輸單元92適用於將來自該晶片讀卡機的電訊號轉換為電能;而後,該指紋感測器94在接收到該電能時,能感測一使用者的一指紋901,並產生一傳送到該處理晶片93的指紋感測訊號,使該處理晶片93能對該指紋感測訊號進行指紋辨處理。
目前該智慧型卡片9的指紋感測器94高度會與該保護層95齊平,或略高(或略低)於該保護層95的高度,且由於該指紋感測器94未受該保護層95遮覆而直接裸露於外界,造成外界灰塵容易附著在該指紋感測器94上,導致後續使用該智慧型卡片時,該指紋感測訊號容易受到灰塵干擾,使得指紋辨識精確度降低。
因此,本新型之目的,即在提供一種能夠克服先前技術的至少一個缺點的指紋辨識智慧卡。
於是,本新型指紋辨識智慧卡,適用於感測一使用者的一指紋,並適用於訊號連接於一讀卡機模組。該指紋辨識智慧卡包含一承載層體、一電訊號傳輸單元、一指紋感測器、一訊號處理器,及一填充層。
該承載層體具有彼此相反的一第一表面及一第二表面,及一自該第一表面往該第二表面的方向凹陷而界定出一凹槽的凹槽面。
該電訊號傳輸單元適用於訊號連接於該讀卡機模組,及接收該讀卡機模組的電訊號後轉換為一電能,並設置於該承載層體。
該指紋感測器訊號連接於該電訊號傳輸單元,並用於在接收到來自該電訊號傳輸單元的電能並感測到該指紋時,產生一指紋感測訊號。該指紋感測器設置於該承載層體的該凹槽,並具有一與該第一表面同向且低於該第一表面的指紋感測面。
該訊號處理器訊號連接於該電訊號傳輸單元與該指紋感測器,並用於在接收到來自該電訊號傳輸單元的電能與該指紋感測器的指紋感測訊號時,對該指紋感測訊號進行處理,該訊號處理器設置於該承載層體。
該填充層填充於該凹槽且覆蓋該指紋感測晶片的該指紋感測面
本新型之功效在於:利用該填充層的設計,在感測該指紋時,能產生精確對應該指紋的指紋感測訊號。
在本新型被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。
參閱圖2至圖4,本新型指紋辨識智慧卡之一第一實施例,適用於感測一使用者的一指紋81,並適用於訊號連接於一讀卡機模組82。該讀卡機模組82適用於訊號連接於一電腦的資料庫或雲端的資料庫,並包括一無線讀卡機821,及一有線讀卡機822,且具體為整合於一圖未示出的機殼中。
該指紋辨識智慧卡包括一呈片狀的承載層體1、一設置於該承載層體1的電訊號傳輸單元2、一設置於該承載層體1的指紋感測器3、一設置於該承載層體1的訊號處理器4,及一覆蓋於該指紋感測器3表面的填充層5。而由於該指紋辨識智慧卡的整體厚度相對較薄,故在圖3剖視示意圖中,為了清楚表示出每一元件,適度加厚各構件的厚度,所以圖3僅為示意圖,並非正確對應圖2的尺寸比例。
該承載層體1為以塑膠製成的一長方形片體,並包括彼此相反的一第一表面11及一第二表面12,及一自該第一表面11往該第二表面12凹陷而界定出一呈方形的凹槽131的凹槽面13。於其他實施例中,該承載層體1也依外觀設計需求而具特定形狀,並以其他絕緣材料製成,例如:矽膠。
該電訊號傳輸單元2包括一適用於以直接接觸的方式訊號連接於該有線讀卡機822的電訊號轉換電路21、一適用於以無線的方式訊號連接於該無線讀卡機821並埋入於該承載層體1中的感應線圈22,及一埋入於該承載層體1中並訊號連接於該感應線圈22的整流電路23。
更具體地,該電訊號轉換電路21設置於該承載層體1,並自該第一表面11裸露出來,且在插入該有線讀卡機822時,能將接收自該有線讀卡機822的電訊號轉換為一電能。另一方面,該感應線圈22能和整流電路23配合,而先利用該感應線圈22,將接收自該無線讀卡機821的電訊號轉換為一交流電源,再利用該整流電路23,將該交流電源轉換為直流電形式的一電能。
該指紋感測器3訊號連接於該電訊號傳輸單元2的該電訊號轉換電路21與該整流電路23,使該整流電路23訊號連接於該指紋感測器3與該感應線圈22之間。該指紋感測器3具體為一未經封裝而為裸晶的指紋感測晶片,並放置於該承載層體1的該凹槽面13而設置於該凹槽131底部,且具有一與該第一表面11同向且低於該第一表面11的指紋感測面31。該指紋感測器3用於在接收到來自該電訊號轉換電路21的電能或來自該感應線圈22的電能,並利用該指紋感測面31感測到該指紋81時,產生一帶有一感測指紋資料的指紋感測訊號。需說明的是,該指紋感測晶片的一基材例如但不限於為矽(Si)基材、玻璃基材、聚醯亞胺(Polyimide,PI)膜、ABF(Ajinomoto build-up film)膜,或BT樹酯(Bismaleimide Triazine Resin)膜。
該訊號處理器4訊號連接於該電訊號傳輸單元2的該電訊號轉換電路21與該整流電路23,及該指紋感測器3,並用於在接收到來自該電訊號傳輸單元2的電能與該指紋感測器3的指紋感測訊號時,對該指紋感測訊號進行處理。該訊號處理器4為一處理晶片,並埋入於該承載層體1中,且位於該電訊號傳輸單元2的該電訊號轉換電路21下方,而相對於電訊號轉換電路21,更鄰近該第承載層體1的第二表面12。
該填充層5呈片狀,具有一範圍為1~8的介電係數,且製成材質為一固態膠體。具體地說,該固態膠體可為一直接貼覆於該指紋感測器3的膠片,或先在該指紋感測器3上填充一液態膠體後再固化成型。該填充層5覆蓋該指紋感測器3的該指紋感測面31地填充於該凹槽131。該填充層5具有一與該承載層體1的該第一表面11共同形成一平坦面的表層面51,及一與該表層面51相反的底層面52。該填充層5具有一自該底層面52至該表層面51的厚度D,且該厚度D範圍為25 μm~80 μm。
在該使用者手持該指紋辨識智慧卡插入該有線讀卡機822或位於該無線讀卡機821的一感應範圍,且該指紋81同時接觸在該填充層5的表層面51時,由於該填充層5具有預定範圍的介電係數與厚度D,而能供該指紋感測器3感測到該指紋81,而產生該指紋感測訊號;之後,該指紋感測訊號傳送到該訊號處理器4,用以對該指紋感測訊號進行處理。
當該訊號處理器4預先儲存至少一個對應該指紋辨識智慧卡的一持有人之指紋的指紋比對資料時,該訊號處理器4能比對該指紋感測訊號的感測指紋資料與該指紋比對資料。在該訊號處理器4判斷該感測指紋資料與該指紋比對資料相符,經由該電訊號傳輸單元2,對該讀卡機模組82回傳一個表示該使用者對應該持有人的確認訊號;在判斷該感測指紋81資料與該指紋81比對資料不符時,則回傳一個表示該使用者無法對應該持有人的否定訊號。當然,上述只是該指紋辨識智慧卡的其中一種辨識方式,在其他實施例中,該指紋81比對資料也能儲存在適用於與該讀卡機模組82訊號連接的資料庫中。
由於該指紋感測器3的表面覆蓋該填充層5,確實能保護該指紋感測器3不被外界灰塵沾染。再者,該指紋感測器3能平均地感應到指紋81各細部位上的電荷,還能有效提升該指紋感測訊號對應該指紋81的精確度。
需說明的是,該電訊號傳輸單元2也可省略該感應線圈22及該整流電路23,或省略該電訊號轉換電路21,而分別適用於僅具有該有線讀卡機822或僅具有該無線讀卡機821的讀卡機模組82。
參閱圖5,為本新型指紋辨識智慧卡的一第二實施例。該第二實施例與該第一實施例相似,其不同處在於:該第二實施例還包括一貼合於該承載層體1的第一表面11的保護層6,及該填充層5的製成材質。該保護層6為一透明膠膜,並覆蓋於該填充層5的該表層面51,且供該電訊號傳輸單元2的該電訊號轉換電路21裸露出來。該填充層5利用該保護層6被密封於內。由於該填充層5與該指紋感測器3之間沒有空氣間隙,且該保護層6也是無間隙地覆蓋於該填充層5,使該使用者的手指在接觸按壓於該保護層6上時,該指紋感測器3仍能平均地感應到指紋81上的電荷,同樣能產生高精確度的指紋感測訊號。另一方面,該保護層6不需另外設置一供該指紋感測器3外露的開口,設計與製作相對簡易,有效簡化製程繁瑣程度。
綜上所述,利用該填充層5的設計,並控制該填充層5具有預定範圍的介電係數與厚度D,使得本新型指紋辨識智慧卡在感測指紋81時,能產生高精確度的指紋感測訊號,故確實能達成本新型之目的。
惟以上所述者,僅為本新型之實施例而已,當不能以此限定本新型實施之範圍,凡是依本新型申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本新型專利涵蓋之範圍內。
1:承載層體 11:第一表面 12:第二表面 13:凹槽面 131:凹槽 2:電訊號傳輸單元 21:電訊號轉換電路 22:感應線圈 23:整流電路 3:指紋感測器 31:指紋感測面 4:訊號處理器 5:填充層 51:表層面 52:底層面 6:保護層 81:指紋 82:讀卡機模組 821:無線讀卡機 822:有線讀卡機 D:厚度
本新型之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中: 圖1是一剖視示意圖,說明習知一指紋辨識智慧卡; 圖2是一俯視示意圖,說明本新型一指紋辨識智慧卡的一第一實施例; 圖3是沿著圖2中的Ⅲ-Ⅲ線所截取的一剖視示意圖; 圖4是該第一實施例的訊號傳輸示意圖;及 圖5是一俯視示意圖,說明本新型一指紋辨識智慧卡的一第二實施例。
1:承載層體
11:第一表面
12:第二表面
13:凹槽面
131:凹槽
2:電訊號傳輸單元
21:電訊號轉換電路
22:感應線圈
3:指紋感測器
31:指紋感測面
4:訊號處理器
5:填充層
51:表層面
52:底層面
81:指紋

Claims (9)

  1. 一種指紋辨識智慧卡,適用於感測一使用者的一指紋,並適用於訊號連接於一讀卡機模組,該指紋辨識智慧卡包含: 一承載層體,具有彼此相反的一第一表面及一第二表面,及一自該第一表面往該第二表面的方向凹陷而界定出一凹槽的凹槽面; 一電訊號傳輸單元,適用於訊號連接於該讀卡機模組,及接收該讀卡機模組的電訊號後轉換為一電能,並設置於該承載層體; 一指紋感測器,訊號連接於該電訊號傳輸單元,並用於在接收到來自該電訊號傳輸單元的電能並感測到該指紋時,產生一指紋感測訊號,該指紋感測器設置於該承載層體的該凹槽,並具有一與該第一表面同向且低於該第一表面的指紋感測面; 一訊號處理器,訊號連接於該電訊號傳輸單元與該指紋感測器,並用於在接收到來自該電訊號傳輸單元的電能與該指紋感測器的指紋感測訊號時,對該指紋感測訊號進行處理,該訊號處理器設置於該承載層體;及 一填充層,填充於該凹槽且覆蓋該指紋感測器的該指紋感測面。
  2. 如請求項1所述的指紋辨識智慧卡,其中,該填充層的介電係數範圍為1~8。
  3. 如請求項2所述的指紋辨識智慧卡,其中,該填充層的製成材質為一固態膠體。
  4. 如請求項1所述的指紋辨識智慧卡,其中,該填充層具有一與該承載層體的該第一表面共同形成一平坦面的表層面。
  5. 如請求項4所述的指紋辨識智慧卡,其中,該填充層還具有一與該表層面相反的底層面,該填充層具有一底層面至該表層面的厚度,該厚度範圍為25 μm~80 μm。
  6. 如請求項4所述的指紋辨識智慧卡,還包含一貼合於該承載層體的該第一表面的保護層,該保護層覆蓋該填充層。
  7. 如請求項1所述的指紋辨識智慧卡,其中,該指紋感測器為一未經封裝的指紋感測晶片。
  8. 如請求項1所述的指紋辨識智慧卡,其中,該讀卡機模組包括一無線讀卡機,且該電訊號傳輸單元包括一適用於以無線的方式訊號連接於該無線讀卡機的感應線圈,及一訊號連接於該感應線圈與該指紋感測器之間的整流電路,該感應線圈設置於該承載層體中。
  9. 如請求項1所述的指紋辨識智慧卡,其中,該讀卡機模組包括一有線讀卡機,且該電訊號傳輸單元包括一適用於與該有線謮卡機直接接觸而訊號連接且與該指紋感測器訊號連接的電訊號轉換電路,該電訊號轉換電路自該承載層體的第一表面裸露出來。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI830359B (zh) * 2022-08-31 2024-01-21 安帝司股份有限公司 指紋辨識晶片模組的封裝結構及其製作方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3111215B1 (fr) * 2020-06-04 2022-08-12 Linxens Holding Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module
DE102021112447B4 (de) * 2021-05-12 2024-06-20 Infineon Technologies Ag Chipkarten-Biometrie-Sensor-Bauteil, Chipkarte, Verfahren zum Bilden eines Chipkarten-Biometrie-Sensor-Bauteils und Verfahren zum Bilden einer Chipkarte
US11688197B1 (en) * 2022-08-09 2023-06-27 Idspire Corporation Ltd. Fingerprint recognition module
WO2024128955A1 (en) * 2022-12-12 2024-06-20 Fingerprint Cards Anacatum Ip Ab Enrollment assistance device and method of biometrically enrolling a user

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5098276B2 (ja) * 2006-09-29 2012-12-12 富士通セミコンダクター株式会社 半導体装置の製造方法
TWI462193B (zh) * 2008-09-04 2014-11-21 En Min Jow 指紋感測晶片封裝方法及其封裝結構
US9336428B2 (en) * 2009-10-30 2016-05-10 Synaptics Incorporated Integrated fingerprint sensor and display
US8756680B2 (en) * 2011-08-02 2014-06-17 Corning Incorporated Biometric-enabled smart card
DE102013011812A1 (de) * 2013-07-16 2015-01-22 Peter-Joachim Neymann Elektronische Chipkarte
TWI530885B (zh) * 2014-03-18 2016-04-21 茂丞科技股份有限公司 具有外露顏料層之全平面感測器及使用其之電子裝置
US10713521B2 (en) * 2016-08-05 2020-07-14 Gingy Technology Inc. Image capturing apparatus and manufacturing method thereof
US10438106B2 (en) * 2014-11-04 2019-10-08 Intellignet Technologies International, Inc. Smartcard
DE102015204018A1 (de) * 2015-03-05 2016-09-08 Bundesdruckerei Gmbh Wert- oder Sicherheitsdokument mit einer elektronischen Schaltung und Verfahren zum Herstellen des Wert- oder Sicherheitsdokuments
CN104779221A (zh) * 2015-04-08 2015-07-15 南昌欧菲生物识别技术有限公司 指纹识别模组封装结构、制备指纹识别模组封装结构的方法以及电子设备
KR20160138917A (ko) * 2015-05-26 2016-12-06 크루셜텍 (주) 지문 검출 장치를 포함하는 스마트카드 및 이의 구동 방법
US9342774B1 (en) * 2015-07-08 2016-05-17 Wu-Hsu Lin Smart card with a fingerprint identifying module
US9959444B2 (en) * 2015-09-02 2018-05-01 Synaptics Incorporated Fingerprint sensor under thin face-sheet with aperture layer
US9904776B2 (en) * 2016-02-10 2018-02-27 Taiwan Semiconductor Manufacturing Company, Ltd. Fingerprint sensor pixel array and methods of forming same
US9875388B2 (en) * 2016-02-26 2018-01-23 Taiwan Semiconductor Manufacturing Company, Ltd. Fingerprint sensor device and method
US9773153B1 (en) * 2016-03-24 2017-09-26 Fingerprint Cards Ab Fingerprint sensor module
US9898640B2 (en) * 2016-05-02 2018-02-20 Fingerprint Cards Ab Capacitive fingerprint sensing device and method for capturing a fingerprint using the sensing device
US9760773B1 (en) * 2016-06-01 2017-09-12 Wu-Hsu Lin Smart card with a retina identifying module
EP3288072A4 (en) * 2016-07-15 2018-05-23 Shenzhen Goodix Technology Co., Ltd. Fingerprint recognition module and preparation method therefor
KR102573234B1 (ko) * 2016-08-02 2023-08-31 삼성전자주식회사 전면 스크린을 채용한 전자 장치
US20180101718A1 (en) * 2016-10-11 2018-04-12 Zwipe As Fingerprint authorisable device
US20180102330A1 (en) * 2016-10-12 2018-04-12 Sunasic Technologies, Inc. Sensing chip package having esd protection and method making the same
CN206602107U (zh) * 2016-11-23 2017-10-31 创智能科技股份有限公司 指纹感测辨识封装结构
MY181171A (en) * 2016-11-28 2020-12-21 Carsem M Sdn Bhd Low-profile electronic package
US11023702B2 (en) * 2016-12-15 2021-06-01 Fingerprint Cards Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
US11610429B2 (en) * 2016-12-15 2023-03-21 Fingerprint Cards Anacatum Ip Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
EP3379391B1 (en) * 2017-01-19 2020-12-02 Shenzhen Goodix Technology Co., Ltd. Fingerprint recognition device and manufacturing method therefor
CN108780772B (zh) * 2017-02-13 2023-07-14 深圳市汇顶科技股份有限公司 硅通孔芯片的二次封装方法及其二次封装体
EP3401835A1 (en) * 2017-05-12 2018-11-14 Nxp B.V. Fingerprint sensor module
SE1750770A1 (en) * 2017-06-16 2018-12-17 Fingerprint Cards Ab Fingerprint sensor module and method for manufacturing a fingerprint sensor module
SE1750836A1 (en) * 2017-06-28 2018-12-29 Fingerprint Cards Ab Fingerprint sensor module comprising antenna and method for manufacturing a fingerprint sensor module
FR3069081B1 (fr) * 2017-07-17 2021-08-20 Safran Identity & Security Carte electronique comprenant un capteur d'empreinte et procede de fabrication d'une telle carte
TWI686767B (zh) * 2018-02-06 2020-03-01 第一美卡事業股份有限公司 具指紋辨識之交易卡
CN112203824B (zh) * 2018-06-07 2022-04-19 指纹卡安娜卡敦知识产权有限公司 包括指纹传感器的智能卡以及用于制造智能卡的方法
FR3095287B1 (fr) * 2019-04-19 2022-11-04 Linxens Holding Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module
TW202105256A (zh) * 2019-07-26 2021-02-01 義隆電子股份有限公司 具指紋感測模組的卡片
GB2590079B (en) * 2019-11-29 2023-01-18 Zwipe As Off-device biometric enrolment
EP3836010B1 (en) * 2019-12-12 2024-07-24 Fingerprint Cards Anacatum IP AB A biometric sensor module for card integration
KR20220013230A (ko) * 2020-07-24 2022-02-04 삼성전자주식회사 지문 센서 패키지 및 이를 포함하는 스마트 카드
KR20220056666A (ko) * 2020-10-28 2022-05-06 삼성전자주식회사 지문 센서 패키지 및 이를 포함하는 스마트 카드
TW202234627A (zh) * 2021-02-24 2022-09-01 安帝司股份有限公司 指紋辨識晶片模組的封裝結構與其製作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI830359B (zh) * 2022-08-31 2024-01-21 安帝司股份有限公司 指紋辨識晶片模組的封裝結構及其製作方法

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