TW201931537A - 封裝結構 - Google Patents
封裝結構 Download PDFInfo
- Publication number
- TW201931537A TW201931537A TW106146510A TW106146510A TW201931537A TW 201931537 A TW201931537 A TW 201931537A TW 106146510 A TW106146510 A TW 106146510A TW 106146510 A TW106146510 A TW 106146510A TW 201931537 A TW201931537 A TW 201931537A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- surface layer
- item
- scope
- patent application
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract description 9
- 238000004519 manufacturing process Methods 0.000 title abstract description 6
- 239000004020 conductor Substances 0.000 claims abstract description 13
- 239000002344 surface layer Substances 0.000 claims description 35
- 239000010410 layer Substances 0.000 claims description 34
- 238000004806 packaging method and process Methods 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 20
- 239000006229 carbon black Substances 0.000 claims description 18
- 238000005538 encapsulation Methods 0.000 claims description 13
- 230000005611 electricity Effects 0.000 claims description 10
- 230000003068 static effect Effects 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 230000003628 erosive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 210000004243 sweat Anatomy 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 210000000887 face Anatomy 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Packaging Frangible Articles (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
一種封裝結構,係於感測晶片上設置表面層,且該表面層係包含聚合物與導電物,使該感測晶片不會外露於環境中,故不僅能保護該感測晶片而避免發生表面侵蝕及產生靜電等問題,且能避免該感測晶片因靜電而造成燒毀之問題,因而能提升該封裝結構的耐用性。
Description
本發明係有關一種封裝結構,尤指一種可應用於指紋感測器之封裝結構。
隨著消費者對於隱私的注重程度提升,諸多高階電子產品皆已裝載使用者辨識系統,例如,手機、平板電腦、個人電腦、電子鎖等,以增加電子產品中資料的安全性,因此辨識系統的研發與設計隨著消費者需求,而成為電子產業主要發展方向之一。
於生物辨識系統中,依據辨識標的之不同可概括分為辨識生物的生理特徵(如指紋、瞳孔、人臉、聲紋)辨識與行為特徵(如簽名、語音)等類型的生物辨識系統,其中,辨識生理特徵的生物辨識系統具有單一性、防偽程度高與便利等優點,且此技術已逐漸成熟而廣泛地應用於個人之身分辨識與確認,因此廣為消費者所接受。
現有指紋辨識裝置中,依據指紋的掃描方式分為掃描指紋圖案的光學式指紋辨識裝置及偵測指紋紋路中的微量電荷的電容式指紋辨識裝置。
目前電容式指紋感測器係符合薄型化與微小型化,因
而廣泛應用於電子產品上。如第1圖所示,習知電容式指紋感測器(fingerprint sensor)之封裝結構1係於一基板10上設置一具有感測面11a之感測晶片11,再以封裝膠體12包覆該感測晶片11並外露出該感測面11a,之後於該感測面11a與該封裝膠體12上設置一傳感層13。藉此,使用者可藉由觸滑(swipe)該傳感層13而令該感測晶片11之感測面11a感測指紋。
惟,習知封裝結構1中,於設置該傳感層13前之運送過程中,該感測晶片11係外露於環境中,因而容易受到環境氣體、環境液體或手指上的汗水與酸鹼性等的影響,致使該感測晶片11(甚至該感測面11a)發生表面侵蝕及產生靜電等問題,造成採用該封裝結構1之電容式指紋感測器的耐用性不佳,且使用壽命大幅降低。
再者,雖可於該感測晶片11上設置一藍寶石基板,以避免發生表面侵蝕及產生靜電等問題,但會大幅提高製作成本。
因此,如何克服上述習知技術的種種問題,實已成目前亟欲解決的課題。
鑒於上述習知技術之缺失,本發明係提供一種封裝結構,係包括:承載件;電子元件,係具有相對之感測面與非感測面,並以該非感測面結合至該承載件上;封裝層,係形成於該承載件上以包覆該電子元件,且令該感測面外露出該封裝層;以及表面層,係覆蓋該電子元件,並包含
有聚合物與導電物。
前述之封裝結構中,該電子元件係電性連接該承載件。
前述之封裝結構中,該聚合物係為環氧樹脂。
前述之封裝結構中,該導電物係為碳黑材料,如碳顆粒,且該碳黑材料佔據該表面層的含量比例低於5%。進一步地,該碳黑材料佔據該表面層的含量比例可調整該表面層之顏色深淺程度或調整該表面層的電阻值。或者,該碳黑材料的導電性亦可用以調整該表面層的電阻值。
前述之封裝結構中,該表面層的導電物、該電子元件及該承載件係構成一用以排除靜電的導電通路。
前述之封裝結構中,復包括設於該表面層上之傳感層。
由上可知,本發明之封裝結構,主要藉由該包含有聚合物與導電物之表面層之設計取代習知藍寶石基板之使用,以降低製作成本,且使該電子元件於設置該傳感層13前不會外露於環境中,故相較於習知技術,本發明不僅能保護該電子元件而避免發生表面侵蝕及產生靜電等問題,且能避免該電子元件因靜電而造成燒毀之問題,因而能提升該封裝結構的耐用性,且能大幅增加使用壽命。
1,2,3‧‧‧封裝結構
10‧‧‧基板
11‧‧‧感測晶片
11a,21a‧‧‧感測面
12‧‧‧封裝膠體
13,23‧‧‧傳感層
20‧‧‧承載件
200‧‧‧接地線路
21‧‧‧電子元件
21b‧‧‧非感測面
210,310‧‧‧電極墊
211‧‧‧導電凸塊
22‧‧‧封裝層
22a‧‧‧第一表面
22b‧‧‧第二表面
24‧‧‧表面層
24a‧‧‧聚合物
24b‧‧‧導電物
29‧‧‧底膠
311‧‧‧銲線
第1圖係為習知封裝結構之剖面示意圖;第2圖係為本發明之封裝結構之剖面示意圖;以及第3圖係為第2圖之另一實施例之剖面示意圖。
以下係藉由特定的具體實例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點與功效。本發明亦可藉由其他不同的具體實例加以施行或應用,本說明書中的各項細節亦可基於不同觀點與應用,在不悖離本發明之精神下進行各種修飾與變更。
須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本創作可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本創作所能產生之功效及所能達成之目的下,均應仍落在本創作所揭示之技術內容得能涵蓋之範圍內。本說明書中所引用之如「上」、「第一」、「第二」及「一」等之用語,亦僅為便於敘述之明瞭,而非用以限定本創作可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本創作可實施之範疇。
請參閱第2圖,係為本發明之封裝結構2之剖面示意圖。如第2圖所示,所述之封裝結構2係包括一承載件20、一電子元件21、一封裝層22、一傳感層23以及一表面層24。
所述之承載件20係為具有核心層或無核心層(coreless)之線路結構,例如封裝基板(substrate),其具
有線路層,如包含接地線路200,其型態為扇出(fan out)型重佈線路層(redistribution layer,簡稱RDL)。應可理解地,該承載件20亦可為其它承載晶片之型式,如導線架(leadframe)、如晶圓(wafer)或矽中介板(silicon interposer)之半導體板、或其它具有金屬佈線(routing)之載板,並不限於上述。
所述之電子元件21係具有相對之感測面21a與非感測面21b,且該電子元件21以其非感測面21b結合該承載件20。
於本實施例中,該電子元件21係為感測晶片,例如,一種用以偵測生物體電荷變化、溫度差、壓力等的感測晶片,更佳為指紋辨識晶片,該指紋辨識晶片係為能藉由該感測面21a所接收的電容差進行生物辨識。
再者,該電子元件21之電極墊210係配置於該非感測面21b上,使電子元件21藉由該電極墊210及複數導電凸塊211以覆晶方式電性連接該承載件20之線路層,再以底膠29包覆該些導電凸塊211。或者,於其它實施例中,如第3圖所示,該電子元件21之電極墊310可配置於該感測面21a上,使該電極墊310藉由銲線311以打線方式電性連接該承載件20之線路層。因此,對於該電子元件21電性連接該承載件20之方式並無特別限制。
所述之封裝層22係形成於該承載件20上以包覆該電子元件21,使該電子元件21嵌埋於該封裝層22中,且令該感測面21a外露出該封裝層22。另外,可省略前述之底
膠29,直接以該封裝層22包覆該些導電凸塊211。
於本實施例中,該封裝層22係具有相對之第一表面22a及第二表面22b,該封裝層22以其第二表面22b結合至該承載件20上,且令該感測面21a外露於該封裝層22之第一表面22a。
再者,形成該封裝層22之材質係為聚醯亞胺(polyimide,簡稱PI)、乾膜(dry film)、環氧樹脂(epoxy)或封裝材(molding compound),但不限於上述。
又,形成該封裝層22之方法係以壓合(laminating)方式或如模壓成型(compression molding)、轉注成型(transfer molding)等鑄模成型(molding)方式所完成。
所述之表面層24係形成於該封裝層22之第一表面22a上且覆蓋該電子元件21之感測面21a,且該表面層24係包含聚合物24a與導電物24b。
於本實施例中,該聚合物24a係為環氧樹脂,且該導電物24b係為碳黑材料,其中,該碳黑材料係為碳顆粒,例如,該碳黑材料佔據該表面層24的含量比例係低於5%。
再者,將該碳黑材料添加於該環氧樹酯中,可使該表面層24之顏色呈黑色,故藉由控制該碳黑材料的比例可調整該表面層24之黑色程度,如深黑色、淺黑色或灰色等。
又,藉由控制該碳黑材料的含量比例或導電性(如提高其電阻等),可調整該表面層24的電阻值,故該表面層24的導電物24b(碳黑材料)、相關該電子元件21的導電元件(如電極墊210,310與該導電凸塊211或銲線311等)
及該承載件20的接地線路200可構成一用以排除靜電的導電通路。
此外,可將該導電物24b(碳黑材料)佔據該表面層24的含量比例調降至5%以下,使該表面層24之電阻上升至大於或等於1011歐姆(≧1011Ω),以提高該表面層24之抗靜電力,如可抗大於30千伏(>30KV)之電壓,故能避免該電子元件21因靜電而造成燒毀之問題。
所述之傳感層23係設於該表面層24上。於本實施例中,該傳感層23係作為傳感或保護用,其材質係為玻璃或其它適當的高分子材料。
於該封裝結構2之運作中,藉由手指作用(按壓)該傳感層23而令該表面層24與該感測面21a感測指紋之相關訊號。
綜上所述,本發明之封裝結構2,3中,係藉由該表面層24形成於該感測面21a上(或於該電子元件21與該傳感層23之間形成該表面層24),且該表面層24包含聚合物24a與導電物24b,相較於習知,將可大幅降低製作成本,且使該電子元件21於設置該傳感層23前之運送過程中不會外露於環境中,故相較於習知技術,該封裝結構2,3不僅能保護該電子元件21而使其不受到環境氣體、環境液體或手指上的汗水與酸鹼性等的影響以避免該電子元件21(甚至該感測面21a)發生表面侵蝕及產生靜電等問題,且能避免該電子元件21因靜電而造成燒毀之問題,因而能提升採用該封裝結構2之電容式感測器的耐用性,且能大
幅增加使用壽命。
上述實施例僅例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修飾與改變。因此,本發明之權利保護範圍,應如後述之申請專利範圍所列。
Claims (11)
- 一種封裝結構,係包括:承載件;電子元件,係具有相對之感測面與非感測面,並以該非感測面結合至該承載件上;封裝層,係形成於該承載件上以包覆該電子元件,且令該感測面外露出該封裝層;以及表面層,係覆蓋該電子元件,並包含有聚合物與導電物。
- 如申請專利範圍第1項所述之封裝結構,其中,該電子元件係電性連接該承載件。
- 如申請專利範圍第1項所述之封裝結構,其中,該聚合物係為環氧樹脂。
- 如申請專利範圍第1項所述之封裝結構,其中,該導電物係為碳黑材料。
- 如申請專利範圍第4項所述之封裝結構,其中,該碳黑材料係為碳顆粒。
- 如申請專利範圍第4項所述之封裝結構,其中,該碳黑材料佔據該表面層的含量比例係低於5%。
- 如申請專利範圍第4項所述之封裝結構,其中,該碳黑材料佔據該表面層的含量比例係用以調整該表面層之顏色深淺程度。
- 如申請專利範圍第4項所述之封裝結構,其中,該碳黑材料佔據該表面層的含量比例係用以調整該表面層的 電阻值。
- 如申請專利範圍第4項所述之封裝結構,其中,該碳黑材料的導電性係用以調整該表面層的電阻值。
- 如申請專利範圍第1項所述之封裝結構,其中,該表面層的導電物、該電子元件及該承載件係構成一用以排除靜電的導電通路。
- 如申請專利範圍第1項所述之封裝結構,復包括設於該表面層上之傳感層。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW106146510A TWI689059B (zh) | 2017-12-29 | 2017-12-29 | 封裝結構 |
CN201810021381.XA CN109994431A (zh) | 2017-12-29 | 2018-01-10 | 封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW106146510A TWI689059B (zh) | 2017-12-29 | 2017-12-29 | 封裝結構 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201931537A true TW201931537A (zh) | 2019-08-01 |
TWI689059B TWI689059B (zh) | 2020-03-21 |
Family
ID=67128985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106146510A TWI689059B (zh) | 2017-12-29 | 2017-12-29 | 封裝結構 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN109994431A (zh) |
TW (1) | TWI689059B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111816643A (zh) * | 2020-07-10 | 2020-10-23 | 山东砚鼎电子科技有限公司 | 一种触控传感器 |
CN111816642A (zh) * | 2020-07-10 | 2020-10-23 | 山东砚鼎电子科技有限公司 | 一种防静电传感器 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3753765A (en) * | 1971-09-20 | 1973-08-21 | Du Pont | Conductive carbon antistatic backing for photographic film |
CN1025122C (zh) * | 1990-10-20 | 1994-06-22 | 浙江工学院 | 耐油抗静电防腐涂料 |
TW589724B (en) * | 2002-03-28 | 2004-06-01 | Toshiba Corp | Semiconductor device |
US20040113129A1 (en) * | 2002-07-25 | 2004-06-17 | Waggoner Marion G. | Static dissipative thermoplastic polymer composition |
TWM352093U (en) * | 2008-09-05 | 2009-03-01 | En-Min Jow | Fingerprint sensor chip package structure |
CN102863787B (zh) * | 2012-09-14 | 2015-08-12 | 毛澄宇 | 一种导电-抗静电复合材料及其制备方法 |
TWM484793U (zh) * | 2014-05-23 | 2014-08-21 | Dynacard Co Ltd | 指紋辨識晶片封裝模組 |
TWI559463B (zh) * | 2014-10-31 | 2016-11-21 | 矽品精密工業股份有限公司 | 封裝結構及其製法 |
TWI594341B (zh) * | 2015-01-19 | 2017-08-01 | 神盾股份有限公司 | 指紋辨識裝置封裝及其製造方法 |
TW201723140A (zh) * | 2015-12-31 | 2017-07-01 | 安炬科技股份有限公司 | 透明抗靜電膜 |
CN105778709A (zh) * | 2016-03-10 | 2016-07-20 | 天津市烯腾科技有限公司 | 一种环氧树脂-石墨烯导静电防腐涂料及其制备方法 |
CN107507823B (zh) * | 2016-06-14 | 2022-12-20 | 三星电子株式会社 | 半导体封装和用于制造半导体封装的方法 |
-
2017
- 2017-12-29 TW TW106146510A patent/TWI689059B/zh active
-
2018
- 2018-01-10 CN CN201810021381.XA patent/CN109994431A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
TWI689059B (zh) | 2020-03-21 |
CN109994431A (zh) | 2019-07-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10395164B2 (en) | Fingerprint sensing module and method for manufacturing the fingerprint sensing module | |
US9646905B2 (en) | Fingerprint sensor package and method for fabricating the same | |
TWI672749B (zh) | 指紋識別晶片之封裝結構及封裝方法 | |
US11610429B2 (en) | Fingerprint sensing module and method for manufacturing the fingerprint sensing module | |
US9978673B2 (en) | Package structure and method for fabricating the same | |
TWI570857B (zh) | 封裝結構及其製法 | |
US11023702B2 (en) | Fingerprint sensing module and method for manufacturing the fingerprint sensing module | |
TWI559463B (zh) | 封裝結構及其製法 | |
TWI689059B (zh) | 封裝結構 | |
TWI637468B (zh) | 封裝結構及其製法 | |
TWI612626B (zh) | 封裝結構及其製法 | |
KR102089620B1 (ko) | 센서 패키지용 코팅 장치 | |
TWI591768B (zh) | 封裝結構及其製法 | |
TWI653728B (zh) | 指紋辨識晶片的封裝結構及其製造方法 | |
TWI615928B (zh) | 封裝結構及其製法 | |
TWI620287B (zh) | 封裝結構及其製法 | |
TWI526942B (zh) | 指紋感測裝置 | |
KR20210071561A (ko) | 지문센서 패키지 |