CN1066474C - 耐热树脂组合物，耐热膜粘合剂及其制造方法 - Google Patents
耐热树脂组合物，耐热膜粘合剂及其制造方法 Download PDFInfo
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- CN1066474C CN1066474C CN95100995A CN95100995A CN1066474C CN 1066474 C CN1066474 C CN 1066474C CN 95100995 A CN95100995 A CN 95100995A CN 95100995 A CN95100995 A CN 95100995A CN 1066474 C CN1066474 C CN 1066474C
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- heat resistant
- polyimide resin
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- dianhydride
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- 230000006866 deterioration Effects 0.000 description 1
- 125000006159 dianhydride group Chemical group 0.000 description 1
- 229940117389 dichlorobenzene Drugs 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- GWZCCUDJHOGOSO-UHFFFAOYSA-N diphenic acid Chemical compound OC(=O)C1=CC=CC=C1C1=CC=CC=C1C(O)=O GWZCCUDJHOGOSO-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000005055 memory storage Effects 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 229960003418 phenoxybenzamine Drugs 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000004577 thatch Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N tolylenediamine group Chemical group CC1=C(C=C(C=C1)N)N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S526/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S526/935—Hot melt adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6036887A JP3014578B2 (ja) | 1994-03-08 | 1994-03-08 | 高温時の物性が改良された樹脂組成物 |
| JP036887/94 | 1994-03-08 | ||
| JP036887/1994 | 1994-03-08 | ||
| JP14191294A JP2951206B2 (ja) | 1994-06-23 | 1994-06-23 | 高温時の物性が改良された樹脂組成物 |
| JP141912/94 | 1994-06-23 | ||
| JP141912/1994 | 1994-06-23 | ||
| JP16497594A JPH0827430A (ja) | 1994-07-18 | 1994-07-18 | 高温時の物性が改良されたフィルム接着剤及びその製造方法 |
| JP164975/1994 | 1994-07-18 | ||
| JP164975/94 | 1994-07-18 | ||
| JP6170924A JPH0834967A (ja) | 1994-07-22 | 1994-07-22 | 高温時の物性が改良されたフィルム接着剤及びその製造方法 |
| JP170924/1994 | 1994-07-22 | ||
| JP170924/94 | 1994-07-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1112584A CN1112584A (zh) | 1995-11-29 |
| CN1066474C true CN1066474C (zh) | 2001-05-30 |
Family
ID=27460334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN95100995A Expired - Fee Related CN1066474C (zh) | 1994-03-08 | 1995-03-07 | 耐热树脂组合物，耐热膜粘合剂及其制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5773509A (enrdf_load_stackoverflow) |
| KR (1) | KR100371756B1 (enrdf_load_stackoverflow) |
| CN (1) | CN1066474C (enrdf_load_stackoverflow) |
| TW (1) | TW294702B (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109722211A (zh) * | 2018-12-21 | 2019-05-07 | 东华大学 | 一种bdaddm型含硅胶粘剂及其制备方法 |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6791194B1 (en) * | 1996-05-30 | 2004-09-14 | Hitachi, Ltd. | Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same |
| JP3639088B2 (ja) * | 1997-06-06 | 2005-04-13 | 株式会社ルネサステクノロジ | 半導体装置及び配線テープ |
| KR100335663B1 (ko) * | 1999-10-19 | 2002-05-06 | 윤종용 | 테입리스 ｌｏｃ 패키징용 폴리(이미드-실록산) 화합물 |
| TW567198B (en) | 1999-12-28 | 2003-12-21 | Kaneka Corp | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide |
| KR100599544B1 (ko) * | 2000-04-12 | 2006-07-13 | 가부시키가이샤 가네카 | 적층체 및 그것을 사용한 다층 배선판 |
| US6632523B1 (en) | 2000-09-28 | 2003-10-14 | Sumitomo Bakelite Company Limited | Low temperature bonding adhesive composition |
| JP4067869B2 (ja) * | 2002-05-13 | 2008-03-26 | 新日鐵化学株式会社 | シロキサン変性ポリイミド樹脂 |
| US20050165196A1 (en) * | 2002-05-30 | 2005-07-28 | Jin Kinoshita | Adhesive resin and film adhesive made by using the same |
| JP4120780B2 (ja) * | 2002-07-19 | 2008-07-16 | 信越化学工業株式会社 | フェノール性水酸基を有するポリイミド樹脂の製造方法 |
| US20060199920A1 (en) * | 2003-04-15 | 2006-09-07 | Koji Okada | Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof |
| WO2005019231A1 (ja) * | 2003-06-05 | 2005-03-03 | Kaneka Corporation | ホスファゼン化合物、及び感光性樹脂組成物並びにその利用 |
| SE525619C2 (sv) * | 2004-05-05 | 2005-03-22 | Isaberg Rapid Ab | Häftapparat |
| CN100575438C (zh) * | 2004-11-12 | 2009-12-30 | 三井化学株式会社 | 薄膜状粘结剂以及使用该粘结剂的半导体封装体 |
| JP4761952B2 (ja) * | 2005-12-14 | 2011-08-31 | 富士通株式会社 | Ｒｆｉｄタグ |
| KR20120066354A (ko) * | 2010-12-14 | 2012-06-22 | 삼성모바일디스플레이주식회사 | 기판 및 상기 기판을 포함하는 표시 장치 |
| JP5824402B2 (ja) * | 2012-04-02 | 2015-11-25 | 株式会社巴川製紙所 | 半導体装置製造用マスクシート及びそれを用いた半導体装置の製造方法 |
| CN109722209A (zh) * | 2018-12-21 | 2019-05-07 | 东华大学 | 一种yasi有机酰亚胺硅胶及其制备方法 |
| CN109705799B (zh) * | 2018-12-21 | 2022-03-18 | 东华大学 | 一种yasi环氧有机酰亚胺硅胶及其制备方法 |
| CN109722212B (zh) * | 2018-12-21 | 2021-12-28 | 福建省海钛智能科技有限公司 | 一种酰亚胺环氧有机硅胶及其制备方法 |
| CN109722208A (zh) * | 2018-12-21 | 2019-05-07 | 东华大学 | 一种12bdapb型含硅胶粘剂及其制备方法 |
| CN109722210A (zh) * | 2018-12-21 | 2019-05-07 | 东华大学 | 一种tade型含硅胶粘剂及其制备方法 |
| CN109735295B (zh) * | 2018-12-21 | 2021-12-28 | 福建省海钛智能科技有限公司 | 一种酰亚胺有机硅胶及其制备方法 |
| CN113637449B (zh) * | 2021-08-25 | 2023-05-26 | 余鹏飞 | 一种高频胶黏剂及用其制备的高频覆铜板用保护膜 |
| CN114686157B (zh) * | 2022-03-09 | 2023-08-18 | 江苏环峰电工材料有限公司 | 一种用于胶黏剂的三维网状聚合物及其制备方法 |
| DE102023205219A1 (de) * | 2023-06-05 | 2024-12-05 | Siemens Aktiengesellschaft | Lackformulierung, Isolation daraus und Verwendung dazu |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6157875A (ja) * | 1984-08-30 | 1986-03-24 | Nippon Steel Corp | マイクロ波距離測定装置 |
| JPS6172716A (ja) * | 1984-09-17 | 1986-04-14 | Kao Corp | 外用抗真菌剤 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2101148B (en) * | 1981-04-14 | 1984-10-24 | Hitachi Ltd | Composition of protective coating material |
| JPS58218127A (ja) * | 1982-06-11 | 1983-12-19 | Hitachi Chem Co Ltd | 半導体装置の保護被膜材料用組成物 |
| US4758476A (en) * | 1984-12-12 | 1988-07-19 | Hitachi Chemical Company, Ltd. | Polyimide precursor resin composition and semiconductor device using the same |
| US4996293A (en) * | 1987-02-13 | 1991-02-26 | New Japan Chemical Co., Ltd. | Composition comprising polyimide resin from diphenyl sulfone -3,3',4,4'-tetracarboxylic acid dianhydride |
| JPH0627180B2 (ja) * | 1988-07-05 | 1994-04-13 | 信越化学工業株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JPH07102646B2 (ja) * | 1988-09-30 | 1995-11-08 | 株式会社日立製作所 | 金属とポリイミドの複合成形体 |
| JPH02124972A (ja) * | 1988-11-02 | 1990-05-14 | Shin Etsu Chem Co Ltd | ポリイミド樹脂溶液組成物 |
| MY105477A (en) * | 1990-03-29 | 1994-10-31 | Sumitomo Chemical Co | Thermosetting resin composition and use thereof for an electronic part. |
| JP2748995B2 (ja) * | 1990-11-26 | 1998-05-13 | 三井東圧化学株式会社 | 溶融成形用ポリイミドおよびその製造方法ならびにその樹脂組成物 |
| JP2998858B2 (ja) * | 1990-11-30 | 2000-01-17 | 宇部興産株式会社 | 耐熱性樹脂接着剤 |
| KR960010844B1 (ko) * | 1991-07-11 | 1996-08-09 | 제일모직 주식회사 | 내열성이 향상된 반도체소자 밀봉용 수지조성물 |
| JP3031020B2 (ja) * | 1991-11-19 | 2000-04-10 | 宇部興産株式会社 | 耐熱性樹脂接着剤 |
| JP3031064B2 (ja) * | 1992-05-12 | 2000-04-10 | 宇部興産株式会社 | 耐熱性接着剤 |
| JP3074661B2 (ja) * | 1992-11-20 | 2000-08-07 | 宇部興産株式会社 | ポリイミドシロキサン組成物 |
| JP2805741B2 (ja) * | 1992-12-04 | 1998-09-30 | 宇部興産株式会社 | 耐熱性接着剤組成物 |
-
1995
- 1995-02-27 TW TW84101808A patent/TW294702B/zh active
- 1995-03-07 US US08/399,644 patent/US5773509A/en not_active Expired - Lifetime
- 1995-03-07 KR KR1019950004639A patent/KR100371756B1/ko not_active Expired - Fee Related
- 1995-03-07 CN CN95100995A patent/CN1066474C/zh not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6157875A (ja) * | 1984-08-30 | 1986-03-24 | Nippon Steel Corp | マイクロ波距離測定装置 |
| JPS6172716A (ja) * | 1984-09-17 | 1986-04-14 | Kao Corp | 外用抗真菌剤 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109722211A (zh) * | 2018-12-21 | 2019-05-07 | 东华大学 | 一种bdaddm型含硅胶粘剂及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US5773509A (en) | 1998-06-30 |
| KR100371756B1 (ko) | 2003-09-03 |
| CN1112584A (zh) | 1995-11-29 |
| TW294702B (enrdf_load_stackoverflow) | 1997-01-01 |
| KR950032465A (ko) | 1995-12-20 |
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