CN106537683B - 多层基板上信号的耦合 - Google Patents

多层基板上信号的耦合 Download PDF

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Publication number
CN106537683B
CN106537683B CN201580034311.2A CN201580034311A CN106537683B CN 106537683 B CN106537683 B CN 106537683B CN 201580034311 A CN201580034311 A CN 201580034311A CN 106537683 B CN106537683 B CN 106537683B
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China
Prior art keywords
coupler
dielectric material
conductive layer
signal line
signal
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CN201580034311.2A
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Chinese (zh)
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CN106537683A (zh
Inventor
罗伯特·C·弗莱
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Blue Danube Systems Inc
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Blue Danube Systems Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/026—Coplanar striplines [CPS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
CN201580034311.2A 2014-06-23 2015-06-22 多层基板上信号的耦合 Active CN106537683B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462015604P 2014-06-23 2014-06-23
US62/015,604 2014-06-23
PCT/US2015/036891 WO2015200171A1 (en) 2014-06-23 2015-06-22 Coupling of signals on multi-layer substrates

Publications (2)

Publication Number Publication Date
CN106537683A CN106537683A (zh) 2017-03-22
CN106537683B true CN106537683B (zh) 2020-03-13

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Family Applications (1)

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CN201580034311.2A Active CN106537683B (zh) 2014-06-23 2015-06-22 多层基板上信号的耦合

Country Status (6)

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US (2) US20150373837A1 (enExample)
EP (1) EP3158605A1 (enExample)
JP (2) JP6526069B2 (enExample)
KR (1) KR20170023095A (enExample)
CN (1) CN106537683B (enExample)
WO (2) WO2015200163A1 (enExample)

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US9496902B2 (en) 2014-07-24 2016-11-15 Skyworks Solutions, Inc. Apparatus and methods for reconfigurable directional couplers in an RF transceiver with selectable phase shifters
US9866244B2 (en) 2015-09-10 2018-01-09 Skyworks Solutions, Inc. Electromagnetic couplers for multi-frequency power detection
US9954564B2 (en) 2016-02-05 2018-04-24 Skyworks Solutions, Inc. Electromagnetic couplers with multi-band filtering
TWI720128B (zh) 2016-02-29 2021-03-01 美商天工方案公司 整合式濾波器及定向耦合器總成
WO2017172575A1 (en) 2016-03-30 2017-10-05 Skyworks Solutions, Inc. Tunable active silicon for coupler linearity improvement and reconfiguration
CN109314298B (zh) * 2016-04-29 2023-05-02 天工方案公司 补偿电磁耦合器
US10249930B2 (en) 2016-04-29 2019-04-02 Skyworks Solutions, Inc. Tunable electromagnetic coupler and modules and devices using same
US10284167B2 (en) 2016-05-09 2019-05-07 Skyworks Solutions, Inc. Self-adjusting electromagnetic coupler with automatic frequency detection
US10164681B2 (en) 2016-06-06 2018-12-25 Skyworks Solutions, Inc. Isolating noise sources and coupling fields in RF chips
WO2017223141A1 (en) 2016-06-22 2017-12-28 Skyworks Solutions, Inc. Electromagnetic coupler arrangements for multi-frequency power detection, and devices including same
CN107546486B (zh) * 2016-06-23 2021-06-29 康普技术有限责任公司 具有恒定反转相位的天线馈送元件
US10426023B2 (en) * 2017-02-14 2019-09-24 The Regents Of The University Of California Systematic coupling balance scheme to enhance amplitude and phase matching for long-traveling multi-phase signals
US10742189B2 (en) 2017-06-06 2020-08-11 Skyworks Solutions, Inc. Switched multi-coupler apparatus and modules and devices using same
JP7001158B2 (ja) * 2018-06-07 2022-01-19 株式会社村田製作所 多層基板、電子機器および多層基板の製造方法
US10813211B2 (en) * 2018-12-14 2020-10-20 Dell Products L.P. Printed circuit board layout for mitigating near-end crosstalk
US11057078B2 (en) * 2019-05-23 2021-07-06 Canon Kabushiki Kaisha Wireless communication system
JP7510262B2 (ja) * 2019-05-23 2024-07-03 キヤノン株式会社 無線通信システムおよび制御方法
JP2021034536A (ja) * 2019-08-23 2021-03-01 日本特殊陶業株式会社 配線基板
CN111430863A (zh) * 2019-12-16 2020-07-17 瑞声科技(新加坡)有限公司 传输线以及终端设备
CN114976550A (zh) 2021-02-23 2022-08-30 天工方案公司 带有可切换电感器的智能双向耦合器
WO2022213018A1 (en) * 2021-03-31 2022-10-06 Jabil Inc. Differential pair impedance matching for a printed circuit board
CN115377071B (zh) * 2021-05-19 2025-12-02 圣邦微电子（北京）股份有限公司 一种信号线全包裹隔离的芯片、方法及芯片制造方法
JP2022185583A (ja) 2021-06-02 2022-12-14 スカイワークス ソリューションズ，インコーポレイテッド 複数の終端構成を有する方向性結合器
US11774475B2 (en) * 2021-07-13 2023-10-03 National Instruments Corporation Dual directional asymmetric coupler with a shared through-line
CN114552155B (zh) * 2022-04-25 2022-07-05 电子科技大学成都学院 双模传输线

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CN102484505A (zh) * 2009-09-01 2012-05-30 日本电气株式会社 通信系统和通信装置

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US5638402A (en) * 1993-09-27 1997-06-10 Hitachi, Ltd. Fast data transfer bus
US6600790B1 (en) * 1996-10-30 2003-07-29 Hitachi, Ltd. Gap-coupling bus system
CN1659499A (zh) * 2002-07-01 2005-08-24 株式会社瑞萨科技 等振幅方向性耦合式总线系统
US7271985B1 (en) * 2004-09-24 2007-09-18 Storage Technology Corporation System and method for crosstalk reduction in a flexible trace interconnect array
CN102484505A (zh) * 2009-09-01 2012-05-30 日本电气株式会社 通信系统和通信装置

Also Published As

Publication number Publication date
JP6526069B2 (ja) 2019-06-05
KR20170023095A (ko) 2017-03-02
JP2019165213A (ja) 2019-09-26
US20150372366A1 (en) 2015-12-24
JP2017520923A (ja) 2017-07-27
US9653768B2 (en) 2017-05-16
CN106537683A (zh) 2017-03-22
EP3158605A1 (en) 2017-04-26
WO2015200171A1 (en) 2015-12-30
WO2015200163A1 (en) 2015-12-30
US20150373837A1 (en) 2015-12-24

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