KR20170023095A - 다층 기판들 상에서의 신호들의 결합 - Google Patents
다층 기판들 상에서의 신호들의 결합 Download PDFInfo
- Publication number
- KR20170023095A KR20170023095A KR1020177001537A KR20177001537A KR20170023095A KR 20170023095 A KR20170023095 A KR 20170023095A KR 1020177001537 A KR1020177001537 A KR 1020177001537A KR 20177001537 A KR20177001537 A KR 20177001537A KR 20170023095 A KR20170023095 A KR 20170023095A
- Authority
- KR
- South Korea
- Prior art keywords
- coupler
- dielectric material
- conductive layer
- signal line
- upper conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 230000008878 coupling Effects 0.000 title claims description 10
- 238000010168 coupling process Methods 0.000 title claims description 10
- 238000005859 coupling reaction Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 title description 2
- 239000003989 dielectric material Substances 0.000 claims abstract description 60
- 238000009826 distribution Methods 0.000 claims abstract description 25
- 230000005540 biological transmission Effects 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 12
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- 230000008859 change Effects 0.000 description 4
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- 238000012935 Averaging Methods 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/026—Coplanar striplines [CPS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
- H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
- H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462015604P | 2014-06-23 | 2014-06-23 | |
| US62/015,604 | 2014-06-23 | ||
| PCT/US2015/036891 WO2015200171A1 (en) | 2014-06-23 | 2015-06-22 | Coupling of signals on multi-layer substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20170023095A true KR20170023095A (ko) | 2017-03-02 |
Family
ID=53541916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020177001537A Ceased KR20170023095A (ko) | 2014-06-23 | 2015-06-22 | 다층 기판들 상에서의 신호들의 결합 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9653768B2 (enExample) |
| EP (1) | EP3158605A1 (enExample) |
| JP (2) | JP6526069B2 (enExample) |
| KR (1) | KR20170023095A (enExample) |
| CN (1) | CN106537683B (enExample) |
| WO (2) | WO2015200163A1 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015192150A2 (en) | 2014-06-12 | 2015-12-17 | Skyworks Solutions, Inc. | Devices and methods related to directional couplers |
| US9496902B2 (en) | 2014-07-24 | 2016-11-15 | Skyworks Solutions, Inc. | Apparatus and methods for reconfigurable directional couplers in an RF transceiver with selectable phase shifters |
| TWI720014B (zh) | 2015-09-10 | 2021-03-01 | 美商西凱渥資訊處理科技公司 | 用於多頻功率偵測之電磁耦合器及具有電磁耦合器之系統 |
| TWI716539B (zh) | 2016-02-05 | 2021-01-21 | 美商天工方案公司 | 具有多波段濾波的電磁耦合器 |
| WO2017151321A1 (en) | 2016-02-29 | 2017-09-08 | Skyworks Solutions, Inc. | Integrated filter and directional coupler assemblies |
| TW201801360A (zh) | 2016-03-30 | 2018-01-01 | 天工方案公司 | 用於耦合器線性改良及重組態的可調主動矽 |
| CN109314299B (zh) * | 2016-04-29 | 2021-09-21 | 天工方案公司 | 可调谐电磁耦合器和使用其的模块和装置 |
| CN109314298B (zh) * | 2016-04-29 | 2023-05-02 | 天工方案公司 | 补偿电磁耦合器 |
| CN109417215B (zh) | 2016-05-09 | 2021-08-24 | 天工方案公司 | 具有自动频率检测的自调节电磁耦合器 |
| US10164681B2 (en) | 2016-06-06 | 2018-12-25 | Skyworks Solutions, Inc. | Isolating noise sources and coupling fields in RF chips |
| WO2017223141A1 (en) | 2016-06-22 | 2017-12-28 | Skyworks Solutions, Inc. | Electromagnetic coupler arrangements for multi-frequency power detection, and devices including same |
| CN107546486B (zh) * | 2016-06-23 | 2021-06-29 | 康普技术有限责任公司 | 具有恒定反转相位的天线馈送元件 |
| US10426023B2 (en) * | 2017-02-14 | 2019-09-24 | The Regents Of The University Of California | Systematic coupling balance scheme to enhance amplitude and phase matching for long-traveling multi-phase signals |
| US10742189B2 (en) | 2017-06-06 | 2020-08-11 | Skyworks Solutions, Inc. | Switched multi-coupler apparatus and modules and devices using same |
| WO2019235558A1 (ja) * | 2018-06-07 | 2019-12-12 | 株式会社村田製作所 | 多層基板、電子機器および多層基板の製造方法 |
| US10813211B2 (en) * | 2018-12-14 | 2020-10-20 | Dell Products L.P. | Printed circuit board layout for mitigating near-end crosstalk |
| US11057078B2 (en) * | 2019-05-23 | 2021-07-06 | Canon Kabushiki Kaisha | Wireless communication system |
| JP7510262B2 (ja) * | 2019-05-23 | 2024-07-03 | キヤノン株式会社 | 無線通信システムおよび制御方法 |
| JP2021034536A (ja) * | 2019-08-23 | 2021-03-01 | 日本特殊陶業株式会社 | 配線基板 |
| CN111430863A (zh) * | 2019-12-16 | 2020-07-17 | 瑞声科技(新加坡)有限公司 | 传输线以及终端设备 |
| JP2022128597A (ja) | 2021-02-23 | 2022-09-02 | スカイワークス ソリューションズ,インコーポレイテッド | スイッチング可能インダクタを備えたスマート双方向性結合器 |
| US20240188209A1 (en) * | 2021-03-31 | 2024-06-06 | Jabil Inc. | Differential pair impedance matching for a printed circuit board |
| CN115377071B (zh) * | 2021-05-19 | 2025-12-02 | 圣邦微电子(北京)股份有限公司 | 一种信号线全包裹隔离的芯片、方法及芯片制造方法 |
| CN115441146A (zh) | 2021-06-02 | 2022-12-06 | 天工方案公司 | 具有多个终端布置的定向耦合器 |
| US11774475B2 (en) * | 2021-07-13 | 2023-10-03 | National Instruments Corporation | Dual directional asymmetric coupler with a shared through-line |
| CN114552155B (zh) * | 2022-04-25 | 2022-07-05 | 电子科技大学成都学院 | 双模传输线 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3942164A (en) * | 1975-01-30 | 1976-03-02 | Semi, Inc. | Sense line coupling reduction system |
| US5430247A (en) | 1993-08-31 | 1995-07-04 | Motorola, Inc. | Twisted-pair planar conductor line off-set structure |
| US5389735A (en) * | 1993-08-31 | 1995-02-14 | Motorola, Inc. | Vertically twisted-pair planar conductor line structure |
| JP3399630B2 (ja) * | 1993-09-27 | 2003-04-21 | 株式会社日立製作所 | バスシステム |
| JP3442237B2 (ja) * | 1996-10-30 | 2003-09-02 | 株式会社日立製作所 | 間隙結合式バスシステム |
| EP1014471A1 (en) * | 1998-12-24 | 2000-06-28 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Waveguide-transmission line transition |
| JP3880286B2 (ja) * | 1999-05-12 | 2007-02-14 | エルピーダメモリ株式会社 | 方向性結合式メモリシステム |
| JP2001044712A (ja) * | 1999-07-28 | 2001-02-16 | Ricoh Co Ltd | ストリップ線路 |
| US7170361B1 (en) * | 2000-04-13 | 2007-01-30 | Micron Technology, Inc. | Method and apparatus of interposing voltage reference traces between signal traces in semiconductor devices |
| US6573801B1 (en) | 2000-11-15 | 2003-06-03 | Intel Corporation | Electromagnetic coupler |
| TWI242132B (en) * | 2002-07-01 | 2005-10-21 | Renesas Tech Corp | Equal-amplitude directional coupling bus system |
| US6703907B1 (en) | 2002-08-26 | 2004-03-09 | Inphi Corporation | Circuit technique for increasing effective inductance of differential transmission lines |
| US7307492B2 (en) * | 2002-11-27 | 2007-12-11 | Intel Corporation | Design, layout and method of manufacture for a circuit that taps a differential signal |
| US7002430B2 (en) * | 2003-05-30 | 2006-02-21 | Intel Corporation | Compact non-linear geometry electromagnetic coupler for use with digital transmission systems |
| US7265647B2 (en) * | 2004-03-12 | 2007-09-04 | The Regents Of The University Of California | High isolation tunable MEMS capacitive switch |
| FI121516B (fi) * | 2004-03-25 | 2010-12-15 | Filtronic Comtek Oy | Suuntakytkin |
| US7280808B2 (en) * | 2004-04-12 | 2007-10-09 | Sony Ericsson Mobile Communications, Ab | Wireless communications devices including circuit substrates with partially overlapping conductors thereon coupling power to/from power amplifier systems |
| US7271985B1 (en) * | 2004-09-24 | 2007-09-18 | Storage Technology Corporation | System and method for crosstalk reduction in a flexible trace interconnect array |
| EP1788765B1 (en) * | 2005-11-18 | 2012-08-01 | STMicroelectronics Srl | Transmission system of a digital signal |
| FI20065144L (fi) * | 2006-02-28 | 2007-08-29 | Filtronic Comtek Oy | Suuntakytkin |
| DE102007021615A1 (de) * | 2006-05-12 | 2007-11-15 | Denso Corp., Kariya | Dielektrisches Substrat für einen Wellenhohlleiter und einen Übertragungsleitungsübergang, die dieses verwenden |
| EP2854326A1 (en) | 2007-07-20 | 2015-04-01 | Blue Danube Labs Inc | Method and system for multi-point signal generation with phase synchronized local carriers |
| EP2068391A3 (de) | 2007-12-04 | 2010-01-20 | Rohde & Schwarz GmbH & Co. KG | Einrichtung mit überkreutzter Streifenleitung |
| US7830221B2 (en) * | 2008-01-25 | 2010-11-09 | Micron Technology, Inc. | Coupling cancellation scheme |
| US9288893B2 (en) * | 2009-02-11 | 2016-03-15 | Broadcom Corporation | Implementations of twisted differential pairs on a circuit board |
| JP5225188B2 (ja) * | 2009-04-23 | 2013-07-03 | 三菱電機株式会社 | 方向性結合器 |
| US20120146860A1 (en) * | 2009-09-01 | 2012-06-14 | Koichiro Nakase | Communication system and communication apparatus |
| AU2010306171B2 (en) * | 2009-10-14 | 2015-06-18 | Landis+Gyr (Europe) Ag | Antenna coupler |
| TR201807974T4 (tr) | 2010-07-01 | 2018-06-21 | Blue Danube Systems Inc | Uygun maliyetli, aktif anten dizilimleri. |
| KR101375938B1 (ko) * | 2012-12-27 | 2014-03-21 | 한국과학기술원 | 저전력, 고속 멀티-채널 유전체 웨이브가이드를 이용한 칩-대-칩 인터페이스 |
-
2015
- 2015-06-22 WO PCT/US2015/036881 patent/WO2015200163A1/en not_active Ceased
- 2015-06-22 US US14/745,710 patent/US9653768B2/en active Active
- 2015-06-22 JP JP2016574466A patent/JP6526069B2/ja active Active
- 2015-06-22 KR KR1020177001537A patent/KR20170023095A/ko not_active Ceased
- 2015-06-22 US US14/745,624 patent/US20150373837A1/en not_active Abandoned
- 2015-06-22 CN CN201580034311.2A patent/CN106537683B/zh active Active
- 2015-06-22 EP EP15736717.8A patent/EP3158605A1/en not_active Ceased
- 2015-06-22 WO PCT/US2015/036891 patent/WO2015200171A1/en not_active Ceased
-
2019
- 2019-02-28 JP JP2019036460A patent/JP2019165213A/ja not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019165213A (ja) | 2019-09-26 |
| EP3158605A1 (en) | 2017-04-26 |
| CN106537683A (zh) | 2017-03-22 |
| JP2017520923A (ja) | 2017-07-27 |
| JP6526069B2 (ja) | 2019-06-05 |
| CN106537683B (zh) | 2020-03-13 |
| WO2015200163A1 (en) | 2015-12-30 |
| WO2015200171A1 (en) | 2015-12-30 |
| US20150373837A1 (en) | 2015-12-24 |
| US20150372366A1 (en) | 2015-12-24 |
| US9653768B2 (en) | 2017-05-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20170118 Patent event code: PA01051R01D Comment text: International Patent Application |
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| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20200602 Comment text: Request for Examination of Application |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20210524 Patent event code: PE09021S01D |
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| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20210929 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20210524 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |