CN106489191A - 包括同轴互连的集成器件 - Google Patents

包括同轴互连的集成器件 Download PDF

Info

Publication number
CN106489191A
CN106489191A CN201580036954.0A CN201580036954A CN106489191A CN 106489191 A CN106489191 A CN 106489191A CN 201580036954 A CN201580036954 A CN 201580036954A CN 106489191 A CN106489191 A CN 106489191A
Authority
CN
China
Prior art keywords
interconnect
substrate
integrated device
interconnects
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580036954.0A
Other languages
English (en)
Chinese (zh)
Inventor
D·W·金
Y·K·宋
K-P·黄
H·B·蔚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Priority to CN202210862033.1A priority Critical patent/CN115036287A/zh
Publication of CN106489191A publication Critical patent/CN106489191A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/267—Patterned shielding planes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)
CN201580036954.0A 2014-07-11 2015-07-09 包括同轴互连的集成器件 Pending CN106489191A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210862033.1A CN115036287A (zh) 2014-07-11 2015-07-09 包括同轴互连的集成器件

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/329,646 US9385077B2 (en) 2014-07-11 2014-07-11 Integrated device comprising coaxial interconnect
US14/329,646 2014-07-11
PCT/US2015/039678 WO2016007706A1 (en) 2014-07-11 2015-07-09 Integrated device comprising coaxial interconnect

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202210862033.1A Division CN115036287A (zh) 2014-07-11 2015-07-09 包括同轴互连的集成器件

Publications (1)

Publication Number Publication Date
CN106489191A true CN106489191A (zh) 2017-03-08

Family

ID=53719982

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201580036954.0A Pending CN106489191A (zh) 2014-07-11 2015-07-09 包括同轴互连的集成器件
CN202210862033.1A Pending CN115036287A (zh) 2014-07-11 2015-07-09 包括同轴互连的集成器件

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202210862033.1A Pending CN115036287A (zh) 2014-07-11 2015-07-09 包括同轴互连的集成器件

Country Status (8)

Country Link
US (1) US9385077B2 (enExample)
EP (1) EP3167483A1 (enExample)
JP (1) JP6802146B2 (enExample)
KR (1) KR102411667B1 (enExample)
CN (2) CN106489191A (enExample)
AU (1) AU2015287804B2 (enExample)
BR (1) BR112017000154B1 (enExample)
WO (1) WO2016007706A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110098164A (zh) * 2018-01-29 2019-08-06 马维尔国际贸易有限公司 用于半导体部件的同轴互连结构

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10381303B2 (en) * 2016-07-01 2019-08-13 Vanguard International Semiconductor Corporation Semiconductor device structures
TWI594338B (zh) * 2016-08-09 2017-08-01 矽品精密工業股份有限公司 電子堆疊結構及其製法
US10070525B2 (en) * 2016-12-28 2018-09-04 Intel Corporation Internal to internal coaxial via transition structures in package substrates
WO2018182652A1 (en) * 2017-03-30 2018-10-04 Intel Corporation Semiconductor package having a coaxial first layer interconnect
KR102740257B1 (ko) * 2019-12-17 2024-12-10 삼성전자주식회사 반도체 패키지
KR102903835B1 (ko) * 2020-08-25 2025-12-31 삼성전자주식회사 반도체 패키지
US11984421B2 (en) * 2020-11-03 2024-05-14 Samsung Electronics Co., Ltd. Integrated circuit chip having BS-PDN structure
KR20220124583A (ko) * 2021-03-03 2022-09-14 삼성전자주식회사 인터포저를 포함하는 전자 장치
US20230036650A1 (en) * 2021-07-27 2023-02-02 Qualcomm Incorporated Sense lines for high-speed application packages
CN115023038A (zh) * 2022-04-29 2022-09-06 清华大学 微系统集成电路的叠装结构和叠装方法
US20240047319A1 (en) * 2022-08-04 2024-02-08 Samsung Electronics Co., Ltd. Semiconductor package and method of fabricating the same
US12520417B2 (en) * 2022-12-12 2026-01-06 Rolls-Royce North American Technologies Inc. Circuit board assembly having a security shield and method of the same
US20250273612A1 (en) * 2024-02-28 2025-08-28 Qualcomm Incorporated Package comprising a substrate including an inter substrate interconnect structure comprising an inner interconnect

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7045893B1 (en) * 2004-07-15 2006-05-16 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
US20070126091A1 (en) * 2005-12-07 2007-06-07 Wood Alan G Semiconductor components having through wire interconnects (TWI)
US20080158842A1 (en) * 2006-12-29 2008-07-03 Texas Instruments Incorporated Stress and collapse resistant interconnect for mounting an integrated circuit package to a substrate
US20110147901A1 (en) * 2009-12-17 2011-06-23 Rui Huang Integrated circuit packaging system with package stacking and method of manufacture thereof
US20130026649A1 (en) * 2011-07-28 2013-01-31 Fujitsu Semiconductor Limited Semiconductor device and manufacturing method therefor
US20130105987A1 (en) * 2011-11-02 2013-05-02 Avago Technologies Enterprise IP (Singapore) Pte. Ltd. Laminate interconnect having a coaxial via structure

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6623279B2 (en) 1999-07-15 2003-09-23 Incep Technologies, Inc. Separable power delivery connector
JP3601462B2 (ja) * 2001-03-05 2004-12-15 オムロン株式会社 電子部品のパッケージ構造
US6476476B1 (en) 2001-08-16 2002-11-05 Amkor Technology, Inc. Integrated circuit package including pin and barrel interconnects
DE102005002707B4 (de) 2005-01-19 2007-07-26 Infineon Technologies Ag Verfahren zur Herstellung elektrischer Verbindungen in einem Halbleiterbauteil mittels koaxialer Mikroverbindungselemente
KR100663265B1 (ko) 2005-05-10 2007-01-02 삼성전기주식회사 다층 기판 및 그 제조 방법
US7482272B2 (en) 2005-06-14 2009-01-27 John Trezza Through chip connection
US7608921B2 (en) * 2006-12-07 2009-10-27 Stats Chippac, Inc. Multi-layer semiconductor package
US7952196B1 (en) 2008-04-21 2011-05-31 Lockheed Martin Corporation Affordable high performance high frequency multichip module fabrication and apparatus
KR20100075204A (ko) * 2008-12-24 2010-07-02 삼성전자주식회사 스터드 범프를 이용한 적층형 반도체 패키지, 반도체 패키지 모듈, 및 그 제조방법
TWI366890B (en) * 2008-12-31 2012-06-21 Ind Tech Res Inst Method of manufacturing through-silicon-via and through-silicon-via structure
JP4833307B2 (ja) * 2009-02-24 2011-12-07 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体モジュール、端子板、端子板の製造方法および半導体モジュールの製造方法
EP2244291A1 (en) 2009-04-20 2010-10-27 Nxp B.V. Multilevel interconnection system
US8736065B2 (en) * 2010-12-22 2014-05-27 Intel Corporation Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same
JP2012256675A (ja) 2011-06-08 2012-12-27 Shinko Electric Ind Co Ltd 配線基板、半導体装置及びその製造方法
JP5775789B2 (ja) * 2011-10-18 2015-09-09 新光電気工業株式会社 積層型半導体パッケージ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7045893B1 (en) * 2004-07-15 2006-05-16 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
US20070126091A1 (en) * 2005-12-07 2007-06-07 Wood Alan G Semiconductor components having through wire interconnects (TWI)
US20080158842A1 (en) * 2006-12-29 2008-07-03 Texas Instruments Incorporated Stress and collapse resistant interconnect for mounting an integrated circuit package to a substrate
US20110147901A1 (en) * 2009-12-17 2011-06-23 Rui Huang Integrated circuit packaging system with package stacking and method of manufacture thereof
US20130026649A1 (en) * 2011-07-28 2013-01-31 Fujitsu Semiconductor Limited Semiconductor device and manufacturing method therefor
US20130105987A1 (en) * 2011-11-02 2013-05-02 Avago Technologies Enterprise IP (Singapore) Pte. Ltd. Laminate interconnect having a coaxial via structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110098164A (zh) * 2018-01-29 2019-08-06 马维尔国际贸易有限公司 用于半导体部件的同轴互连结构
CN110098164B (zh) * 2018-01-29 2025-02-07 马维尔亚洲私人有限公司 用于半导体部件的同轴互连结构

Also Published As

Publication number Publication date
JP6802146B2 (ja) 2020-12-16
KR20170028901A (ko) 2017-03-14
EP3167483A1 (en) 2017-05-17
US20160013125A1 (en) 2016-01-14
AU2015287804B2 (en) 2020-02-27
WO2016007706A1 (en) 2016-01-14
BR112017000154B1 (pt) 2022-05-17
CN115036287A (zh) 2022-09-09
KR102411667B1 (ko) 2022-06-20
BR112017000154A2 (pt) 2017-11-07
JP2017520929A (ja) 2017-07-27
AU2015287804A1 (en) 2017-01-05
US9385077B2 (en) 2016-07-05

Similar Documents

Publication Publication Date Title
US9385077B2 (en) Integrated device comprising coaxial interconnect
KR102541861B1 (ko) 리소-에칭가능 층에 브리지를 포함하는 통합 디바이스 패키지
US9153560B2 (en) Package on package (PoP) integrated device comprising a redistribution layer
CN107735860B (zh) 包括电容器、重分布层、和分立同轴连接的封装基板
KR101971195B1 (ko) 패키지 기판 내에 임베딩된 인덕터
CN110060974A (zh) 包括重分布层上的堆叠管芯的集成器件
US20160020193A1 (en) PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A CAPACITOR IN A SUBSTRATE
US9490226B2 (en) Integrated device comprising a heat-dissipation layer providing an electrical path for a ground signal
CN107690699A (zh) 具有焊接到管芯或基板的重分布层的高纵横比互连的集成电路封装及对应制造方法
US9355898B2 (en) Package on package (PoP) integrated device comprising a plurality of solder resist layers
US9807884B2 (en) Substrate comprising embedded elongated capacitor
CN107112310B (zh) 包括高性能封装间连接的层叠封装(pop)器件
US9799628B2 (en) Stacked package configurations and methods of making the same
US20160183379A1 (en) Substrate comprising an embedded capacitor
CN105453258A (zh) 基板上的集成无源器件(ipd)
KR101831680B1 (ko) 통합 디바이스 패키지, 와이어-투-다이 커넥터, 및 이들과 관련된 장치
CN108604585A (zh) 包括集成电路(ic)封装之间的柔性连接器的集成器件
HK1232666A1 (en) Integrated device comprising coaxial interconnect
HK1260183B (zh) 包括集成电路(ic)封装之间的柔性连接器的集成器件

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1232666

Country of ref document: HK

RJ01 Rejection of invention patent application after publication

Application publication date: 20170308

RJ01 Rejection of invention patent application after publication
REG Reference to a national code

Ref country code: HK

Ref legal event code: WD

Ref document number: 1232666

Country of ref document: HK