JP6802146B2 - 同軸配線を備える集積デバイス - Google Patents

同軸配線を備える集積デバイス Download PDF

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Publication number
JP6802146B2
JP6802146B2 JP2017500013A JP2017500013A JP6802146B2 JP 6802146 B2 JP6802146 B2 JP 6802146B2 JP 2017500013 A JP2017500013 A JP 2017500013A JP 2017500013 A JP2017500013 A JP 2017500013A JP 6802146 B2 JP6802146 B2 JP 6802146B2
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Japan
Prior art keywords
wiring
substrate
wire
integrated device
electrical
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JP2017500013A
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English (en)
Japanese (ja)
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JP2017520929A (ja
JP2017520929A5 (enExample
Inventor
ドン・ウク・キム
ヨン・キュ・ソン
キュ−ピュン・ファン
ホン・ボク・ウィ
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クアルコム，インコーポレイテッド
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H10W42/20—
    • H10W42/267—
    • H10W70/05—
    • H10W70/614—
    • H10W70/65—
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H10W70/093—
    • H10W70/60—
    • H10W70/685—
    • H10W90/401—
    • H10W90/701—
    • H10W90/724—
    • H10W90/752—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Geometry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
JP2017500013A 2014-07-11 2015-07-09 同軸配線を備える集積デバイス Active JP6802146B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/329,646 2014-07-11
US14/329,646 US9385077B2 (en) 2014-07-11 2014-07-11 Integrated device comprising coaxial interconnect
PCT/US2015/039678 WO2016007706A1 (en) 2014-07-11 2015-07-09 Integrated device comprising coaxial interconnect

Publications (3)

Publication Number Publication Date
JP2017520929A JP2017520929A (ja) 2017-07-27
JP2017520929A5 JP2017520929A5 (enExample) 2018-08-02
JP6802146B2 true JP6802146B2 (ja) 2020-12-16

Family

ID=53719982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017500013A Active JP6802146B2 (ja) 2014-07-11 2015-07-09 同軸配線を備える集積デバイス

Country Status (8)

Country Link
US (1) US9385077B2 (enExample)
EP (1) EP3167483A1 (enExample)
JP (1) JP6802146B2 (enExample)
KR (1) KR102411667B1 (enExample)
CN (2) CN115036287A (enExample)
AU (1) AU2015287804B2 (enExample)
BR (1) BR112017000154B1 (enExample)
WO (1) WO2016007706A1 (enExample)

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US10381303B2 (en) * 2016-07-01 2019-08-13 Vanguard International Semiconductor Corporation Semiconductor device structures
TWI594338B (zh) * 2016-08-09 2017-08-01 矽品精密工業股份有限公司 電子堆疊結構及其製法
US10070525B2 (en) 2016-12-28 2018-09-04 Intel Corporation Internal to internal coaxial via transition structures in package substrates
WO2018182652A1 (en) * 2017-03-30 2018-10-04 Intel Corporation Semiconductor package having a coaxial first layer interconnect
US10734334B2 (en) * 2018-01-29 2020-08-04 Marvell Asia Pte, Ltd. Coaxial-interconnect structure for a semiconductor component
KR102740257B1 (ko) * 2019-12-17 2024-12-10 삼성전자주식회사 반도체 패키지
KR102903835B1 (ko) * 2020-08-25 2025-12-31 삼성전자주식회사 반도체 패키지
KR20220059722A (ko) * 2020-11-03 2022-05-10 삼성전자주식회사 Bs-pdn 구조를 가진 집적회로 칩
KR20220124583A (ko) * 2021-03-03 2022-09-14 삼성전자주식회사 인터포저를 포함하는 전자 장치
US20230036650A1 (en) * 2021-07-27 2023-02-02 Qualcomm Incorporated Sense lines for high-speed application packages
CN115023038A (zh) * 2022-04-29 2022-09-06 清华大学 微系统集成电路的叠装结构和叠装方法
US20240047319A1 (en) * 2022-08-04 2024-02-08 Samsung Electronics Co., Ltd. Semiconductor package and method of fabricating the same
US12520417B2 (en) * 2022-12-12 2026-01-06 Rolls-Royce North American Technologies Inc. Circuit board assembly having a security shield and method of the same
US20250273612A1 (en) * 2024-02-28 2025-08-28 Qualcomm Incorporated Package comprising a substrate including an inter substrate interconnect structure comprising an inner interconnect

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US6623279B2 (en) 1999-07-15 2003-09-23 Incep Technologies, Inc. Separable power delivery connector
JP3601462B2 (ja) * 2001-03-05 2004-12-15 オムロン株式会社 電子部品のパッケージ構造
US6476476B1 (en) 2001-08-16 2002-11-05 Amkor Technology, Inc. Integrated circuit package including pin and barrel interconnects
US7045893B1 (en) * 2004-07-15 2006-05-16 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
DE102005002707B4 (de) 2005-01-19 2007-07-26 Infineon Technologies Ag Verfahren zur Herstellung elektrischer Verbindungen in einem Halbleiterbauteil mittels koaxialer Mikroverbindungselemente
KR100663265B1 (ko) 2005-05-10 2007-01-02 삼성전기주식회사 다층 기판 및 그 제조 방법
US7884483B2 (en) 2005-06-14 2011-02-08 Cufer Asset Ltd. L.L.C. Chip connector
US7307348B2 (en) * 2005-12-07 2007-12-11 Micron Technology, Inc. Semiconductor components having through wire interconnects (TWI)
US7608921B2 (en) * 2006-12-07 2009-10-27 Stats Chippac, Inc. Multi-layer semiconductor package
US20080158842A1 (en) * 2006-12-29 2008-07-03 Texas Instruments Incorporated Stress and collapse resistant interconnect for mounting an integrated circuit package to a substrate
US7952196B1 (en) 2008-04-21 2011-05-31 Lockheed Martin Corporation Affordable high performance high frequency multichip module fabrication and apparatus
KR20100075204A (ko) * 2008-12-24 2010-07-02 삼성전자주식회사 스터드 범프를 이용한 적층형 반도체 패키지, 반도체 패키지 모듈, 및 그 제조방법
TWI366890B (en) * 2008-12-31 2012-06-21 Ind Tech Res Inst Method of manufacturing through-silicon-via and through-silicon-via structure
JP4833307B2 (ja) * 2009-02-24 2011-12-07 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体モジュール、端子板、端子板の製造方法および半導体モジュールの製造方法
EP2244291A1 (en) 2009-04-20 2010-10-27 Nxp B.V. Multilevel interconnection system
US8288844B2 (en) * 2009-12-17 2012-10-16 Stats Chippac Ltd. Integrated circuit packaging system with package stacking and method of manufacture thereof
US8736065B2 (en) * 2010-12-22 2014-05-27 Intel Corporation Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same
JP2012256675A (ja) 2011-06-08 2012-12-27 Shinko Electric Ind Co Ltd 配線基板、半導体装置及びその製造方法
JP5682496B2 (ja) * 2011-07-28 2015-03-11 富士通セミコンダクター株式会社 半導体装置、マルチチップ半導体装置、デバイス、及び半導体装置の製造方法
JP5775789B2 (ja) * 2011-10-18 2015-09-09 新光電気工業株式会社 積層型半導体パッケージ
US9041208B2 (en) * 2011-11-02 2015-05-26 Avago Technologies General Ip (Singapore) Pte. Ltd. Laminate interconnect having a coaxial via structure

Also Published As

Publication number Publication date
CN106489191A (zh) 2017-03-08
KR102411667B1 (ko) 2022-06-20
EP3167483A1 (en) 2017-05-17
CN115036287A (zh) 2022-09-09
BR112017000154B1 (pt) 2022-05-17
AU2015287804B2 (en) 2020-02-27
US20160013125A1 (en) 2016-01-14
JP2017520929A (ja) 2017-07-27
US9385077B2 (en) 2016-07-05
AU2015287804A1 (en) 2017-01-05
KR20170028901A (ko) 2017-03-14
BR112017000154A2 (pt) 2017-11-07
WO2016007706A1 (en) 2016-01-14

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